Ultrasonic Semiconductor Wafer Coating
Description:
Wafer coating is a unique process that facilitates the automatic
application of chip bonding adhesives at the wafer level, followed
by the formation of chip bonding films in the next stage.
FUNSONIC's ultrasonic semiconductor wafer coating technology is
suitable for wafer coating, which can achieve process speed,
thickness control, and material uniformity. After the hot or UVB
stage and wafer cutting, chip connections are achieved through
heating and pressure to produce consistent adhesive lines and
small, controlled corners.
Ultrasonic semiconductor wafer coating technology needs to consider
spraying parameters during use, such as ultrasonic frequency,
spraying speed, and coating thickness, which need to be optimized
according to specific materials and requirements; At the same time,
material properties can also have a certain impact on the spraying
effect, such as the viscosity, surface tension, and volatility of
the coating, which need to be considered when selecting materials.
Parameters:
| Product Type | Intelligent Ultrasonic Precision Coating Machine desktop Type FS620 |
| Spray Nozzle Operating Frequency | 20-200Khz |
| Nozzle Power | 1-15W |
| Continuous Spraying Volume Max | 0.5-10ml/min |
| Effective Spraying Width | 2-20mm |
| Spray Uniformity | ≥95% |
| Solution Conversion Rate | ≥95% |
| Dry Film Thickness | 20nm-100μm |
| Solution Viscosity | ≤30cps |
| Temperature Range | 1-60℃ |
| Atomized Particles (Median Value) | 15-40μm (distilled water), determined by the frequency of the
nozzle |
| Diversion Pressure Max | ≤0.05MPA |
| Input Voltage | 220V±10%/50-60Hz |
| Exercise Mode | XYZ three-axis, independently programmable |
| Control Mode | FUNSONIC spraying control system, PLC control, 13.3-inch full-color
touch screen |
| Control Content | Ultrasonic spraying, liquid supply, heating, ultrasonic dispersion
and other systems |
| Liquid Supply Method | Precision injection pump |
| Ultrasonic Dispersion System (Optional) | 20ml or 50ml, 40K, biological grade sampler |
| Rated Power of Ultrasonic Dispersion System | 100W |
Application :
1. Coating of photosensitive layer:
In photolithography, ultrasonic technology is used to uniformly
coat photosensitive materials, ensuring high-resolution pattern
transfer.
2. Protective coating:
Apply anti-corrosion and scratch resistant protective coatings to
enhance the durability of the wafer.
3. Functional coating:
In certain applications, functional materials with specific
electrical or optical properties can be coated.
Ultrasonic Semiconductor Wafer Coating
