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Product Listing: Product Name: Programmable IC Chip EP2C35F484I8N Parameters: - Package: 484-FBGA - Number of Logic Elements: 2,378 - Number of Flip Flops: 4,856 - Maximum Operating Frequency: 300 MHz - Number ...
Product Listing: XC7S15-2CSGA225C Programmable IC Chip Parameters: - Family: Xilinx Spartan-7 - Package: CSGA225C - Speed Grade: -2 - Number of Logic Cells: 15,360 - Number of Flip Flops: 51,200 - Number of DSP...
XC7A200T-2FBG676C Programmable IC Chip Product Features: - Family Name: XC7A - Device Type: FPGA - Number of Logic Cells: 200000 - Number of Flip Flops: 400000 - Number of I/O: 676 - Maximum Clock Frequency: 66...
...IC Chip: - Package: FGG484C - Technology: 6SLX45T - Speed Grade: -2 - Voltage: 1.2V - Max Frequency: 325 MHz - I/O Buffer: 576 - Max User I/O: 576 - Power Consumption: 2.5 W - Total Gb/s Bandwidth: 3.2 - Max...
XC7S75-2FGGA676I Programmable IC Chip Product Parameters: -Device Family: Spartan-7 -Device Core: 7-Series -Package Size: 676-FCBGA -Number of Logic Cells: 75K -Number of Flip-Flops: 300K -Number of LUTs: 375K ...
XC6SLX16-3CSG324I Programmable IC Chip Product Parameters: Package: CSG324 Logic Cells: 16K Flip-Flops: 16K Number of I/O Pins: 324 Voltage Rating: 3.3V Maximum Frequency: 400MHz Package Height: 6...
Product Listing: Product: XC7A15T-1FGG484I Programmable IC Chip Parameters: - Type: FPGA - Series: XC7A - Number of Logic Cells: 15K - Number of Flip-Flops: 106K - Number of I/O: 384 - Operating Temperature Ran...
Product Name: XC7S6-2FTGB196I Programmable IC Chip Parameters: • Number of Logic Cells: 6,200 • Number of Flip-Flops: 19,600 • Number of LUTs: 12,800 • Number of Bonds: 2,000 • Number of I/O: 160 • Core Voltage...
...: CLG400I - Number of I/O Pins: 144 pins - Number of Logic Elements: 20K - Number of Flip-Flops: 40K - Maximum Current Rating: 10.5A - Programmable Interconnects: 80 - Number of Multipliers: 2 - Memory Bits:...
...4TQG144C Programmable IC Chip for High Performance Computing XC3S100E-4TQG144C Specifications: • Family: Spartan-3E • Speed Grade: -4 • Package Type: TQG144C • Number of Gates: 7.2 million • Number of I/O: 1...
Product Listing: Product Name: DS90UB954TRGZRQ1 Product Description: This is a high performance FPGA device that can be used for a variety of applications. It features a wide range of configurable logic blocks ...
...Chip FH40-24S-0.5SV 24 Position Flat Flexible Connectors Product Description Of FH40-24S-0.5SV FH40-24S-0.5SV is a 24 Position FPC Connector Contacts, Vertical - 1 Sided 0.020" (0.50mm) Surface Mount. Specif...
...Chip TF31-20S-0.5SH Flat Flexible Connectors 20Position 50V Product Description Of TF31-20S-0.5SH TF31-20S-0.5SH is 20 Position FFC, FPC Connector Contacts, Bottom 0.020" (0.50mm) Surface Mount, Right Angle...
900-FCBGA XC7K325T-2FBG900I FPGA Integrated Circuit 640MHz Kintex-7 FPGA Chips Product Description Of XC7K325T-2FBG900I XC7K325T-2FBG900I Low-cost, wire-bond, bare-die flip-chip, and high signal integrity flip...
...active LOW output from the most significant flip-flop (O5-9), active HIGH and active LOW clock inputs (CP0, CP1) and an overriding asynchronous master reset input (......
SN54LS74AJ Logic IC Chip for industrial or military use, Obsolete and hard to find part DUAL D-TYPE POSITIVE-EDGE-TRIGGERED FLIP-FLOPS WITH PRESET AND CLEAR List Of Other Electronic Components In Stock PART NUM...
RGBW Multi Chip Led 300Watt Small LES , Washlight Cree Chips LED Module Products’ Features: 1, Small LES, 5W/mm² ; 2, Eutectic Flip-chip bonding, Thermoelectric solution, fast heat-conductivity 3, Special Paral...
...chip 1.Chip:213 2.Inlay Size: Dia 21mm 3.Environmental: ROHS compliant 4.Data storage: ≥10 years 5.Memory:144/504/888bytes 6.Reading Distance: 1.5~3cm (depends on reader applied) 7.Customization: Company log...
... Bonding Flip chip Unwinding chip side up Thickness 0.07mm Reading Distance 1.5~3cm (depends on reader applied) Operation Temp. -20°C~+65°C Storage Temp. -25°C~+......
...dry inlay / wet inlay PET material with SLI chip Frequency HF 13.56MHz Label Size 25*37mm Wet Inlay Size 25*37mm Chip SLI Antenna Aluminium etching antenna Bonding Flip chip Unwinding chip side up Thickness ...