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... Vertical / Flip-chip LEDs Eutectic bonding to make sure the fast conductivity of heat, it's aim to the lumen maintenance; Small Light Emiting surface(LES) to enhance the light density; Using copper MCPCB to...
...Vertical / Flip-chip LEDs Eutectic bonding to make sure the fast conductivity of heat, it's aim to the lumen maintenance; Small Light Emiting surface(LES) to enhance the light density; Using copper MCPCB to ...
...Vertical / Flip-chip LEDs Eutectic bonding to make sure the fast conductivity of heat, it's aim to the lumen maintenance; Small Light Emiting surface(LES) to enhance the light density; Using copper MCPCB to ...
...Brightness Vertical / Flip-chip LEDs Eutectic bonding to make sure the fast conductivity of heat, it's aim to the lumen maintenance; Small Light Emiting surface(LES) to enhance the light density; Using coppe...
...Lenses, anti polarized light and anti color cast; Adopting Eutectic bonding packaging technique with flip-chips, conductivity reach 120-160 W/m-k to enable a longer lifespan; Variable CCT-tunning from 2700K-...
...Lenses, anti polarized light and anti color cast; Adopting Eutectic bonding packaging technique with flip-chips, conductivity reach 120-160 W/m-k to enable a longer lifespan; Variable CCT-tunning from 2700K-...
...anti polarized light and anti color cast; Adopting Eutectic bonding packaging technique with flip-chips, conductivity reach 120-160 W/m-k to enable a longer lifespan; Variable CCT-tunning from 2700K-7000K, d...
... or Lenses, anti polarized light and anti color cast; Adopting Eutectic bonding packaging technique with flip-chips, conductivity reach 120-160 W/m-k to enable a longer lifespan; Variable CCT-tunning from 27...
...ough optics reflectors or Lenses, anti polarized light and anti color cast; Adopting Eutectic bonding packaging technique with flip-chips, conductivity reach 120-160 W/m-k to enable a longer lifespan; Variab...
...: Cross-distribution of LED chips in a circular LES to perform a better color-mixing through optics reflectors or Lenses, anti polarized light and anti color cast; Adopting Eutectic bonding packaging techniq...
...the PCB material. No need to weld gold wire with this Flip Chip technology, only Copper foil and circuit attach on PCB, chip solding on the circuit. Good thermal cooling performance make sure more reliable f...
... aluminum alloy housing from 30W to 200W. 2. Substantial friction resistant powder spraying process surface treatment. 3. Adopt multi-chips package 5050 LEDs. Stable performance,flip chip technology, single ...
...chipping and burr, one person can easily cut large boards, double saw blades can be lifted up and down independently, independent control switch, electric board table top 4mm, equipped with aluminum alloy fl...
... design uses flip-chip LEDs to eliminate visible LED dots (hot spots). The all-new chip-on-board technology not only improves light quality but also improves the thermal management and flexibility of the str...
...the PCB material. No need to weld gold wire with this Flip Chip technology, only Copper foil and circuit attach on PCB, chip solding on the circuit. Good thermal cooling performance make sure more reliable f...
... aluminum alloy housing from 30W to 200W. 2. Substantial friction resistant powder spraying process surface treatment. 3. Adopt multi-chips package 5050 LEDs. Stable performance,flip chip technology, single ...
ARM® Cortex®-M3 System On Chip (SOC) IC SmartFusion® ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops 80MHz 256-FPBGA (17x17)...
ARM® Cortex®-M3 System On Chip (SOC) IC SmartFusion® ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops 80MHz 484-FPBGA (23x23)...
ARM® Cortex®-M3 System On Chip (SOC) IC SmartFusion® ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops 80MHz 256-FPBGA (17x17)...
ARM® Cortex®-M3 System On Chip (SOC) IC SmartFusion® ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops 80MHz 256-FPBGA (17x17)...