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... X-ray Tester for precise inspection and quality control. Applications BGA, CSP, LED, Flip Chip, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Aerospace Components, Photo...
... 2, The latest Eutectic Flip-chip bonding with Cree Chips, Thermoelectric solution, fast heat-conductivity between LEDs and MCPCB substrate 3, Unique Parallel and Serial connection of LED design, Lower ......
BGA PCB Printed Circuit Board Assemblies Custom Circuit Board Design Capabilities Include: - SMT - PTH Auto Insertion - BGA - Flip Chip Bonding (Chip on Board) - Manual Insertion - Wire Bonding - Complete Produ...
...Flip-chip LEDs, Quality assured LED Components for Entertainment Lighting products; Eutectic bonding to make sure the fast conductivity of heat, it's aim to the lumen maintenance; Small Light Emiting surface...
... to the lumen maintenance; Small Light Emiting surface(LES) to enhance the light density; Using copper MCPCB to carry the LED chips, the LEDs can be installed directly to...
300watt 42V LED Light Engine White 6000K - 8000K CREE Flip-chip LED Features: 1. Excellent Transiting Heat from LED Chip Operating under 7.5A 2. High Luminous Output 3. No UV 4. Light emitting area is small, po...
...Flip-chip LEDs, Quality assured LED Components for Entertainment Lighting products; Eutectic bonding to make sure the fast conductivity of heat, it's aim to the lumen maintenance; Small Light Emiting surface...
... Vertical / Flip-chip LEDs Eutectic bonding to make sure the fast conductivity of heat, it's aim to the lumen maintenance; Small Light Emiting surface(LES) to enhance the light density; Using copper MCPCB to...
... Vertical / Flip-chip LEDs Eutectic bonding to make sure the fast conductivity of heat, it's aim to the lumen maintenance; Small Light Emiting surface(LES) to enhance the light density; Using copper MCPCB to...
...Vertical / Flip-chip LEDs Eutectic bonding to make sure the fast conductivity of heat, it's aim to the lumen maintenance; Small Light Emiting surface(LES) to enhance the light density; Using copper MCPCB to ...
...spot lighting,far distance projection illumination 2, The latest Eutectic Flip-chip bonding with Cree Chips, Thermoelectric solution, fast heat-conductivity between LEDs and MCPCB substrate 3, Unique Paralle...
...Flip-chip LEDs, Quality assured LED Components for Entertainment Lighting products; Eutectic bonding to make sure the fast conductivity of heat, it's aim to the lumen maintenance; Small Light Emiting surface...
... / Flip-chip LEDs Eutectic bonding to make sure the fast conductivity of heat, it's aim to the lumen maintenance; Small Light Emiting surface(LES) to enhance the light density; Using copper MCPCB to carry th...
BGA PCB Printed Circuit Board Assemblies Custom Circuit Board Design Capabilities Include: - SMT - PTH Auto Insertion - BGA - Flip Chip Bonding (Chip on Board) - Manual Insertion - Wire Bonding - Complete Produ...
...spot lighting,far distance projection illumination 2, The latest Eutectic Flip-chip bonding with Cree Chips, Thermoelectric solution, fast heat-conductivity between LEDs and MCPCB substrate 3, Unique Paralle...
... 2, The latest Eutectic Flip-chip bonding with Cree Chips, Thermoelectric solution, fast heat-conductivity between LEDs and MCPCB substrate 3, Unique Parallel and Serial connection of LED design, Lower ......
...: Cross-distribution of LED chips in a circular LES to perform a better color-mixing through optics reflectors or Lenses, anti polarized light and anti color cast; Adopting Eutectic bonding packaging techniq...
...Lenses, anti polarized light and anti color cast; Adopting Eutectic bonding packaging technique with flip-chips, conductivity reach 120-160 W/m-k to enable a longer lifespan; Variable CCT-tunning from 2700K-...
...Lenses, anti polarized light and anti color cast; Adopting Eutectic bonding packaging technique with flip-chips, conductivity reach 120-160 W/m-k to enable a longer lifespan; Variable CCT-tunning from 2700K-...
...Cross-distribution of LED chips in a circular LES to perform a better color-mixing through optics reflectors or Lenses, anti polarized light and anti color cast; Adopting Eutectic bonding packaging technique...