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ADI AD9361BBCZ-REEL Electronic Components IC Chips Integrated Circuits PRODUCT DESCRIPTION Part number # AD9361BBCZ-REEL is manufactured by ADI Technologies and distributed by Jalixin. As one of the leading dis...
Introduction of XCR3256XL-12PQ208C Features Low power 3.3V 256 macrocell CPLD 7.0 ns pin-to-pin logic delays System frequencies up to 154 MHz 256 macrocells with 6,000 usable gates Available in small ...
Introduction of XC95288XL-10PQG208C Features 6 ns pin-to-pin logic delays System frequency up to 208 MHz 288 macrocells with 6,400 usable gates Available in small footprint packages - 144-pin TQFP (117 ...
ORIGINAL POWER MANAGEMENT ICS GRAPHIC CHIPSET AMD 218-0755042 D/c: Newest Condition: New And Original Price: Please Contact Us Shipping Way: DHL Shipping Ways: DHL FEDEX UPS EMS TNT High Light: AMD Power Manage...
RF Mixer SA605D SA605 NE605 SOP20 SA605DK SA605 TSSOP-20 IC Original in stock Model Package Date STM32F407ZET6 LQFP144 2020+/2019+ ADM2587EBRWZ-REEL7 SOP-20 2020+ LAN8720A-CP-TR QFN24 2020+ STM32F401RCT6 LQFP64...
NB7L1008MMNG NB7L1008 NB7L 1008M QFN New parts Electronic component New parts Electronic component Model Package Date STM32F407ZET6 LQFP144 2020+/2019+ ADM2587EBRWZ-REEL7 SOP-20 2020+ LAN8720A-CP-TR QFN24 2020+...
Stock Offer (Hot Sell) Part no. Quantity Brand D/C Package ADXRS300ABG 2045 AD 14+ GBA AZ78L09RTR 5000 BCD 14+ SOT89 BAV99WT1G 5000 ON 14+ SOT-323 BC857C 5000 16+ SOT-23 FR105 5000 MIC 16+ DO-41 KTC3875S-Y-RTK/...
Stock Offer (Hot Sell) Part no. Quantity Brand D/C Package DS1644-120 2562 DALLAS 15+ DIP FZ800R12KL4C 2594 EUPEC 16+ Modules ILQ74 2626 SIMENS 16+ DIP16 M48T08-100PC 2658 ST 14+ DIP MACH210AQ-15JC-18JI 2690 AM...
Stock Offer (Hot Sell) Part no. Quantity Brand D/C Package M2716-1F1 4192 ST 16+ DIP MPQ2222A 5931 MOTOROLA 16+ DIP N270 SLB73 440 INTEL 13+ BGA MSP430F149IPMR 6673 TI 14+ QFP BQ34Z100PWR 1310 TI 12+ QFN LM3875...
STOCK LIST UPA1716 3200 NEC 16+ SOP-8 1N6303A 3201 VISHAY 16+ DO-201 ADC0801LCN 3201 NS 14+ DIP-20 ST3485EBDR 3202 ST 16+ SOP8 L6219 3205 ST 16+ DIP24/SOP24 TPS3828-50DBVR 3210 TI 15+ SOT23-5 LF156H 3211 NS 16+...
... Steel and Rubber. It's suitable for Component Placement, like cathode capacitance, diode, SOT, QFN, BGA and so on. Specifications Brand JUKI Parts number E36027290A0 Model number M3180301021 Nozzle type 503...
... Steel and Rubber. It's suitable for Component Placement, like cathode capacitance, diode, SOT, QFN, BGA and so on. Specifications Brand JUKI Parts number E36027290A0 Model number M3180301021 Nozzle type 503...
... Steel and Rubber. It's suitable for Component Placement, like cathode capacitance, diode, SOT, QFN, BGA and so on. Specifications Brand JUKI Parts number E36027290A0 Model number M3180301021 Nozzle type 503...
... Steel and Rubber. It's suitable for Component Placement, like cathode capacitance, diode, SOT, QFN, BGA and so on. Specifications Brand JUKI Parts number E36027290A0 Model number M3180301021 Nozzle type 503...
... Steel and Rubber. It's suitable for Component Placement, like cathode capacitance, diode, SOT, QFN, BGA and so on. Specifications Brand JUKI Parts number E36027290A0 Model number M3180301021 Nozzle type 503...
...Chip Shooter Silver and Green Color 503 E36027290A0 Introduction This 503 nozzle type is compatible with the JUKI2000 Series chip mounter. Constructed from a combination of ceramic, tungsten steel, and rubbe...
... Thick For BGA IC Devices Secure, stackable, and fully traceable, our JEDEC trays streamline logistics in fast-paced manufacturing environments. JEDEC trays is a standard-defined tray for transporting, handl...
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