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1 tem Description Mode QTY Accuracy(mm) 1 Sink EDM M3OF(TAIWAN) 1 0.005~0.01 2 Sink EDM (Mitsubish) EA8M/EA8A 2 0.005 3 Sink EDM FORM S350 3 0.005 4 Sink EDM(CHARMILLES-Switzerland) PROBOFORM 35P 1 0.005 5 Sink...
Anti-Static JEDEC Tray Stackable Secure Handling For BGA PGA QFP Looking for chip trays that actually fit your product? We customize every JEDEC tray cavity to match your device perfectly. Developed to cater to...
...Dual-Core DSP 3648MBPS 32KB L1 Cache 256KB RAM BGA-256 -40anddeg;C to +100anddeg;C Industrial DSP andnbsp; Features andnbsp; andbull; Software Support andndash; TI DSP/BIOSandtrade; andndash; Chip Support Li...
High Resolution X-Ray machine AX8200MAX for Semicon Chip inner defects inspection Application Fields Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal...
... is a kind of high-temperature resistant IC tray made of PES and the injection molding process. The JEDEC tray is a carrier used by semiconductor chip companies for packaging and baking tests of their chips....
... range; Brand new flight vision camera: Improve recognition performance, size up to 40*40 mm, apply to BGA or CSP etc; Vacuum sensing device: Each placement head with independent detection function, which im...
... range; Brand new flight vision camera improve recognition performance, size up to 40*40mm, apply to BGA or CSP etc; Vacuum sensing device: Each placement head with independent detection function, which impr...
...chip high precision easy operate SMT pick and place machine Machine main features Adopt High speed multi modular head, apply to ultra small chip 0201~40*40 mm large chip, wide component range; Brand new flig...
...chip 1700 kg SMT CE CCC SIRA pick and place machine Machine main features Adopt High speed multi modular head, apply to ultra small chip 0201~40*40 mm large chip, wide component range; Brand new flight visio...
...Chip BCM54991ELB0KFEBG Integrated Circuit Chip BGA81 Ethernet CMOS Transceiver Product Description Of BCM54991ELB0KFEBG BCM54991ELB0KFEBG is a highly integrated solution combining digital adaptive equalizer...
... new flight vision camera improve recognition performance, size up to 40*40mm, apply to BGA or CSP etc; Vacuum sensing device: Each placement head with independent detection function, which improves the stab...
...chip automatic optimization SMT placement head Machine main features Adopt High speed multi modular head, apply to ultra small chip 0201~40*40mm large chip, wider component range; Brand new flight vision cam...
... range; Brand new flight vision camera improve recognition performance, size up to 40*40mm, apply to BGA or CSP etc; Vacuum sensing device: Each placement head with independent detection function, which impr...
64GB EMMC 5.1 Nand Flash Memory Chips Integrated Circuits High density BGA packaged single-chip storage products integrate flash controllers, FLASH chips, and other components into one, with a storage capacity ...
Original PG Brand eMMC5.1 64GB 128GB 256GB Memory Chips Integrated Circuits High density BGA packaged single-chip storage products integrate flash controllers, FLASH chips, and other components into one, with a...
... speed multi modular head, apply to ultra small chip 0201~40*40mm large chip, wider component range; Brand new flight vision camera improve recognition performance, size up to 40*40mm, apply to BGA or CSP et...
XC6SLX9-2FTG256C XC6SLX9-FTG256 XC6SLX9 BGA original XC6SLX9-2FTG256C XC6SLX9-2FT256C BGA256 IC Datasheet Product Spartan-6 Series XC6SLX9 Number of Logic Elements 9152 LE Adaptive Logic Modules - ALMs 1430 ALM...
Inline Dual-Track Visual Dispensing Machine for Chip Underfill The FS600 Series Inline Visual Dispensing Machine is an advanced high-efficiency dispensing solution engineered for chip underfill and electronic c...
HI3520DRQCV300 HISILICON Security surveillance camera IC video processor decoding chip 1. HISILICON HI3520DRQCV300 HiSilicon chip Type: Other ICs Purpose: Video codec Brand: HiSilicon Model: HI3520DRQCV300 Pack...
...BGA package is one of the semiconductor package types on memory electronics manufacture,It required the substrate ball high quality guarantee,It is also one of types of the semiconductor package substrate,fo...