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...Copper Cables Product Advantages Ø Hybrid cable conforms to the Small Form Factor SFF-8436 and SFF-8431 Ø Support for multi-gigabit data rates :1 Gb/s - 10 Gb/s (per channel) Ø Maximum aggregate data rate: 4...
... ensures safe and energy-efficient operation—compatible with standard 12V LED drivers and transformers. Copper PCB Design: Enhanced conductivity and heat dissipation compared to traditional FR4 boards—improv...
...Density Multilayer Printed Circuit Boards FR4 Printed Circuit Board Introduction Beijing Haina Lean Technology Co., Ltd. is a manufacturing enterprise specializing in high-density multilayer printed boards, ...
15.8-18.5g/cm3 WNiFe Tungsten Nickel Iron High Density Tungsten Alloy Rod Specification Product Name WNiFe WNiCuTungsten Alloy Rod Material Tungsten Nickel Iron Alloy Tungsten Nickel Copper Alloy Density 15.8-1...
... is 4 Layers, and it was made with FR - 4 board material, with 2 Oz / 70µm copper thickness. Also, the board size of this PCB Circuit Board is customized, with blue solder mask and HASL Lead Free surface tre...
... Density Description SPACECOM SFP28 Passive cable assemblies are high performance, cost effective I/O solutions for 25Gb Ethernet and 25G Fiber Channel applications. SFP28 copper modules allow hardware manuf...
Ethernet Shielded CAT6 UTP Cable Indoor High Density Polyethylene Specifications: Conductor: bare copper wire 0.58 0.01 mm, 23 AWG, Insulation: High density polyethylene, minimum thickness of 0.18 mm Co...
15.8-18.5g/cm3 WNiFe Tungsten Nickel Iron High Density Tungsten Alloy Rod Specification Product Name WNiFe WNiCuTungsten Alloy Rod Material Tungsten Nickel Iron Alloy Tungsten Nickel Copper Alloy Density 15.8-1...
...Density Multilayer Printed Circuit Boards FR4 Printed Circuit Board Introduction Beijing Haina Lean Technology Co., Ltd. is a manufacturing enterprise specializing in high-density multilayer printed boards, ...
... boards. HDI boards are more compact and have smaller vias, pads, copper traces and spaces. As a result, HDIs have denser wiring resulting in lighter weight, more compact, lower layer count PCBs. HDI ......
... Density Description SPACECOM SFP28 Passive cable assemblies are high performance, cost effective I/O solutions for 25Gb Ethernet and 25G Fiber Channel applications. SFP28 copper modules allow hardware manuf...
...steel, copper, brass and more 3.Size: According to customer demands 4.Surface treatment: steam treatment, heat treatment 5.Performace: Pricision metal stamping, other ......
... line width high Tg High Density Interconnect HDI PCB: 12 layers FR-4 Tg 150 ENIG surface 1.6mm board thickness BGA with soldmask defined With inpedance control With Blind & buried via Copper Thickness: L1--...
... mobility. The color is silver, the melting point of 648.8 ℃, the boiling point of 1107 ℃, light weight, density of 1.74 g / cm3, about copper 1/4, aluminum 2/3; its chemical activity, and oxygen affinity, C...
...alloy ball 1. Density: 17.8-18.5g / cm3 2. Composition: tungsten content: 85-99%, tungsten-nickel-iron, tungsten-nickel-copper 3. Surface: sintered, polished surface, polished surface Features and applicatio...
... aluminum, scrap copper, scrap stainless steel, scrap car, etc.) into qualified charges of cuboid, octagonal, cylinder and other shapes, which can not only reduce the transportation and smelting costs, but a...
SM-X-6X1G Overview ® Gigabit Ethernet WAN Module SM-X-6X1G brings high-density Small Form-Factor Pluggable (SFP) and copper (RJ-45) 1 Gigabit and 10 Gigabit Ethernet (GE) connectivity to the 4000 Series Integra...