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... issue. TIG™780-10 is presenting thermal paste products. They serve to moisten the contact surface sufficiently so as to form an interface of extremely low thermal impedance.Consequently, the heat dissipatio...
CPU Thermal Pad 1.5mm Thick Thermal Gap Pad For Heat Transfer In Electronic Components Company Profile Ziitek Technology CO.,Ltd is a professional manufacturer of thermal interface materials with 20 years of in...
...TIG™780-18 is presenting thermal paste products. They serve to moisten the contact surface sufficiently so as to form an interface of extremely low thermal impedance.Consequently, the heat dissipation effici...
...TIG™780-25 is presenting thermal paste products. They serve to moisten the contact surface sufficiently so as to form an interface of extremely low thermal impedance.Consequently, the heat dissipation effici...
...780-52 is a heat conducting product in the shape of paste.They serve to moisten the contact surface sufficiently so as to form an interface of extremely low thermal impedance .Consequently, the heat dissipat...
... and reliability issues. TIG™780-50 is a heat conducting product in the shape of paste. They serve to moisten the contact surface sufficiently so as to form an interface of extremely low thermal impedance.Co...
.... TIG™780-56 is a heat conducting product in the shape of paste.They serve to moisten the contact surface sufficiently so as to form an interface of extremely low thermal impedance .Consequently, the heat di...
...Thermal Grease Graphics Desktop Cpu Notebook Cooling Paste Attribute Value Test Method Composition Non-Vulcanized Silicone Oil and Thermally Conductive Filler Mixture - Color White Visual Density(g/cc) 2.8 A...
...Thermal Grease Graphics Desktop Cpu Notebook Cooling Paste Attribute Value Test Method Composition Non-Vulcanized Silicone Oil and Thermally Conductive Filler Mixture - Color White Visual Density(g/cc) 2.8 A...
0117 TDS-EN.pdf Product Description Silicone thermally conductive compound Gray paste Non-curing type Product Features Thermal conductivity: 4.0 W/ mK It contains metal powder to enhance thermal conductivity a...
0116 TDS-EN.pdf Product Description Silicone thermally conductive compound White paste Non-curing type Product Features Thermal conductivity: 3.2 W/ mK Solvent-free, metal powder-free for insulation requiremen...
Product Attributes Model No.: R11-50 place of origin: China Socket Type: Fclga 3647 Narrow Ilm Compatibility: Recommend For Intel Xeon Platinum / Gold Family Processor (Products Formerly Skylake ) , Socket Fc...
...: Recommend For Intel® Xeon® Platinum / Gold Family Processor ( Products Formerly Skylake ), Socket Fclga3647 Narrow Ilm Only. Thermal Interface Material: 7762(thermal Paste Area:68*45 Mm) Packing: Industria...
0112 TDS-EN.pdf 0112 is a one-component Silicone Thermal Conductive Grease suitable for gap filler and reducing the temperature of electronic components. Product Features: One-component, white; Physical form: p...
0113 TDS-EN.pdf 0113 is a one-component Silicone Thermal Conductive Grease suitable for gap filler and reducing the temperature of electronic components. Product Features: One-component, white; Physical form: p...
Product Features: Single component, white color. Physical form: paste Made of metallic oxide and polysiloxane Wide operating temperature range Nontoxic, non-corrosive Eco-friendly, odorless Does...
...) ≥7.0 ASTM D149 Dielectric Constant(@10mhz) 7.3 ASTM D150 Volume Resistivity(Ω.cm) 1.0*1013 ASTM D257 Flammability V-0 UL94 Thermal Thermal conductivity(W/m.K...
...) ≥7.0 ASTM D149 Dielectric Constant(@10mhz) 7.3 ASTM D150 Volume Resistivity(Ω.cm) 1.0*1013 ASTM D257 Flammability V-0 UL94 Thermal Thermal conductivity(W/m.K...