WCu Flanges / Heat Sinks W90Cu10 W80Cu20 W50Cu50 Substrates With
excellent TC
Description:
W-Cu heat sink material is a composite of tungsten and copper, with
both tungsten low expansion characteristics, but also has copper of
high thermal conductivityproperties, and the tungsten and copper in
the thermal expansion coefficient andthermal conductivity can be
adjusted with the W-Cu composition, also the compositecan be
machined to various shape, these features make the application of
thiscomposite with great convenience. The thermal expansion can be
adjusted to matchwith the following materials:
(1) Ceramic materials: Al203(A-90, A-95, A-99), BeO(B-95, B-99),
AIN, etc
(2) Semiconductor materials: Si, GaAs, SiGe, SiC, GaP, GaAs
(3)Metal Material: Kovar alloy (4J29), 42 alloy;
Advantages:
No Fe, Co, Ni, Mn and other elements addeled as the sintering
activator, to maintain a high thermal conductivity.
Excellent hermeticity
Can provide semi-finished or finished (Ni/Au plated)products
Precision machining and excellent dimensional control, surface
finish and flatness
With close technical supports including product design, custom
manufacturing testing and post sale supports
Product Properties:
| Type | Composition | Properties | | Tungsten Content | Density | CTE | Thermal Conductivity | | W90Cu | 90 ± 1 wt % | 17.0 g/cm3 | 6.5 ppm/K | 180 - 190 W/m.K | | W85Cu | 85 ± 1 wt % | 16.3 g/cm3 | 7.0 ppm/K | 190 - 200 W/m.K | | W80Cu | 80 ± 1 wt % | 15.6 g/cm3 | 8.3 ppm/K | 200 - 210 W/m.K | | W75Cu | 75 ± 1 wt % | 14.9 g/cm3 | 9.0 ppm/K | 220 - 230 W/m.K |
|
Application:
This composite are widely used in applications such as microwave
carriers, ceramic substrate carriers, laser diode mounts, optical
packages, power packages, butterfly packages and crystal carriers
for solid state lasers, etc.
Product picture:
