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Cu / Mo70Cu / Cu Heatspreader For Mobile Base Stations / CPC For 5G Mobile Base Stations

    Buy cheap Cu / Mo70Cu / Cu Heatspreader For Mobile Base Stations / CPC For 5G Mobile Base Stations from wholesalers
     
    Buy cheap Cu / Mo70Cu / Cu Heatspreader For Mobile Base Stations / CPC For 5G Mobile Base Stations from wholesalers
    • Buy cheap Cu / Mo70Cu / Cu Heatspreader For Mobile Base Stations / CPC For 5G Mobile Base Stations from wholesalers
    • Buy cheap Cu / Mo70Cu / Cu Heatspreader For Mobile Base Stations / CPC For 5G Mobile Base Stations from wholesalers
    • Buy cheap Cu / Mo70Cu / Cu Heatspreader For Mobile Base Stations / CPC For 5G Mobile Base Stations from wholesalers
    • Buy cheap Cu / Mo70Cu / Cu Heatspreader For Mobile Base Stations / CPC For 5G Mobile Base Stations from wholesalers

    Cu / Mo70Cu / Cu Heatspreader For Mobile Base Stations / CPC For 5G Mobile Base Stations

    Ask Lasest Price
    Brand Name : JBNR
    Model Number : CPC141,CPC232,CPC300
    Price : Negotiable
    Payment Terms : L/C, , T/T, Western Union
    Delivery Time : 15days
    • Product Details
    • Company Profile

    Cu / Mo70Cu / Cu Heatspreader For Mobile Base Stations / CPC For 5G Mobile Base Stations


    CPC (Cu/Mo70Cu/Cu) Heatspreader For Mobile Base Stations / CPC For 5G Mobile Base Stations


    Description:

    CPC is a composite material with a laminated structure with Cu layers above and below the Cu-Mo composite material. Thermal conductivity and linear expansion coefficient can be changed by combining the composition of the core material Cu-Mo and the lamination ratio. In addition, because both surfaces are Cu, the initial heat radiation effect is excellent.
    It is mainly used for wireless communications, especially amplifier substrates of mobile phone base stations.


    Advantages:
    1.More easily to be stamped into components than CMC
    2.Very strong interface bonding which can repeatedly resist 850℃ heat shock
    3.Higher thermal conductivity and lower cost
    4.No magnetism

    Product Properties:
    GradeDensity g/cm3

    Coefficient of thermal

    Expansion ×10-6 (20℃)

    Coefficient of thermal

    Expansion ×10-6 (20℃)

    CPC1419.57.3

    280(XY)/170(Z)

    CPC2329.310.2255(XY)/250(Z)

    Application:
    Typical Applications: Microwave carriers and heat sinks, BGA Packages, LED packages, GaAs device mount,mobile phone base stations.


    Product picture:

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