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90WCu Tungsten Copper 90 / 10 Heat Sink For High Powered Electronic Devices

    Buy cheap 90WCu Tungsten Copper 90 / 10 Heat Sink For High Powered Electronic Devices from wholesalers
     
    Buy cheap 90WCu Tungsten Copper 90 / 10 Heat Sink For High Powered Electronic Devices from wholesalers
    • Buy cheap 90WCu Tungsten Copper 90 / 10 Heat Sink For High Powered Electronic Devices from wholesalers

    90WCu Tungsten Copper 90 / 10 Heat Sink For High Powered Electronic Devices

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    Brand Name : JBNR
    Model Number : 50WCu,75WCu,80WCu,85WCu,90WCu
    Payment Terms : L/C, , T/T, Western Union
    Delivery Time : 15days
    Price : Negotiable
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    90WCu Tungsten Copper 90 / 10 Heat Sink For High Powered Electronic Devices

    90WCu / Tungsten Copper 90 / 10 Heat Sink For Electronic Packaging


    Description:

    Electronic packaging is to put a certain function of the integrated circuit chips (including semiconductor integrated circuit chips, thin film integrated circuit substrate, hybrid integrated circuit chips) placed in a corresponding shell container, which can provide a stable environment to protect chips work normally and keep stable functions in integrated circuit. At the same time, encapsulation also is connection method of outputting and inputting to make the transition to outside, and it can form a completed entirety with chips.

    W-Cu heat sink material is a composite of tungsten and copper, with both tungsten low expansion characteristics, but also has copper of high thermal conductivity properties, and the tungsten and copper in the thermal expansion coefficient and thermal conductivity can be adjusted with the W-Cu composition, also the composite can be machined to various shape.


    Advantages:

    1. High thermal conductivity
    2. Excellent hermeticity
    3. Excellent flatness, surface finish, and size control
    4. Semi-finished or finished (Ni/Au plated) products available
    5. Low void

    Product Properties:

    GradeW ContentDensity g/cm3

    Coefficient of thermal

    Expansion ×10-6 (20℃)

    Thermal conductivity W/(M·K)
    90WCu90±2%17.06.5180 (25℃) /176 (100℃)
    85WCu85±2%16.47.2190 (25℃) / 183 (100℃)
    80WCu80±2%15.658.3200 (25℃) / 197 (100℃)
    75WCu75±2%14.99.0230 (25℃) / 220 (100℃)
    50WCu50±2%12.212.5340 (25℃) / 310 (100℃)



    Application:

    These composite are widely used in applications such as Optoelectronics Packages, Microwave Packages, C Packages, Laser Sub-mounts. etc.

    Product picture:




























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