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CPC141 Carrier Base Heat Sink Strong Interface Bonding For Powder Device Packages

    Buy cheap CPC141 Carrier Base Heat Sink Strong Interface Bonding For Powder Device Packages from wholesalers
     
    Buy cheap CPC141 Carrier Base Heat Sink Strong Interface Bonding For Powder Device Packages from wholesalers
    • Buy cheap CPC141 Carrier Base Heat Sink Strong Interface Bonding For Powder Device Packages from wholesalers

    CPC141 Carrier Base Heat Sink Strong Interface Bonding For Powder Device Packages

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    Brand Name : JBNR
    Model Number : CPC141,CPC232,CPC300
    Payment Terms : L/C, , T/T, Western Union
    Delivery Time : 15days
    Price : Negotiable
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    CPC141 Carrier Base Heat Sink Strong Interface Bonding For Powder Device Packages

    CPC141 Carrier / Base / Heat Sink For Powder Device Packages


    Description:


    Has the same thermal expansion coefficient as that of alumina ceramic, widely used for ceramic package using alumina. As the surface is copper with high thermal conductivity, it has excellent heat diffusion.

    Advantages:

    1.More easily to be stamped into components than CMC
    2.Very strong interface bonding which can repeatedly resist 850℃ heat shock
    3.Higher thermal conductivity and lower cost
    4.No magnetism

    Product Properties:
    GradeDensity g/cm3

    Coefficient of thermal

    Expansion ×10-6 (20℃)

    Coefficient of thermal

    Expansion ×10-6 (20℃)

    CPC1419.57.3

    280(XY)/170(Z)

    CPC2329.310.2255(XY)/250(Z)

    Application:


    Wireless communication, Opto electronics, in-vehicle, wind power generation, LED, industrial machine.


    Product picture:

    Product Tags:

    copper heat sink

      

    copper base plate

      
    Quality CPC141 Carrier Base Heat Sink Strong Interface Bonding For Powder Device Packages for sale
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