WCu Material / Tungsten Copper Heat Sink Nickel Plated For Laser
Diode Submounts
Description:
It is a composite of tungsten and copper. The coefficient of
thermal expansion (CTE) of the composite can be disigned by
controlling the content of tungsten, matching that of the
materials, such as Ceramics (Al2O3, BeO),Semiconductors (Si),Metals
(Kovar), etc. The products are widely applicated in the fields such
as radio frequency,microwave,high power diode packaging and optical
communication system.
Advantages:
1. High thermal conductivity
2. Excellent hermeticity
3. Excellent flatness, surface finish, and size control
4. Semi-finished or finished (Ni/Au plated) products available
5. Low void
Product Properties:
| Grade | W Content | Density g/cm3 | Coefficient of thermal Expansion ×10-6 (20℃) | Thermal conductivity W/(M·K) |
| 90WCu | 90±2% | 17.0 | 6.5 | 180 (25℃) /176 (100℃) |
| 85WCu | 85±2% | 16.4 | 7.2 | 190 (25℃) / 183 (100℃) |
| 80WCu | 80±2% | 15.65 | 8.3 | 200 (25℃) / 197 (100℃) |
| 75WCu | 75±2% | 14.9 | 9.0 | 230 (25℃) / 220 (100℃) |
| 50WCu | 50±2% | 12.2 | 12.5 | 340 (25℃) / 310 (100℃) |
Application:
1.Used as high temperature resistance in electronic products and
Auto-Engines. Like Computer generates vast amounts of heat, which
results in the slow of speed.Tungsten alloy heat sink can solve
this problem.
2.Used in applications such as optoelectronics packages, Microwave
Packages, Packages, Laser Submounts, etc.
3.Used as heat sink pieces and encapsulation shell.
4.Used in thermal mounting plates, chip carriers, flanges, and
frames for RF, microwave millimeter wave packages like LDMOS FET;
MSFET; HBT; Bipolar; HEMT; MMIC, light emitting diodes and
detectors, laser diode packages like pulse, CW, single emitter,
bars and complex carriers for optoelectronics amplifiers,
receivers, transmitters, tunable Lasers.
Product picture:
