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MoCu Carriers High Reliability Ceramic Substrates And Critical Glass To Metal Interfaces

    Buy cheap MoCu Carriers High Reliability Ceramic Substrates And Critical Glass To Metal Interfaces from wholesalers
     
    Buy cheap MoCu Carriers High Reliability Ceramic Substrates And Critical Glass To Metal Interfaces from wholesalers
    • Buy cheap MoCu Carriers High Reliability Ceramic Substrates And Critical Glass To Metal Interfaces from wholesalers
    • Buy cheap MoCu Carriers High Reliability Ceramic Substrates And Critical Glass To Metal Interfaces from wholesalers

    MoCu Carriers High Reliability Ceramic Substrates And Critical Glass To Metal Interfaces

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    Brand Name : JBNR
    Model Number : HCMC010
    Certification : ISO9001
    Payment Terms : L/C, D/A, D/P, T/T, Western Union
    Supply Ability : 5 tons a month
    Delivery Time : 20 days
    Price : Negotiable
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    MoCu Carriers High Reliability Ceramic Substrates And Critical Glass To Metal Interfaces

    MoCu Carriers For High Reliability Ceramic Substrates And Critical Glass-to-metal Interfaces


    Description:

    Molybdenum copper alloy is a composite material of molybdenum and copper which has adjustable thermal expansion coefficient and thermal conductivity. But the density of molybdenum copper is much smaller than tungsten copper. Therefore, molybdenum copper alloy is more suitable for aerospace and other fields.


    Advantages:

    1. This molybdenum copper base plates feature high thermal conductivity and excellent hermeticity.

    2. Molybdenum copper flanges are 40% lighter than comparable tungsten copper composite.


    Product Properties:

    GradeMo ContentDensity g/cm3

    Coefficient of thermal

    Expansion ×10-6 (20℃)

    Thermal conductivity W/(M·K)
    70MoCu70±2%9.87200(25℃)/196(100℃)
    60MoCu60±2%9.667.5222(25℃)/217(100℃)
    50MoCu50±2%9.510.2250(25℃)/220(100℃)


    Advantages:

    Mo/Cu offers the following advantages to our customers:

     Tailored thermal expansion to meet your specific design criteria

     Highest thermal/electrical conductivity performance available for this material

     Outstanding thermal-mechanical stability

     Critical dimensional tolerance and surface finish control

     Metallization capability including electrolytic, electroless, and thin film processes to meet your specifications  Finer particle size available for critical edge and thermal uniformity specification

     A forty percent weight savings compared to W/Cu


    Application:

    Molybdenum copper heat spreaders are widely used in applications such as microwave carriers, ceramic substrate carriers, laser diode mounts, optical packages, power packages, butterfly packages and crystal carriers for solid state lasers, etc.

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