85WCu Copper Tungsten Alloy , No Void Heat Spreader For Electronic Packaging

85WCu Copper Tungsten Alloy , No Void Heat Spreader For Electronic Packaging

Description:

Electronic packaging is to put a certain function of the integrated circuit chips (including semiconductor integrated circuit chips, thin film integrated circuit substrate, hybrid integrated circuit chips) placed in a corresponding shell container, which can provide a stable environment to protect chips work normally and keep stable functions in integrated circuit. At the same time, encapsulation also is connection method of outputting and inputting to make the transition to outside, and it can form a completed entirety with chips.

W-Cu heat sink material is a composite of tungsten and copper, with both tungsten low expansion characteristics, but also has copper of high thermal conductivity properties, and the tungsten and copper in the thermal expansion coefficient and thermal conductivity can be adjusted with the W-Cu composition, also the composite can be machined to various shape.


Advantages:

1. High thermal conductivity
2. Excellent hermeticity
3. Excellent flatness, surface finish, and size control
4. Semi-finished or finished (Ni/Au plated) products available
5. Low void

Product Properties:

Application:

These composite are widely used in applications such as Optoelectronics Packages, Microwave Packages, C Packages, Laser Sub-mounts. etc.

Product picture:

Zhuzhou Jiabang Refractory Metal Co.,Ltd, founded in year 2008, has an area coverage of 12000m2. Its registered capital is RMB 30 million. 
Zhuzhou Jiabang Refractory Metal Co.,Ltd is devoted in research and production of products in electronics area, medical area, new energy industry and aeronautical and space industries etc.
The main products are pure tungsten, pure molybdenum, tungsten copper, molybdenum copper, Cu/Mo/Cu (CMC), Cu/MoCu/Cu (CPC) and tungsten heavy alloy etc., 
JB possesses a highly-qualified technical team which has solid theoretical guidance and extremely rich practising experience in the aspects of powder metallurgy, press processing and shape processing. Besides, an energetic technical team with appropriate ages is full of powerful creative spirits and exploratory capabilities.
From year 2014, we have begun the reseach and development for hermetic package materials and heat sink materials. And until now, we have input about RMB 15 million to upgrade the machines. With years of development, the properties of heat sinks have already reached the international quality level.

JBNR will continuously hold the belief of "customer foremost, requirements fulfilled, improvement continued, and world class pursued" and cooperate closely with customers, contriving to gain a win-win situation and develop together with customers in the fierce market competition. Welcome people from all fields and customers from abroad and home to consult technology, do business and cooperate together.