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Silicone Encapsulants And Potting Compounds

    Buy cheap Silicone Encapsulants And Potting Compounds from wholesalers
     
    Buy cheap Silicone Encapsulants And Potting Compounds from wholesalers
    • Buy cheap Silicone Encapsulants And Potting Compounds from wholesalers
    • Buy cheap Silicone Encapsulants And Potting Compounds from wholesalers
    • Buy cheap Silicone Encapsulants And Potting Compounds from wholesalers
    • Buy cheap Silicone Encapsulants And Potting Compounds from wholesalers

    Silicone Encapsulants And Potting Compounds

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    Brand Name : MC SILICONE
    Model Number : MCSIL-E184
    Certification : MSDS
    Price : Negotiable
    Payment Terms : L/C, , T/T, Western Union, PayPal ,
    Supply Ability : 4000kgs/day
    Delivery Time : about 3-5 working days after payment
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    Silicone Encapsulants And Potting Compounds

    Good Moisture Protection Silicone Encapsulants 184 Clear Silicone Elastomer For Electronics Parts Encapsulation


    Product Description
    MCSIL-E184 Silicone Encapsulant, is supplying this product in 2-part separate liquid component kits, consisting of base and curing agents. When mixed thoroughly, the compound turns into a flexible elastomer. The mixing process should be done using a weight or volume ratio of 10:1.


    COMPOSITION
    Two-part
    10 to 1 mix ratio
    Polydimethylsiloxane elastomer


    It is not confined only to the electronics industry, but it is also used extensively in the electrical industry such as transformers, solar cells, ferrite cores, equipment modules, etc. Its intrinsic property is suitable for outdoor usage because silicone is resistant to ozone and ultraviolet rays; hence, preventing pre-mature degradation.


    Applications

    MCSIL-E184 Silicone Encapsulant is suitable for:
    LED Lighting encapsulation
    Power supplies
    Connectors
    Sensors
    Industrial controls
    Transformers
    Amplifiers
    High voltage resistor packs
    Relays
    Adhesive/encapsulant for solar cells
    Adhesive handling beam lead integrated circuits during processing


    Features

    Flowable
    Room temperature and heat cure
    Good dielectric properties
    Rapid, versatile cure processing controlled by temperature
    High transparency allows easy inspection of components.


    Technical datasheet of Electronic Potting Silicone Encapsulates


    Item No.RTV184
    Before curing
    Appearancetransparent
    Viscosity (mPa.s 25°C)3500
    Density (g/cm3 )1.03
    Working life (min 25°C)150 mins
    Curing time (hrs)24
    Heat-up at 100°C (min)10
    After curing
    Hardness (shore A)43
    Dielectric breakdown voltage kv/mm 25°C19
    Thermal conductivity0.27
    Working temperature °C-45~200

    Note: Mechanical and electrical performance data tested at 25°C 7 days after curing, relative humidity of 55%; all the tested data is average value.


    APPLICATION METHODS
    Automated metered mixing and dispensing
    Manual mixing


    MIXING AND DE-AIRING
    The 10 to 1 mix ratio these products are supplied in gives one latitude to tune the modulus and hardness for specific application needs and production lines. In most cases de-airing is not required.


    PREPARING SURFACES
    In applications requiring adhesion, priming will be required for many of the silicone encapsulants. For best results, the primer should be applied in a very thin, uniform coating and then wiped off after application. After application, it should be thoroughly cured prior to application of the silicone elastomer. Additional instructions for primer usage can be found in the information sheets specific to the individual primers.


    PROCESSING/CURING
    Thoroughly mixed silicone encapsulant may be poured/dispensed directly into the container in which it is to be cured. Care should be taken to minimize air entrapment. When practical, pouring/dispensing should be done under vacuum, particularly if the component being potted or encapsulated has many small voids. If this technique cannot be used, the unit should be evacuated after the silicone encapsulant has been poured/dispensed. Silicone encapsulants may be either room temperature (25°C/77°F) or heat cured. Room temperature cure encapsulants may also be heat accelerated for faster cure.


    POT LIFE AND CURE RATE
    Cure reaction begins with the mixing process. Initially, cure is evidenced by a gradual increase in viscosity, followed by gelation and conversion to a solid elastomer. Pot life is defined as the time required for viscosity to double after base and curing agent are mixed and is highly temperature and application dependent.


    USEFUL TEMPERATURE RANGES
    For most uses, silicone elastomers should be operational over a temperature range of -45 to 200°C (-49 to 392°F) for long periods of time. However, at both the low and high temperature ends of the spectrum, behavior of the materials and performance in particular applications can become more complex and require additional considerations and should be adequately tested for the particular end-use environment.


    LIMITATIONS
    This product is neither tested nor represented as suitable for medical or pharmaceutical uses.


    USABLE LIFE AND STORAGE
    Shelf life is 12 months from the production date found on the product label. Special precautions must be taken to prevent moisture from contacting these materials. Containers should be kept tightly closed and head or air space minimized. Partially filled containers should be purged with dry air or other gases, such as nitrogen.

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