9um 12um 18um 35um High Density FPC PCB Copper Foil

9um 12um 18um 35um High Density FPC PCB Copper Foil

Specification:

Thickness: 9µm～35µm

Performances:

The product surface is black or red, has lower surface roughness.

Applications:

Flexible Copper Clad Laminate (FCCL), Fine Circuit FPC, LED coated crystal thin film.

Features:

High density, high bending resistance and good etching performance.

Microstructure:

Table1- Performance:

We work at developing, producing and circulating metallic materials. We delivers a wide range of copper and its alloy products to demanding customers in the electro-technical industry.

Our product-range includes copper and copper alloy in the shape of foil, strip and sheet with a great variety of standards, ingredients and purposes. Our products have broadly been used in aviation, space industry, shipbuilding, military industry, metallurgy, electronics industry, electric goods producing, telecommunications, decoration engineering, plumbing and sanitary.