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Copper Rotatable Sputtering Target High Density With Smooth Surface

Name: Copper Rotatable Sputtering Target High Density With Smooth Surface
Brand: JINXING
Price: 15 USD

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Brand Name :	JINXING
Model Number :	Copper Rotatable Sputtering Target
Certification :	ISO 9001
Price :	15～100USD/kg
Payment Terms :	L/C, D/A, D/P, T/T, Western Union
Supply Ability :	100000kgs/M
Delivery Time :	10～25 work days

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Copper Rotatable Sputtering Target High Density With Smooth Surface

Copper Rotatable Sputtering Target Ultra high purity 99.999%, 99.9999%

6N ultra-high purity electrolytic copper is mainly used in the production of sputtering target, evaporation film and anode materials for integrated circuits.

Purity: 99.999% ~ 99.9999%

For precise control of impurity content, Ag content can be controlled below 0.1ppm and s content below 0.02ppm

The content of gas elements (C, O, N, H) is less than 1ppm

Main uses: 6N copper has some properties similar to gold, good conductivity, ductility, corrosion resistance and surface performance, and low softening temperature. As a new kind of material, high-purity copper is not only used in the preparation of high-purity analytical standard test materials, various connecting wires for electronic industry, bonding wires for electronic packaging, high-quality audio wires and integrated circuits, sputtering targets for liquid crystal display and ion coating, but also an indispensable and precious material in the atomic energy, rocket, missile, aviation, aerospace and metallurgical industries . As a new material, ultra pure copper has been paid more and more attention. In addition to the preparation of high-purity analytical standard test materials, various connecting wires for electronic industry, bonding wires for electronic packaging, high-quality audio wires and integrated circuits, sputtering targets and ion coating for liquid crystal display, high-quality audio circuits and other high-tech fields, high-purity copper is also used in atomic energy, rockets, missiles, aviation, space navigation and other fields Precious materials are indispensable in metallurgical industry. With the development of high and new technology and the need of strategic materials, high-purity metals have higher and higher requirements for purity. The preparation and application of high-purity and ultra-high-purity metals in modern materials science and engineering are new and growing fields.

Among the production methods of high-purity copper, electrolytic refining technology is the most mature, widely used and the most promising method in industry. The key technology of electrolytic refining to produce high purity copper is to highly purify the electrolyte. The raw material is the cathode copper obtained by the general electrolytic plant. The purity of copper is improved by RE Electrolysis

Copper Rotatable Sputtering Target 99.9999% , Copper Tu beSputtering Target 99.9999% are available in varying sizes

Sizes:

Plate sputtering targets:

Thickness: 0.04 to 1.40" (1.0 to 35mm).

Width up to 20"(50 to 500mm).

Length: 3.9" to 6.56 feet( 100-2000mm)

other sizes as requested.

Cylinder sputtering targets:

3.94 Dia. x 1.58"(100 Dia. x 40mm)

2.56 Dia. x 1.58" (65 Dia. x 40mm)

or 63*32mm other sizes as requested.

Rotatable sputtering targets:

2.76 OD x 0.28 WT x 39.4”L (70 OD x 7 WT x 1000mm L)

3.46 OD x 0.39 WT x 48.4”L (88 OD x 10 WT x 1230mm L)

other sizes as requested.

Advantage:

1. Purity: 99.99% ~ 99.9999%

2. High density, no defects inside, even grains and smooth surface

3. Unique melting and casting pollution control process

4. It can meet the needs of customized alloy

5. Unique homogenization control technology of added elements

6. Unified microstructure control

Product Name	Element	Purirty	Melting Point ℃	Density (g/cc)	Available Shapes
High Pure Sliver	Ag	4N-5N	961	10.49	Wire, Sheet, Particle, Target
High Pure Aluminum	Al	4N-6N	660	2.7	Wire, Sheet, Particle, Target
High Pure Gold	Au	4N-5N	1062	19.32	Wire, Sheet, Particle, Target
High Pure Bismuth	Bi	5N-6N	271.4	9.79	Particle, Target
High Pure Cadmium	Cd	5N-7N	321.1	8.65	Particle, Target
High Pure Cobalt	Co	4N	1495	8.9	Particle, Target
High Pure Chromium	Cr	3N-4N	1890	7.2	Particle, Target
High Pure Copper	Cu	3N-6N	1083	8.92	Wire, Sheet, Particle, Target
High Pure Ferro	Fe	3N-4N	1535	7.86	Particle, Target
High Pure Germanium	Ge	5N-6N	937	5.35	Particle, Target
High Pure Indium	In	5N-6N	157	7.3	Particle, Target
High Pure Magnesium	Mg	4N	651	1.74	Wire, Particle, Target
High Pure Magnesium	Mn	3N	1244	7.2	Wire, Particle, Target
High Pure Molybdenum	Mo	4N	2617	10.22	Wire, Sheet, Particle, Target
High Pure Niobium	Nb	4N	2468	8.55	Wire, Target
High Pure Nickel	Ni	3N-5N	1453	8.9	Wire, Sheet, Particle, Target
High Pure Lead	Pb	4N-6N	328	11.34	Particle, Target
High Pure Palladium	Pd	3N-4N	1555	12.02	Wire, Sheet, Particle, Target
High Pure Platinum	Pt	3N-4N	1774	21.5	Wire, Sheet, Particle, Target
High Pure Silicon	Si	5N-7N	1410	2.42	Particle, Target
High Pure Tin	Sn	5N-6N	232	7.75	Wire, Particle, Target
High Pure Tantalum	Ta	4N	2996	16.6	Wire, Sheet, Particle, Target
High Pure Tellurium	Te	4N-6N	425	6.25	Particle, Target
High Pure Titanium	Ti	4N-5N	1675	4.5	Wire, Particle, Target
High Pure Tungsten	W	3N5-4N	3410	19.3	Wire, Sheet, Particle, Target
High Pure Zinc	Zn	4N-6N	419	7.14	Wire, Sheet, Particle, Target
High Pure Zirconium	Zr	4N	1477	6.4	Wire, Sheet, Particle, Target

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Copper Rotatable Sputtering Target High Density With Smooth Surface

Copper Rotatable Sputtering Target High Density With Smooth Surface

Copper Rotatable Sputtering Target High Density With Smooth Surface

Copper Rotatable Sputtering Target Ultra high purity 99.999%, 99.9999%

Copper Rotatable Sputtering Target

Sputtering Target With Smooth Surface

Copper Sputtering Target High Density

Copper Rotatable Sputtering Target High Density With Smooth Surface

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