N Type , Undoped Or S-Doped Indium Phosphide Wafer , 6”, Prime Grade

N Type , Undoped Or S-Doped Indium Phosphide Wafer , 6”, Prime Grade

PAM-XIAMEN offers InP wafer – Indium Phosphide which are grown by LEC(Liquid Encapsulated Czochralski) or VGF(Vertical Gradient Freeze) as epi-ready or mechanical grade with n type, p type or semi-insulating in different orientation(111)or(100).
Indium phosphide (InP) is a binary semiconductor composed of indium and phosphorus. It has a face-centered cubic (“zinc blende”) crystal structure, identical to that of GaAs and most of the III-V semiconductors.Indium phosphide can be prepared from the reaction of white phosphorus and indium iodide[clarification needed] at 400 °C.,[5] also by direct combination of the purified elements at high temperature and pressure, or by thermal decomposition of a mixture of a trialkyl indium compound and phosphide. InP is used in high-power and high-frequency electronics[citation needed] because of its superior electron velocity with respect to the more common semiconductors silicon and gallium arsenide.

N Type, Indium Phosphide Wafer, 6”, Prime Grade

What is the InP Process?

InP wafers must be prepared prior to device fabrication. To start, they must be completely cleaned to remove any damage that might have occurred during the slicing process. The wafers are then Chemically Mechanically Polished/Plaranrized (CMP) for the final material removal stage. This allows for the attainment of super-flat mirror-like surfaces with a remaining roughness on an atomic scale. After that is completed, the wafer is ready for fabrication.

Recombination Parameters

Surface recombination velocity versus the heat of reaction per atom of each metal phosphide ΔHR (Rosenwaks et al. [1990]).

If the surface Fermi level EFS is pinned close to midgap (EFS~Eg/2) the surface recombination velocity increases from ~5·10-3cm/s for doping level no~3·1015 cm-3 to ~106 cm/s for doping level no ~ 3·1018cm-3 (Bothra et al. [1991]).

Application in LiDAR systems for the automotive sector and industry 4.0

Widely discussed in the LiDAR arena is the wavelength of the signal. While some players have opted for 830-to-940-nm wavelengths to take advantage of available optical components, companies (including Blackmore, Neptec, Aeye, and Luminar) are increasingly turning to longer wavelengths in the also-well-served 1550-nm wavelength band, as those wavelengths allow laser powers roughly 100 times higher to be employed without compromising public safety. Lasers with emission wavelengths longer than ≈ 1.4 μm are often called “eye-safe” because light in that wavelength range is strongly absorbed in the eye's cornea, lens and vitreous body and therefore cannot damage the sensitive retina).
• LiDAR-based sensor technology can provide a high level of object identification and classification with three-dimensional (3D) imaging techniques.
• The automotive industry will adopt a chip-based, low cost solid state LiDAR sensor technology instead of large, expensive, mechanical LiDAR systems in the future.
• For the most advanced chip-based LiDAR systems, InP will play an important role and will enable autonomous driving. (Report: Blistering Growth for Automotive Lidar, Stewart Wills). The longer eye safe wavelength is also more appropriate dealing with real world conditions like dust, fog and rain.

Are You Looking for an InP substrate?

PAM-XIAMEN is proud to offer indium phosphide substrate for all different kinds of projects. If you are looking for InP wafers, send us enquiry today to learn more about how we can work with you to get you the InP wafers you need for your next project. Our group team is looking forward to providing both quality products and excellent service for you!

Xiamen Powerway Advanced Material Co.,Limited(PAM-XIAMEN) is a high-tech enterprise for compound semiconductor material integrating semiconductor crystal growth, process development and epitaxy, specializing in the research and production of compound semiconductor wafers, there are two main field: SiC&GaN material(SiC wafer and epitaxy, GaN wafer and epi wafer) and III-V material (III-V substrate and epi service: InP wafer, GaSb wafer, GaAs wafer, InAs wafer and InSb wafer). Our wafers are widely used in LED semiconductor lighting,wireless communication, solar power, infrared device, laser, detectors and semiconductor power devices, including power devices, high temperature devices and photoelectric devices, therein, GaN wafer including GaN on Si,GaN on SiC and GaN on Sapphire are for Mini / micro LED, power electronics and microwave RF.

As a leading professional company, we are committed to constantly improving the quality of existing products. PAM-XIAMEN has a strong technical R & D team, composed of graduate students, doctors, masters, and has a strong R & D strength. The technical backbone of the company has been engaged in material preparation and related equipment design and development for almost 30years, and has in-depth research on the physical, chemical and electrical properties of materials, material preparation process. The accumulation of many years of theoretical deposition and practical experience of scientific and technological personnel makes the company have unique insights and unique advantages in the development of relevant materials and equipment, while ensuring that the product performance and equipment design scheme of the company meet the actual technical and technological needs of users.