JEDEC Outline MPPO Material BGA Matrix Tray With Standard Pocket Design

JEDEC Outline MPPO Material BGA Matrix Tray With Standard Pocket Design

With exact alignment and stackable design, these trays maximize automation efficiency and minimize IC damage.

Electrostatic discharge (ESD), even a small spark, is strong enough to kill electronic components on the spot and can cause serious production accidents. This leaves the product that customers depend on you to protect unusable. Our ESD matrix tray provides critical protection and simplifies the processes of manufacturing, transportation, and storage. The ESD component tray must provide two types of protection. First, the tray should prevent electrostatic discharge into the tray or the general area of the parts. They do this by isolating static charge from surrounding objects, people, and even the flow of air. One of the most important steps is to prevent static electricity by sliding the tray across the device or surface.

Second, sometimes components are placed in trays that still carry the charge left over from the testing process. If the tray conducts too much electricity, a short circuit will allow a rapid discharge, damaging the component. Packaging that is too conductive can be just as bad as non-conductive packaging, which is why metal trays are bad. While you say you want ESD conductive packaging, what you really want is a tray that dissipates static or is anti-static. This is a subtle but important difference.

The trays are available for many BGA package sizes and are available in various Temperature Range materials, including ESD-safe Materials. Our BGA trays offer a unique mix of protection and flexibility for your automated environment.

Technical Parameters:

Reference to the temperature resistance of different materials with the JEDEC Tray:

FAQ:

Q1: Are you a manufacturer?
Ans: Yes, we are a 100% manufacturer specialized in packaging for over 12 years with a 1500 square meter workshop area, located in Shenzhen, China.

Q2: What information should we supply if we want a quotation?
Ans: Drawing of your IC or component, Quantity, and size normally.
Q3: How long could you prepare samples?
Ans: Normally, 3 days. If customized, open a new mold 25~30 days around.
Q4: How about batch order production?
Ans: Normally, 5- 8 days or so.
Q5: Do you inspect the finished products?
Ans: Yes, we will do an inspection according to the ISO 9001 standard and be ruled by our QC staff.

Hiner-pack was founded in 2013, it is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services.

Hiner-pack has established a depth of cooperation with well-known enterprises and built a polymer material R&D base with domestic well-known universities as well as scientific research institutions. Hiner-pack has mastered special processing techniques and manufacturing in the semiconductor packaging raw material field. Owned a lot of inventions and practical new patents. Through years of unremitting efforts, Hiner-pack has a professional R&D team to improve semiconductor packaging products, new products continue to be launched, and to solve the customer demand for high-quality products.

Learn more through our official website: https://www.hiner-pack.com/english/