Precision Jedec Ic Trays For Advanced Semiconductor Packaging And
Complex Ic Modules
Looking for reliable precision JEDEC IC trays for advanced
semiconductor packaging? These high-quality JEDEC IC trays are
specially made for complex IC module packaging applications.
These custom JEDEC trays feature finely processed high-precision
cavities that fit complex IC structures very well. They meet
standard JEDEC industry requirements and can be fully customized
according to your chip design drawings.
They are widely compatible with modern semiconductor packaging
processes, and perfectly meet the packaging needs of SiP modules,
MEMS devices and various complex IC modules.
Key Features/ Benefits
- Full customization based on chip drawing
- High precision cavity for complex IC structures
- Excellent anti-static performance
- Fast mold development
Specifications
| Brand | Hiner-pack |
| Model | HN24223 |
| Material | MPPO |
| Package Type | JEDEC |
| Color | Black |
| Resistance | 1.0×10⁴ - 1.0×10¹¹ Ω |
| Outline Line Size | 322.6×135.9×7.62 mm |
| Cavity Size | 3x3x0.92 mm |
| Matrix QTY | 14x35=490 PCS |
| Warpage | MAX 0.76mm |
| Service | Accept OEM, ODM |
| Custom Pocket Options | Available |
Applications
This MPPO high-temperature resistant JEDEC IC tray provides full
protection for IC chips throughout production, testing, packaging
and transportation processes. It features excellent ESD anti-static
performance, making it extremely suitable for
electrostatic-sensitive semiconductor devices.It is widely applied
to these professional semiconductor scenarios:
- High-temperature SiP system-in-package packaging processes
- Precision MEMS micro-electro-mechanical device packaging & handling
- Advanced high-density semiconductor module assembly
- Fine Pitch IC chip packaging, testing and carrier storage
- High temperature resistant semiconductor manufacturing workshops
Packaging & Shipping/ Services
JEDEC Matrix Trays are packaged in durable, anti-static materials
with secure stacking and cushioning inserts. Customized packaging
solutions are available upon request. All shipments are tracked and
handled by trusted carriers for reliable worldwide delivery.
About Us:
Hiner-pack® was founded in 2013. It is a high-tech enterprise that
integrates Design, R&D, Manufacturing, Sales of IC packaging
and testing, as well as semiconductive wafer fabrication process in
automated handling, carrying, and transportation to provide
customers with turnkey services.
Why Choose Us:
- Rich experience in JEDEC / IC / waffle pack trays
- In-house mold design capability
- Fast prototype development
- Professional engineering team
- Stable supply for global semiconductor customers
