Product Description:
Our Bare Die Trays can provide a secure and organized way to handle
delicate bare die components during production, assembly, testing,
and shipping.They are designed in a rectangular shape to
efficiently accommodate multiple bare die chips. Their customized
size ensures a perfect fit for various die sizes, offering
flexibility and versatility in handling different types of
components. These trays come in a sleek black color, giving them a
professional and modern look suitable for industrial environments.
Technical Parameters:
| Durability | Sturdy And Impact-Resistant |
| Color | Black |
| Injection Mold | Lead Time 20~25 Days |
| Capacity | Holds Multiple Bare Die Chips |
| Customizable Logo | Yes |
| Flatness | <0.3mm |
| Shape | Rectangular |
| Size | Customized |
| Anti-Static | Yes |
| Surface Resistance | 1.0x10E4~1.0x10E11Ω |
Applications:
I.Chip On Board (COB) Assembly
Bare Die Trays provide secure positioning and electrostatic
discharge (ESD) protection for singulated semiconductor dice during
manual or automated COB assembly processes.
II.Flip Chip and 3D Packaging
The trays' precision-engineered pockets accommodate
backside-exposed dice required for flip chip bonding, enabling
accurate alignment during flux application and reflow processes.
Support and Services:
♠Customized Packaging Solutions: We offer tailored Bare Die Trays
designed to meet the specific requirements of your die sizes and
configurations, ensuring optimal protection and handling during
transportation and storage.
♠On-site Technical Support: Our team of experts provides on-site
assistance for the installation, integration, and troubleshooting
of Bare Die Trays, ensuring seamless operations and minimizing
downtime.
FAQ:
Q:How long can the production be put into production after the
order is placed?
A:Generally, it takes one or two working days.
Q: What is the minimum order quantity for the Bare Die Trays?
A: The minimum order quantity for the Bare Die Trays is 1000
pieces.
