Precision Machining Bare Die Trays For Transport And Customized
Service By Injection Moulding
Bare Die Trays, also known as waffle pack trays, are typically
characterized by their thin trays that are typically 2” or 4”
square in size. These trays feature a distinctive pattern of
separator ribs that form pockets, giving them the appearance of a
waffle.
Waffle pack chip trays are primarily used for the handling and
transportation of bare die or chip scale packages (CSP). These
trays typically come with simple rectangular pockets. In some
cases, custom waffle pack trays are preferred for specific
applications where the existing processes are designed for waffle
pack configurations but require special properties such as bakeable
materials or unique pocket geometry.
Features:
These die trays have been carefully designed to ensure that the
materials used are capable of absorbing all the Electrostatic
Discharge (ESD) that occurs during the handling and transportation
of dies.
The die trays are designed to be temperature range friendly, making
it easy to handle dies as they move between different processes.
This ensures that the dies are always placed within the optimal
temperature range.
Die trays are certified for clean room use, guaranteeing that they
are 100% contaminant-free. The trays effectively absorb any
electric shocks that could potentially damage the dies.
These trays come in various sizes to accommodate different types of
dies, making them compatible with all die types based on the user's
preferences.
Technical Parameters:
| HN24009 Technical Data Ref. |
| Base Information | Material | Color | Matrix QTY | Pocket Size |
| ABS | Black | 10*16=160PCS | 2.0*3.5*0.7mm |
| Size | Length * Width * Height (according to customer's requirement) |
| Feature | Durable; Reusable; Rcofriendly; Biodegradable |
| Sample | A. The free samples: Choosen from existing products. |
| B. Customized samples as per your design/demand |
| Accessory | Cover/Lid, Clip/Clamp, Tyvek paper |
| Artowrk Format | PDF,2D,3D |
Applications:
1. The die tray is primarily utilized in the manufacturing and
assembly of semiconductor dies. Semiconductor companies commonly
rely on die trays to facilitate the transportation of dies between
different production facilities.
2. In addition to transportation, die trays are essential for
securely holding dies during testing and for storage purposes.
3. Die trays are widely accessible through semiconductor research
organizations, stores, and production facilities within the
industry.
4. They are mainly designed for transporting and testing prototype
semiconductor dies.
