Multiple Bare Dies Capacity Chip Holders For Dust-Free Die Storage
And Safety
The Bare Die Tray (Chip Tray & Waffle Pack) series from Hiner-pack
offers a safe and convenient solution for packaging and
transporting various microelectronic components such as Chips,
Dies, COGs, and Optoelectronic devices. These products come in
different sizes and materials to meet diverse needs. The product
specifications include options for 2-inch and 4-inch sizes, while
materials range from Antistatic and Conductive ABS to PC.
Customization is also available to cater to the specific
requirements of customers.
Features:
Molded of ESD-safe Materials: Our products are made of ESD-safe, non-sloughing, and
carbon-powder-free clean polymers to ensure the safety of your
electronics equipment.
Carbon-Fiber Reinforced Design: To provide both strength and permanent ESD protection, our
products are carbon-fiber reinforced, giving you added durability
and peace of mind.
High Temperature Resistance: With an available bake temperature of up to 180°C, our products
can withstand high-temperature environments, making them versatile
for various applications.
Customized Industry-Standard Formats: Our products come in industry-standard formats that can also be
customized to meet your specific needs, ensuring a tailored
solution for your requirements.
Technical Parameters:
| HN24034 Technical Data Ref. |
| Base Information | Material | Color | Matrix QTY | Pocket Size |
| ABS | Black | 10*5=50PCS | 8.00*3.20*1.35mm |
| Size | Length * Width * Height (according to customer's requirement) |
| Feature | Durable; Reusable; Rcofriendly; Biodegradable |
| Sample | A. The free samples: Choosen from existing products. |
| B. Customized samples as per your design/demand |
| Accessory | Cover/Lid, Clip/Clamp, Tyvek paper |
| Artowrk Format | PDF,2D,3D |
Specifications:
The external dimensions of waffle pack chip trays are standardized
into different sizes: 2-inch, 4-inch, and so on, where each size
corresponds to a square shape. The variability lies in the size of
the pockets, their geometry, and the number of pockets present in
the tray.
When it comes to waffle pack trays, they are typically described by
several key characteristics:
- External size – 2”, 4”, etc.
- Pocket size or pocket count – selecting one will impact the other
- Temperature rating – specifies the maximum temperature at which the
tray can be used
For custom waffle pack trays, additional specifications are
necessary:
- Component geometry
- Special process requirements
- Quantity of trays needed or quantity of components to be processed
(this helps determine the appropriate manufacturing process for
tray production)
