Injection Mold Bare Die Tray With High Temperature Resistance
Bare Die Trays, also known as waffle pack trays, are thin trays
typically measuring 2 inches or 4 inches square. These trays
feature a regular pattern of separator ribs that create pockets,
giving them the appearance of a waffle.
Waffle pack chip trays are mainly used for handling and
transporting bare die or chip scale packages (CSP). These trays are
equipped with simple rectangular pockets. Custom waffle pack trays
are favored in scenarios where processes already adhere to the
waffle pack format but require special properties, such as bakeable
material or unique pocket geometry.
Features:
1. These trays are meticulously designed to ensure that the
materials utilized effectively absorb all electrostatic discharge
(ESD) produced during the handling and transporting of dies.
2. The trays are engineered to be compatible with a wide
temperature range, allowing for easy handling of the dies during
transitions between processes. This ensures that the dies are
maintained within the optimal temperature range.
3. The die trays are certified for use in a completely
contaminant-free clean room environment. They are specially
designed to absorb any electrical shocks that could potentially
damage the dies.
4. These trays come in various sizes to accommodate different die
dimensions, and are versatile enough to support all types of dies
based on user preference.
Technical Parameters:
| HN24007 Technical Data Ref. |
| Base Information | Material | Color | Matrix QTY | Pocket Size |
| ABS | Black | 7*12=84PCS | 5.00*2.141*2.157mm |
| Size | Length * Width * Height (according to customer's requirement) |
| Feature | Durable; Reusable; Rcofriendly; Biodegradable |
| Sample | A. The free samples: Choosen from existing products. |
| B. Customized samples as per your design/demand |
| Accessory | Cover/Lid, Clip/Clamp, Tyvek paper |
| Artowrk Format | PDF,2D,3D |
Applications:
The die tray is primarily utilized in the manufacturing and assembly processes
of semiconductor dies. These trays play a crucial role as a common
interface for efficiently moving dies between different production
centers in semiconductor companies.
In addition to transportation, die trays also function as a reliable method for securing the dies during
testing procedures and while in storage.
You can find the die tray in various semiconductor research institutions, as well as in
stores and production facilities across the industry.
The main application of these trays lies in facilitating the
transportation and testing of prototype semiconductor dies.
