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Silicon Carbide (SiC) Horizontal Process Tube for LPCVD/CVD Processes

    Buy cheap Silicon Carbide (SiC) Horizontal Process Tube for LPCVD/CVD Processes from wholesalers
     
    Buy cheap Silicon Carbide (SiC) Horizontal Process Tube for LPCVD/CVD Processes from wholesalers
    • Buy cheap Silicon Carbide (SiC) Horizontal Process Tube for LPCVD/CVD Processes from wholesalers
    • Buy cheap Silicon Carbide (SiC) Horizontal Process Tube for LPCVD/CVD Processes from wholesalers
    • Buy cheap Silicon Carbide (SiC) Horizontal Process Tube for LPCVD/CVD Processes from wholesalers
    • Buy cheap Silicon Carbide (SiC) Horizontal Process Tube for LPCVD/CVD Processes from wholesalers

    Silicon Carbide (SiC) Horizontal Process Tube for LPCVD/CVD Processes

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    Brand Name : ZMSH
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    Delivery Time : 2-4 weeks
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    Silicon Carbide (SiC) Horizontal Process Tube for LPCVD/CVD Processes


    Product Positioning & Value Proposition

    The Silicon Carbide (SiC) Horizontal Process Tube is the primary pressure boundary and clean process chamber used in high-temperature gas-phase reactions and heat treatment for semiconductor, photovoltaic, and advanced materials manufacturing.


    The product adopts a 3D-printed monolithic SiC body + CVD SiC functional coating architecture, combining high thermal conductivity, low contamination, high mechanical strength, and chemical durability. It is optimized for processes that demand low particle/gas contamination, excellent temperature uniformity, and long-term stability.

    Core value:

    • Push the tool’s temperature uniformity, cleanliness, and OEE to a higher level.

    • Extend replacement intervals and shorten cleaning downtime to optimize Total Cost of Ownership (TCO).

    • Provide a long-life, low-risk chamber solution for oxidative and chlorine-bearing chemistries at elevated temperature.


    Applicable Atmospheres & Process Window

    • Working atmospheres

      • Reactive gases: oxygen (O₂) and other oxidizing mixtures

      • Carrier/protective gases: nitrogen (N₂) and high-purity inert gases

      • Compatible species: trace chlorine-bearing gases (concentration and residence time controlled by recipe)

    • Typical processes: dry/wet oxidation, anneal, diffusion, LPCVD/CVD deposition, surface activation/modification, PV passivation, functional thin-film formation, carbonization/nitridation, etc.

    • Temperature range: ambient to 1250 °C (recommend 10–15% safety margin depending on heater design and ΔT constraints)

    • Pressure range: from slight vacuum/LPCVD negative pressure to near-atmospheric positive pressure (final rating per PO/spec).


    Materials & Structural Rationale

    1. Monolithic SiC body (additive manufactured)

      • High-density β-SiC or multi-phase SiC; single-piece construction eliminates seams and braze joints that can create micro-leaks or stress concentrators.

      • High thermal conductivity (vs. alumina/quartz) supports rapid thermal response and improved axial/radial uniformity.

      • Low, stable CTE yields better high-temperature dimensional stability and seal integrity.

    2. CVD SiC functional coating

      • In-situ deposited, dense and ultra-pure (surface/coating impurities < 5 ppm); minimizes particle shedding and metal ion release.

      • Outstanding chemical inertness toward oxidizing and chlorine-bearing gases; mitigates wall attack and re-deposition.

      • Zonal thickness tailoring available to balance corrosion resistance with thermal response.

    3. Composite benefits

      • Body provides mechanical support + heat conduction; coating provides corrosion resistance + cleanliness—a system-level optimum for reliability and throughput.


    Key Performance Targets

    • Max continuous use temperature: 1250 °C

    • Substrate (bulk body) total impurities: < 300 ppm

    • CVD SiC coating/surface impurities: < 5 ppm

    • Dimensional tolerances (typical): OD ±0.3–0.5 mm; coaxiality ≤ 0.3 mm/m (tighter upon request)

    • Inner-wall roughness: Ra ≤ 0.8–1.6 µm (fine polish / near-mirror optional)

    • Leak tightness (helium): ≤ 1×10⁻⁹ Pa·m³/s (per tool class)

    • Thermal shock stability: supports repeated hot-cold cycling with no visible cracking or spallation (type-test report supplied)

    • Cleanliness: final clean/assembly in ISO Class 5–6 environment; particle and metal ion residues certified per customer spec.


    Configurations & Options

    • Geometry: OD 50–400 mm (larger on evaluation), long-length one-piece bodies; wall thickness optimized for strength/weight/heat flux.

    • Ends & interfaces: flanges, bell-mouth, bayonet, locating rings, O-ring grooves, pump-out/pressure ports—tailored to your frames/jigs.

    • Functional ports: thermocouple feedthrough preparation, sight window seats, bypass gas inlets (all with high-temp, leak-tight design).

    • Coating strategies: inner wall (default), outer wall, or full coverage; local shielding/graded thickness for high-impingement zones.

    • Surface & cleanliness: roughness grade, ultrasonic/DI clean, drying/bake curves configurable.

    • Ancillaries: graphite/ceramic/metal flanges, seals, locating fixtures, handling sleeves and storage cradles.


    Comparison

    MetricSiC TubeQuartz TubeAlumina TubeGraphite Tube
    Thermal conductivityHigh (uniform field)LowLowHigh
    High-temp strength/creepExcellentFairGoodGood (oxidation-sensitive)
    Thermal shockExcellentWeakModerateExcellent
    Cleanliness / metal ionsExcellent (low)ModerateModeratePoor
    Oxidation & Cl-chemistryExcellentFairGoodPoor (oxidizes)
    Cost vs. service lifeMedium / long lifeLow / shortMedium / mediumMedium / env-limited



    Frequently Asked Questions (FAQ)

    Q1. Why monolithic 3D-printed SiC?
    A. Eliminates seams/brazes that cause leaks and stress peaks; enables complex geometries with repeatable dimensions.


    Q2. Will Cl-bearing gases attack SiC?
    A. CVD SiC is highly inert to most Cl species within specified temperature/partial pressure/residence limits. Use local thickening in high-impingement zones and ensure robust purge/exhaust design.


    Q3. What are the practical gains vs. quartz?
    A. Longer life, better uniformity, lower particles/metal ions, and better TCO—especially above ~900 °C and in oxidizing/Cl environments.


    Q4. Is fast ramping supported?
    A. Yes, with controlled max ΔT and rates; pair high-κ body + thin coating, and follow first-use bake SOP.


    Q5. When should a tube be retired?
    A. Trigger on any of: flange/edge cracks, coating pits/spall, rising leak rate, drifted temperature profile, abnormal particle events.

    Quality Silicon Carbide (SiC) Horizontal Process Tube for LPCVD/CVD Processes for sale
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