ESD ROHS Black Antistatic PPE MPPO IC Storage Packaging JEDEC Chip
Tray
ESD High Temperature IC Chip Tray Electronic Component Tray
JEDEC standard injection molded trays are mainly used for
anti-static IC storage, especially in the transportation and
storage of PCB electronic components. These trays have the
following features and advantages:
1. Application of high-performance materials
New material development: more and more high-performance materials
(such as PE1, PES, etc.) are used to manufacture JEDEC trays to
improve high temperature resistance, chemical resistance and
anti-static properties.
2. Automated production needs
Automation compatibility:With the electronics manufacturing
industry to automation transition, JEDEC tray design is
increasingly focusing on compatibility with automation equipment to
improve production efficiency.
3. Environmental Protection and Sustainability
Recyclable Materials:Manufacturers are gradually adopting
recyclable and environmentally friendly materials to meet the
requirements of sustainable development and reduce the impact on
the environment.
4. Miniaturization and High Density Storage
Miniaturization Trend:As electronic components become smaller and
smaller in size, the design of trays also puts forward higher
requirements, promoting miniaturization and high-density storage
solutions.
5.Customization Requirements
Customized Solutions:Customers are looking for customized solutions
for their pallets. Personalized solutions: Customers are
increasingly demanding customization of pallets to fit specific
products and production processes.
6. Globalized Supply Chain
International Standardization:As globalization advances, the
standardized design of JEDEC pallets enables them to better adapt
to the international market and improve the efficiency of the
supply chain.
| Mold No. | HN23067 |
| Cavity Size/mm | 8.3*9.3*1.14 |
| Overall Dimension/mm | 322.6x135.9x12.19 |
| Material | MPPO/PPE |
| Matrix Quantity | 9X20=180PCS |
| Color | black(According to customer needs) |
Customer FAQ
Question 1: How many kinds of injection molding products do you
produce?
A: Mainly consumer electronics, medical devices, auto parts,
digital electronics, computer parts, semiconductors, labor
protection and other products, welcome to inquire!
Question 2: What are your factory certificates?
A: Passed ISO9001 ITF16949 ISO14001 SGS, ROHS, TUV, CE and so on.
Question 3:What are your mold products?
Answer: Plastic injection molds, injection molded products, blister
trays, wafer turnover boxes and so on.
Question 3: How many materials are available for chip trays?
Answer: ABS/PPO/PPE/LCP/PS/PC, temperature resistance range
80,120,150,270°, we can design different temperature resistance and
anti-static trays.
Q4: What types of pallets do you produce?
A: We offer JEDEC-compliant IC trays for semiconductor and
electronic component packaging, as well as wafers, chip trays, and
other irregular customized trays for various precision parts.
Q5: What are your tray packaging types?
A: BGA, QFN, QFN: BGA, QFN, QFP, BGA, TQFP, LQFP, SO, TSOP, PLCC,
LC, and many other package forms.
