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Momentive Tse397 B/W LSR Silicone Sealant For Dual Color Molded Parts

    Buy cheap Momentive Tse397 B/W LSR Silicone Sealant For Dual Color Molded Parts from wholesalers
     
    Buy cheap Momentive Tse397 B/W LSR Silicone Sealant For Dual Color Molded Parts from wholesalers
    • Buy cheap Momentive Tse397 B/W LSR Silicone Sealant For Dual Color Molded Parts from wholesalers

    Momentive Tse397 B/W LSR Silicone Sealant For Dual Color Molded Parts

    Ask Lasest Price
    Price : CN¥144.75/pieces >=1 pieces
    Delivery Time : 5-8days
    Payment Terms : T/T,L/C,D/A,D/P,Western Union,MoneyGram
    Supply Ability : 1000Piece
    Certification : TDS,SDS,Rohs
    • Product Details
    • Company Profile

    Momentive Tse397 B/W LSR Silicone Sealant For Dual Color Molded Parts

    Momentive Tse397 B/W LSR for Dual-Color Molded Parts

    Product Properties

    ParameterValue
    ModelTSE397 B (Black)/W (White)
    Base MaterialSilicone Sealant
    Curing TypeSingle-component, Condensation
    Curing Time (25°C)24 hours (full cure)
    Tack-Free Time10 minutes
    Density1.04 g/cm³
    Hardness (Shore A)13-15
    Tensile Strength1.2 MPa
    Elongation at Break300%
    Operating Temperature-50°C to +200°C
    Shelf Life12 months

    Product Overview

    Momentive TSE397 B/W is a single-component, condensation-curing silicone adhesive/sealant. It rapidly cures upon exposure to ambient moisture to form elastic silicone rubber. Designed with flowability, it suits fine filling and coating of electronic components. It provides non-corrosive adhesion to metals (copper, aluminum), plastics, ceramics, and glass without primer pretreatment. Compliant with military standard MIL-A-46146B, it releases low-odor alcohol vapor during curing, ensuring environmental friendliness.

    Special Properties

    1. Non-Corrosive Adhesion: Certified by MIL-A-46146B, zero corrosion on sensitive metals (e.g., copper), ensuring long-term reliability of electronics
    2. Rapid Curing: 10-minute tack-free time and 24-hour full cure, enhancing production efficiency
    3. Environmental Resistance: Operates from -50°C to 200°C, withstanding ozone, chemicals, and harsh conditions
    4. Electrical Insulation: High volume resistivity (1.0×10¹⁵ Ω·cm) and dielectric strength (18 kV/mm), providing insulation for electronic devices
    5. Flowability: Fills micro-gaps (≤0.5 mm), ideal for precision sealing in micro-sensors and PCB traces

    Application Scenarios

    1. Electronic Component Sealing:

      • Conformal coating for PCBs (moisture/dust/corrosion protection), sensor encapsulation, waterproofing of junction boxes
    2. Industrial Bonding:

      • Structural adhesion for metal/glass/plastic/wood (e.g., automotive brackets, instrument housings)
    3. Telecommunication Equipment:

      • Waterproof sealing for 5G base station modules and fiber optic interfaces, enhancing outdoor durability

    FAQ

    1. Who are we?

    We are Shenzhen Huazhisheng New Material Technology Co., Ltd., a professional industrial adhesives and sealants supplier based in China since 2018. we serve global markets: Mainland China (60%), Southeast Asia (20%), North America (10%), and Europe (10%).

    2. What products do you offer?

    we supply high-performance adhesives and sealants from global leaders including:

    Cemedine, Dow Corning, Shin-Etsu, Araldite, and Momentive,etc.

    3. How do you guarantee product quality?

    Quality assurance through:

    Mandatory pre-production samples approval

    Final inspection by QC team before shipment

    International certifications: SGS, UL, FDA, RoHS, REACH

    4. Why choose us over other suppliers?

    Reliable Supply:Authentic products from top manufacturers

    Expert Support:Technical guidance for product selection

    Global Compliance:Certifications meeting target market standards

    Efficient Service:Customized solutions & professional support

    5. What services do you provide?

    Delivery​:EXW/FOB/CIF

    Payment​:USD/EUR/CNY/HKD via T/T, L/C

    Support​:Technical consultation & logistics coordination


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