Warpage Less Than 0.76mm Black Electronic Components IC Chips For
Consistent Performance
Stackable, durable, and dimensionally accurate—our JEDEC trays are
the packaging products trusted by global IC manufacturers.
Developed to cater to the needs of precision-driven electronic
manufacturing, this JEDEC matrix tray is designed to provide
secure, static-safe handling of components during both automated
and manual workflows. The tray is constructed with ESD-safe polymer
material to ensure the safety of components and boasts a
precision-formed pocket layout that offers exceptional dimensional
stability and protection.
Perfect for environments that demand high-throughput performance,
this tray is equipped with alignment features and a consistent
surface design that allows for seamless integration with robotic
arms, vacuum tools, and tray elevators. Whether employed in
component assembly, functional testing, or storage, it guarantees
product integrity at each stage of the process.
Features:
JEDEC-Standard Footprint:
Utilizing a JEDEC-standard footprint makes integration into tray
handlers, feeders, conveyors, and storage systems seamless across
various manufacturing facilities worldwide.
Static-Safe Design:
The use of permanently conductive material prevents static charge
buildup, ensuring a reliable shield for delicate components.
Precision Pocket Arrangement:
By adopting a uniform pocket layout, exact positioning is achieved
for precise pick-up, substantially reducing misalignments and the
risk of handling-related damages.
Automation-Compatible:
Facilitating fast and secure robotic handling in automated
production lines, chamfered corners and pickup zones are designed
for compatibility with automation systems.
Stacking Confidence:
Incorporating built-in interlocks guarantees tray alignment during
vertical stacking, effectively decreasing the likelihood of
shifting or tipping.
Long-Term Durability:
The tray is engineered to withstand rigorous operational demands,
enduring multiple handling cycles and controlled temperature
variations without warping or cracking.
Technical Parameters:
| Brand | Hiner-pack | Outline Line Size | 322.6*135.9*7.62mm |
| Model | HN24068 | Cavity Size | 3*3*0.92mm |
| Package Type | IC Component | Matrix QTY | 14*35=490PCS |
| Material | MPPO | Flatness | MAX 0.76mm |
| Color | Black | Service | Accept OEM, ODM |
| Resistance | 1.0x10e4-1.0x10e11Ω | Certificate | RoHS |
Applications:
This matrix tray is designed for the precise management of
semiconductors, hybrid circuits, MEMS devices, and other compact
components. It is extensively used in high-speed automated assembly
lines, IC testing stations, component programming configurations,
and final packing operations.
The tray's compatibility with standardized equipment facilitates
its integration into logistics systems for seamless cross-site
transportation and extended storage of delicate devices.
Customization:
To match evolving manufacturing needs and unique component
profiles, the tray supports a range of customization options:
Custom Pocket Configurations: Tailor pocket shapes, depths, and
spacing to accommodate components with non-standard or fragile
profiles.
Color-Coded Options: ESD-safe tray materials can be produced in
distinct colors to support visual management strategies or part
classification.
Integrated Molded Identifiers: Add permanent batch numbers,
customer logos, or part codes for easy identification and internal
tracking.
Tailored Mechanical Features: Include guide slots, extended tabs,
or special locator elements to enhance compatibility with
proprietary automation systems.
