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Abrasive flow grinding deburring finishing machine polishing

    Buy cheap Abrasive flow grinding deburring finishing machine polishing from wholesalers
     
    Buy cheap Abrasive flow grinding deburring finishing machine polishing from wholesalers
    • Buy cheap Abrasive flow grinding deburring finishing machine polishing from wholesalers

    Abrasive flow grinding deburring finishing machine polishing

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    Brand Name : Kangdali Power Technology
    Model Number : KDL-262
    Price : 100000-1500000W
    Payment Terms : T/T
    Supply Ability : Annual output 500-1000 units
    Delivery Time : 5-8 week days
    • Product Details
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    Abrasive flow grinding deburring finishing machine polishing

    Abrasive flow grinding deburring finishing machine polishing


    The Two Way Reciprocating Fluid Polishing Machine achieves high-precision surface treatment through abrasive fluid flowing alternately in both directions.Its core principle is to use a hydraulic system to drive abrasive fluid (such as diamond micropowder suspension) to circulate forward and reverse on the surface of the workpiece, combining shearing and rolling to remove microscopic unevenness and achieve nano-level finish (Ra≤0.05μm).The equipment is equipped with an intelligent control system, adjustable reciprocating frequency (10-200Hz) and fluid pressure (0.1-20MPa), and adaptive complex surface polishing.


    Main features and applications:
    Main features: Bidirectional uniform polishing: eliminate unidirectional textures and improve surface consistency;
    Cold processing: fluid buffering avoids thermal damage, suitable for precision parts; Complex structure adaptation: fluid automatically fills deep grooves, inner cavities and other areas that are difficult for machines to reach.
    Application scenarios: Optical components: ultra-smooth processing of laser lenses and infrared windows; Aerospace: deburring and strengthening of engine blade mortise and tenon grooves; Medical implants: biocompatibility processing of titanium alloy joints; Semiconductors: low-damage polishing of silicon carbide wafers.


    Machine Size


    Model

    KDL-262

    Device dimensions

    1500mm*1300mm*2400mm

    Workbench dimensions

    1000mm*1200mm* 280mm

    workbench height

    1050mm

    Abrasive capacity

    30Kg

    Equipment power

    5Kw

    Equipment pressure

    1-14Mpa

    Equipment weight

    2T




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