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Fluid Precision Polishing Equipment-KDL-262 Water Particle Flow Polishing Machine

    Buy cheap Fluid Precision Polishing Equipment-KDL-262 Water Particle Flow Polishing Machine from wholesalers
     
    Buy cheap Fluid Precision Polishing Equipment-KDL-262 Water Particle Flow Polishing Machine from wholesalers
    • Buy cheap Fluid Precision Polishing Equipment-KDL-262 Water Particle Flow Polishing Machine from wholesalers

    Fluid Precision Polishing Equipment-KDL-262 Water Particle Flow Polishing Machine

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    Brand Name : Kangdali Power Technology
    Model Number : KDL-262
    Price : 100000-1500000W
    Payment Terms : T/T
    Supply Ability : Annual output 500-1000 units
    Delivery Time : 5-8 week days
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    Fluid Precision Polishing Equipment-KDL-262 Water Particle Flow Polishing Machine

    Precision water particle flow polishing machine


    The difference between the smank water particle flow polishing machine and the abrasive flow process is that the abrasiveFlow uses semi-solid fluid abrasive as grinding medium, while water particle flow polishing machine makesThe particle liquid abrasive is used as the grinding medium.The particle liquid abrasive has very low viscosity and is very easy to clean. Available at very small apertureAnd is less affected by the length of the aperture.So this process is more suitable Deburring, slag removal, oxide layer removal of complex inner cavity or surface, or small caliberPolishing of pipe fittings.The abrasive does not contain any corrosive, oily or harmful substances to the environment and human body Quality, no dust during processing, environmental protection and safety.


    Main Features And Applications:

    Features: Ultra-precision machining: suitable for hard and brittle materials (ceramics, sapphire) and high-precision metal parts.Cold polishing: no thermal deformation, maintaining the original properties of the material.Adjustable parameters: water pressure (50~300MPa) and abrasive concentration can be freely controlled to adapt to workpieces of different hardness.Applications:Optical components: final polishing of lenses and prisms.Semiconductors: surface treatment of silicon wafers and silicon carbide substrates.Medical implants: biocompatible polishing of artificial joints and dental implants.


    Machine Size


    Model

    KDL-262

    Device dimensions

    1400mm*2400mm*2400mm

    Workbench dimensions

    800mm*500mm*300mm

    workbench height

    1050mm

    Abrasive capacity

    6Kg

    Equipment power

    5Kw

    Equipment pressure

    1-15Mpa

    Equipment weight

    2T


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