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... Complex Programmable Logic Devices Product Description Of 5M2210ZF324C5N 5M2210ZF324C5N 324-Pin FineLine Ball-Grid Array (FBGA) , In System Programmable Chip, the Operating Temperature is 0°C ~ 85°C (TJ). ...
... Transformer 1CT:1CT Surface Mount Detailed Information: APPLICATION-LAN ETHERNET TRANSFORMER/CHOKE NUMBER OF PORTS DUAL PACKAGE BGA BUMP GRID ARRAY PACKAGE HEIGHT MM 11.180 PACKAGE LENGTH MM 14.730 PACKAGE ...
... MODULE XFORMR DUAL GIGABIT SMD Detailed Information: APPLICATION-LAN ETHERNET TRANSFORMER/CHOKE NUMBER OF PORTS DUAL PACKAGE BGA BUMP GRID ARRAY PACKAGE HEIGHT MM 11.180 PACKAGE LENGTH MM 14.730 PACKAGE WID...
... MODULE XFORMR QUAD GIGABIT SMD Detailed Information: APPLICATION-LAN ETHERNET TRANSFORMER/CHOKE NUMBER OF PORTS QUAD PACKAGE BGA BUMP GRID ARRAY PACKAGE HEIGHT MM 11.180 PACKAGE LENGTH MM 28.450 PACKAGE WID...
H5401NL MODULE XFORMR QUAD GIGABIT SMD APPLICATION-LAN ETHERNET TRANSFORMER/CHOKE NUMBER OF PORTS QUAD PACKAGE BGA BUMP GRID ARRAY PACKAGE HEIGHT MM 11.180 PACKAGE LENGTH MM 28.450 PACKAGE WIDTH MM 17.270 POE R...
... 10/100/1000 Base-T Pulse Transformer APPLICATION-LAN ETHERNET TRANSFORMER/CHOKE NUMBER OF PORTS SINGLE PACKAGE BGA BUMP GRID ARRAY PACKAGE HEIGHT MM 11.180 PACKAGE LENGTH MM 7.870 PACKAGE WIDTH MM 17.270 PO...
... applications requiring superior signal integrity and reliable power delivery. These LAN Transformers feature an open frame construction in a BGA (Bump Grid Array) package, optimized for 1000BASE-T data tran...
...800 • Logic Array Blocks (LABs):280 • I/O Pins: 144 • Memory Bits: 18,432 • User Flash Memory: 10,000 • Embedded Multipliers: 16 • Maximum User I/Os: 144 • Core Voltage: 1.2V • Package Type: Fine-pitch Ball ...
... ball grid array; 541 balls; 0.75 mm pitch; 19 mm x 19 mm x 1.33 mm body. Specification Of MCIMX7S5EVM08SD Part Number: MCIMX7S5EVM08SD Number Of ......
..., sinking gold, minimum hole 0.2MM Dielectric: FR-4 Flame retardant performance: V0 Package form: fine pitch ball grid array packaging technology Product Name:...
...Pitch 0.2mm Minimum chip size 0201(0.2x0.1)/0603(0.6x0.3mm) Maximum BGA size 74x74mm BGA ball pitch 1.00mm(minimum), 3.00mm(maximum) BGA ball diameter 0.40mm(minimum), 1.00mm(maximum) QFP lead pitch 0.38mm(m...
ST Hot sale electronic components STM8S207S6 bridge rectifier microcontroller ic chip ball grid array integrated circuit STM8S207S6T6C The STM8S207S6T6C is a microcontroller unit based on a high-performance ARM...
... Max PCB Size 1200mm*400mm Min PCB Thinkness 0.35mm Min Chip Size 01 005 Max BGA Size 74mm*74mm BGA Ball Pitch 1.0-3.00 BGA Ball Diameter 0.2 - 1.0mm QFP Lead Pitch...
... i.MX 8DualXPlus FBGA417 Applications Processors Product Description Of MIMX8DX1AVOFZAC MIMX8DX1AVOFZAC fine-pitch ball grid array package, 417 terminals, 0.8 mm pitch, i.MX 8DualXPlus Applications Processo...
...MIMX8ML6CVNKZAB MIMX8ML6CVNKZAB is i.MX 8M Plus Quad Microprocessor Chip, low profile, fine-pitch, ball grid array package, 548 terminals, 0.5 mm pitch. Specification Of MIMX8ML6CVNKZAB Part Number: MIMX8ML6...
...MIMX8MN5DVPIZAA MIMX8MN5DVPIZAA is i.MX 8M Nano UltraLite Quad Microprocessors IC, thin ball grid array package, 306 terminals, the package is 306-TFBGA (11x11). Specification Of MIMX8MN5DVPIZAA Part Number ...
... MCU 1.4GHz MIMX8MN5CVPIZAA TBGA306 4 Core Microprocessors IC Product Description Of MIMX8MN5CVPIZAA MIMX8MN5CVPIZAA TBGA306, thin ball grid array package, 306 terminals, i.MX 8M Nano UltraLite Quad Applica...
... Real-time integrity checker (RTIC), i.MX 8M Nano SoloLite. The package is LFBGA486, low profile fine-pitch ball grid array. Specification Of MIMX8MN1DVTJZAA Part Number MIMX8MN1DVTJZAA Video/Display feature...