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Bga Ball Grid Array

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Total 1703 products for bga ball grid array Manufacture & Suppliers

Microcontroller MCU MCIMX7S3DVK08SD i.MX 7Solo Processors TFBGA488 1 Core

...®-A7 and Cortex-M4 Cores. Package is TFBGA488, plastic, thin fine-pitch ball grid array. Specification Of MCIMX7S3DVK08SD Part Number MCIMX7S3DVK08SD USB USB 2.0 + PHY (1), USB 2.0 OTG + PHY (1) Voltage - I/...

ShenZhen Mingjiada Electronics Co.,Ltd.
China

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Microprocessors Chip MCIMX7U3CVP06SD LFBGA393 Low Power Microcontroller MCU

...-power. The package is LFBGA393, low profile fine-pitch ball grid array. Specification Of MCIMX7U3CVP06SD Part Number: MCIMX7U3CVP06SD Number Of Cores/Bus Width: 1 Core, 32-Bit Operating Frequency(Max): 650M...

ShenZhen Mingjiada Electronics Co.,Ltd.
China

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1.5GHz LS1027AXE7PQA Dual Core 64Bit Microprocessors Chip 448FBGA Circuit Chip

... enabled. Package is FBGA448, fine-pitch ball grid array package. Product Attributes Of LS1027AXE7PQA Part Number: LS1027AXE7PQA Qualification Tier: Industrial Core Type Arm: Cortex-A72 Number Of ......

ShenZhen Mingjiada Electronics Co.,Ltd.
China

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Microprocessors IC LS1017ASN7PQA FBGA448 Single Core Processors Chip 1.5GHz

...Description Of LS1017ASN7PQA LS1017ASN7PQA is Single Core 1.5GHz Processors Chip, FBGA448, fine-pitch ball grid array package. Two high-speed USB 2.0/3.0 controllers with integrated PHY. Product Attributes ...

ShenZhen Mingjiada Electronics Co.,Ltd.
China

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10Gbps Ethernet Chip AQC113-B1-C Integrated Circuit Chip FCBGA224 Ethernet Controllers

..., Single-port Size: 12 Mm X 14 Mm Pitch: 0.8 Mm Pitch Package: 224-pin, Flip-chip Ball Grid Array (FCBGA)...

ShenZhen Mingjiada Electronics Co.,Ltd.
China

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MT47H64M16HR-25E:H High Performance 45Byte Flash Memory Chips

...t is ideal for a variety of applications. It features a 16M x 16-bit configuration and is available in a 204-pin ball grid array package. It is capable of supporting up to 400 MHz clock speeds and offers hig...

Shenzhen Sai Collie Technology Co., Ltd.
China

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Programmable IC Chip EP1C6Q240I7N - High-Performance FPGA For Embedded Systems

EP1C6Q240I7N Programmable IC Chip Product Parameters: �� Operating Voltage: 3.3V �� Maximum Clock Frequency: 66 MHz �� Programmable I/O Pins: 240 �� Package: Ball Grid Array �� Number of Configurable Logic Cells: 8,...

Shenzhen Sai Collie Technology Co., Ltd.
China

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Programmable IC Chip EP1C4F400C8N 400K Gates 144-Pin TQFP 10.5ns Tpd

... IC Chip Parameters: - Number of Logic Cells: 4,400 - Speed: 133 MHz - Package: 144-Pin Fine Pitch Ball Grid Array - Voltage Supply Range: 1.14V - 1.26V - Maximum Power Consumption: 4.8W - Number of I/O Pins...

Shenzhen Sai Collie Technology Co., Ltd.
China

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XC2C512-10FGG324I Programmable IC Chip FPGA for Complex Logic Applications

... for Complex Logic Applications XC2C512-10FGG324I Programmable IC Chip • Package: 324-Pin FG Fine-Pitch Ball Grid Array • Speed Grade: 10 • Number of Logic Cells: 512 • Number of Macrocells: 8 • Clock Manage...

Shenzhen Sai Collie Technology Co., Ltd.
China

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XC6SLX25-2FTG256I Ic Chip Programming FPGA With Performance Low Power Consumption

... Block RAM: 12.5 Mbits • Power Management Modes: Multiple • Package: Flip-Chip Ball Grid Array (FCBGA) • Speed Grade: -2 • User Flash Memory: 8 Mbits • Maximum Frequency: 435 MHz • Number of Clock Managers: ...

Shenzhen Sai Collie Technology Co., Ltd.
China

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1.27mm Pitch Socket Adapter Female PGA Female Sockets Gold Plating

...Grid Array Adapters Female PGA Sockets Gold Plating 1.27mm Pitch Pin Grid Array Adapters Female PGA Sockets Gold Plating Specifications Insulator Material Thick Glass Epoxy, FR4 Sleeve Brass CuZn36Pb3 (C3600...

SHENZHEN JRKCONN ELECTRONICS CO.,LTD
Guangdong,China

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PEX8648-BB50RBC G Electronics Integrated Circuits PCI Bus Controller PBGA 676 CMOS FCBGA-676

... Code e1 Moisture Sensitivity Level 4 Number of Terminals 676 Package Body Material PLASTIC/EPOXY Package Code BGA Package Shape SQUARE Package Style GRID ARRAY Surface Mount...

J&T ELECTRONICS LTD
Hongkong,China

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Flash memory substrate manufacturer

... represented by the ball grid array packaging chip size packaging came out,IC carrier as a new packaging carrier came into being IC board is developed on the basis of ......

HongRuiXing (Hubei) Electronics Co.,Ltd.
China

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E-W403AAE CMOS Processes CISCO BGA360 Integrated Circuits ICs

... component, possibly a FCTEBGA (Flip Chip Thin Exposed Die Ball Grid Array) package [2]. The specific details about its functionality or application are not mentioned in the search results. Manufacturer: The...

Wisdtech Technology Co.,Limited
Guangdong,China

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Rigid Flexible Automotive PCBA Electronics Supplier SMT Circuit Board Manufacturer

... Aoi Pcb Assembly Assembled Printed Circuit Boards Automated PCB Assembly Automotive Pcb Assembly Automotive Pcba Ball Grid Array Assembly Delivery Time for PCB Layer Prototype Mass Productions (above 30 m2 ...

FASTPCBA Co., Ltd.
China

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Quick Turn Pcba Dfm Analysis Pcb Prototype Assembly Service

DFM Analysis Smart Electronics No Minimum Order PCB Soldering Service Quick details: Advanced Circuits Assembly Ball Grid Array Assembly Dc Controller Pcb Board Assembly Medical Components Assembly Full Turnkey...

Shenzhen Yideyi Technology Limited Company
China

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0.25mm Single Sided 1 Layer PCB Car Audio HASL Washing Machine

... chip size: 0201 (0.2x0.1)/0603 (0.6 x 0.3mm) Maximum BGA size: 74x74mm BGA ball pitch: 1.00mm (minimum), 3.00mm (maximum) BGA ball diameter: 0.40mm (minimum), 1.00mm (maximum) QFP lead pitch: 0.38mm (minimu...

Shenzhen Senyan Circuit Co., Ltd.
Guangdong,China

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1.6mm 2 Layers PCB 0.5 Ounce To 6 Ounce 0.25mm

... chip size: 0201 (0.2x0.1)/0603 (0.6 x 0.3mm) Maximum BGA size: 74x74mm BGA ball pitch: 1.00mm (minimum), 3.00mm (maximum) BGA ball diameter: 0.40mm (minimum), 1.00mm (maximum) QFP lead pitch: 0.38mm (minimu...

Shenzhen Senyan Circuit Co., Ltd.
Guangdong,China

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SMT Prototype 2 Layers PCB 0.5 To 6oz 0.25mm OEM

... chip size: 0201 (0.2x0.1)/0603 (0.6 x 0.3mm) Maximum BGA size: 74x74mm BGA ball pitch: 1.00mm (minimum), 3.00mm (maximum) BGA ball diameter: 0.40mm (minimum), 1.00mm (maximum) QFP lead pitch: 0.38mm (minimu...

Shenzhen Senyan Circuit Co., Ltd.
Guangdong,China

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HASL-F 2 Sided PCB

... chip size: 0201 (0.2x0.1)/0603 (0.6 x 0.3mm) Maximum BGA size: 74x74mm BGA ball pitch: 1.00mm (minimum), 3.00mm (maximum) BGA ball diameter: 0.40mm (minimum), 1.00mm (maximum) QFP lead pitch: 0.38mm (minimu...

Shenzhen Senyan Circuit Co., Ltd.
Guangdong,China

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