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Total 43059 products for bga ic package Manufacture & Suppliers

Slip Layer Board , Low Humidity Electronics Industry Dry Box Led Display For Semiconductors, IC packages

Slip Layer Board , Low Humidity Electronics Industry Dry Box Led Display Applications: Its typical applications include the prevention and protection against all types of oxidation (rust), the prevention of the...

SUPER SECURITY LTD
Jiangsu,China

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Standard Custom JEDEC Trays For Secure IC Packaging Mett Special Requirements

*, *::before, *::after {box-sizing: border-box;}* {margin: 0;}html, body {height: 100%;}body {line-height: 1.5;-webkit-font-smoothing: antialiased;}img, picture, video, canvas, svg {display: block;max-width: 10...

Shenzhen Hiner Technology Co., Ltd.
Guangdong,China

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Durable IC Packaging Tray With Personalized Anti Static ESD JEDEC Shippings

*, *::before, *::after {box-sizing: border-box;}* {margin: 0;}html, body {height: 100%;}body {line-height: 1.5;-webkit-font-smoothing: antialiased;}p[style^="text-align"] img{display:inline-block}input, button,...

Shenzhen Hiner Technology Co., Ltd.
Guangdong,China

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Iphone IC Chip STB601A05 64Bit Power Management IC BGA Package

Iphone IC Chip STB601A05 64Bit Power Management IC BGA Package Product Description Of STB601A05 STB601A05 is Power Management IC, package is BGA, Suitable for Iphone 14pro max. Specification Of STB601A05 Part N...

ShenZhen Mingjiada Electronics Co.,Ltd.
China

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Electronic Components Chip IC Package SOIC-8 AD8616ARZ

Good quality Electronic Component provider from China��GS Electronics, Product Model: AD8616ARZ Product Description: The AD8616ARZ is a high-performance, low-noise, low-power operational amplifier designed for ...

Shenzhen GS Electronic Technology Co., Ltd. CN
Guangdong,China

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Iphone IC Chip APL1096/343S00474 Power Management Circuit BGA Package IC Chip

...IC Chip APL1096/343S00474 Power Management Circuit BGA Package IC Chip Product Description Of APL1096/343S00474 APL1096/343S00474 is IC Chip - Power Management Circuit, BGA Package. Specification Of APL1...

ShenZhen Mingjiada Electronics Co.,Ltd.
China

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Audio Chip CS42L83A-CWZR Iphone IC Chip BGA Package Apple IMac IC Chip

...IC Chip BGA Package Apple IMac IC Chip Product Description Of CS42L83A-CWZR CS42L83A-CWZR is Apple IMac/Audio Chip - Iphone IC Chip, package is BGA. Specification Of CS42L83A-CWZR Part Number: CS42L83A-CWZR...

ShenZhen Mingjiada Electronics Co.,Ltd.
China

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Iphone IC Chip BCM47764KUBG GNSS Receiver BGA Package Apple Watch 7 IC Chip

...IC Chip BCM47764KUBG GNSS Receiver BGA Package Apple Watch 7 IC Chip Product Description Of BCM47764KUBG BCM47764KUBG is Apple Watch 7 - GNSS Receiver, package is BGA. Specification Of BCM47764KUBG Part Num...

ShenZhen Mingjiada Electronics Co.,Ltd.
China

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Audio Amplifier IC 338S00537 Iphone IC Chip BGA Package Audio Chip

... max. Specification Of 338S00537 Part Number: 338S00537 Package: BGA Applications: Suitable for Iphone 14pro max Type: Audio Amplifier Chip Applications Of 338S00537 Iphone 14pro max Product ......

ShenZhen Mingjiada Electronics Co.,Ltd.
China

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High Performance Iphone IC Chip 338S00638 Iphone Watch 7/W3 Wireless Chip BGA Package

...IC Chip 338S00638 Iphone Watch 7/W3 Wireless Chip BGA Package Product Description Of 338S00638 338S00638 is high performance Iphone Watch 7/W3 wireless chip Package is BGA. Specification Of 338S00638 Part Nu...

ShenZhen Mingjiada Electronics Co.,Ltd.
China

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Iphone IC Chip 339S00763 WiFi BT Module BGA Package Electronic Integrated Circuits

...IC Chip 339S00763 WiFi BT Module BGA Package Electronic Integrated Circuits Product Description Of 339S00763 339S00763 BGA package, Iphone IC Chip - WiFi BT Module. Specification Of 339S00763 Part Number: 3...

ShenZhen Mingjiada Electronics Co.,Ltd.
China

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Ultra Wideband Chip 338S00642 Iphone IC Chip BGA Package Apple Watch 7 Circuit Chip

...IC Chip BGA Package Apple Watch 7 Circuit Chip Product Description Of 338S00642 338S00642 Iphone IC Chip, BGA package, Apple Watch 7 - Ultra Wideband Chip. Specification Of 338S00642 Part Number: 338S00642 ...

ShenZhen Mingjiada Electronics Co.,Ltd.
China

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FCBGA/BGA package substrate manufacture

...package, FCCSP package, NandFlash memory substrate,Semi Package,Semiconductors ,Semiconductor,IC package,IC substrate,uMCP,MCP,UFS,CMOS,MEMS,IC assembly,Storage IC substrage;Smart phone -.Lap top (Ultra thin...

HongRuiXing (Hubei) Electronics Co.,Ltd.
China

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FCBGA/BGA package substrate manufacture

...package, FCCSP package, NandFlash memory substrate,Semi Package,Semiconductors ,Semiconductor,IC package,IC substrate,uMCP,MCP,UFS,CMOS,MEMS,IC assembly,Storage IC substrage;Smart phone -.Lap top (Ultra thin...

HongRuiXing (Hubei) Electronics Co.,Ltd.
China

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Power Management IC APL1097/343S00475 Iphone IC Chip BGA Power Management Circuit

...IC APL1097/343S00475 Iphone IC Chip BGA Power Management Circuit Product Description Of APL1097/343S00475 APL1097/343S00475 is Power Management IC - Power Management Circuit, the package is BGA. Specificati...

ShenZhen Mingjiada Electronics Co.,Ltd.
China

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Iphone IC Chip APL109C/343S00554 Iphone Macbook AIR/Performance Manager IC

...IC Chip APL109C/343S00554 Iphone Macbook AIR/Performance Manager IC Product Description Of APL109C/343S00554 APL109C/343S00554 is Iphone ic chip,Iphone Macbook AIR/performance manager IC.Package is BGA. Spec...

ShenZhen Mingjiada Electronics Co.,Ltd.
China

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ADV7842KBCZ-5P ADV8003KBCZ-8 ADV8003KBCZ-8B ADI IC BGA Package

...ICs) ADV7842KBCZ-5P ADV8003KBCZ-8 ADV8003KBCZ-8B ADI BGA IC Integrated Circuits Components Specification :ADV7842KBCZ-5P ADV8003KBCZ-8 ADV8003KBCZ-8B Category Integrated Circuits (ICs) Product Name Electroni...

Angel Technology Electronics Co
Hongkong,China

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Ethernet IC VSC7415XMT 6-Port SGMII Gigabit Ethernet Switch BGA-324 Telecom IC

... and Gigabit Ethernet PHYs. Specification Of VSC7415XMT Series Serval™-T Mounting Type Surface Mount Package / Case 324-BGA Supplier Device Package 324-BGA (19x19) Features Of VSC7415XMT IEEE802.1Q switch wi...

ShenZhen Mingjiada Electronics Co.,Ltd.
China

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2-6 Layer BT taw material BGA packaging Substrate For semiconductor assembly

Application:IC substrate package,Memory package,Memory packaging substrate,Dram/SSD/LPDDR package substrate,Semiconductor package;IC package,Semiconductor package,Memory electronics,NAND/Flash memory; Spec.of s...

HongRuiXing (Hubei) Electronics Co.,Ltd.
China

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Black Chip Die BGA QFN ESD Packaging Tray For Optoelectronic Devices Tray

...static electricity and thus protect electronic products from static damage. JEDEC trays are also a common plastic packaging material used for packaging, transporting and displaying a variety of products, suc...

Shenzhen Hiner Technology Co., Ltd.
Guangdong,China

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