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Total 43059 products for bga ic package Manufacture & Suppliers

TPS62400DRCR 4.5V-17V Input 2A Step-Down Power Management IC Package Case 10-VFDFN

...IC Features: • High Efficiency: Up to 95% • Input Voltage Range: 2.5V to 5.5V • Output Voltage Range: 0.9V to VIN • Output Current: Up to 2.3A • High Frequency Switching: 2MHz • External Compensation • Over ...

Shenzhen Sai Collie Technology Co., Ltd.
China

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Fully Automated HAST Chamber with 100%RH Humidity Range and 0.1ºC Resolution Accuracy for IC Package Testing

... resistance test equipment. For example, test the absorption rate of printed circuit board (PCB or FPC), the moisture resistance of semiconductor packaging, the...

Dongguan Youbi Test Equipment Co.,Ltd
Guangdong,China

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180°C High Temp JEDEC Tray with ESD Protection for Semiconductor IC Packaging

High Temp ESD JEDEC Tray for AI Chips Packaging This JEDEC tray is specially designed for high temperature semiconductor processes, such as baking, burn-in, and AI chip packaging. It ensures dimensional stabili...

Shenzhen Hiner Technology Co., Ltd.
Guangdong,China

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Silver Alloy Bonding Wire High Purity For IC Packaging And LED Equipment

High Purity Silver Alloy Bonding Wire The Superior Performance Solution for IC Packaging Superior Material Composition This remarkable material is exquisitely crafted from high - purity gold/silver material tha...

SICHUAN WINNER SPECIAL ELECTRONIC MATERIALS CO., LTD.
China

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High Strength Palladium Coated Copper Wire With 4N High Purity Copper Material For IC Packaging

High-Strength Palladium Coated Copper Wire with 4N High-Purity Copper Material for IC Packaging Material and Composition of the Bonding Wire Our gold - plated/palladium bonding wire is made from 4N high - purit...

SICHUAN WINNER SPECIAL ELECTRONIC MATERIALS CO., LTD.
China

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Ultra Fine 0.01mm Palladium Coated Copper Wire With Low Curvature And High Toughness For IC Packaging

Ultra Fine 0.01mm Palladium Coated Copper Wire with Low Curvature and High Toughness for IC Packaging Palladium Coated Copper (PCC) bonding wire was developed and has now become the most dominant bonding materi...

SICHUAN WINNER SPECIAL ELECTRONIC MATERIALS CO., LTD.
China

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Antistatic Waffle Pack Chip Trays IC Packaging Protecting CSP

Antistatic Waffle Pack Chip Trays IC Packaging Protecting CSP Anti-Static Chip Tray With Digital Array Specially Designed For The Cavity The use of anti-static tray storage electronic components, can effectivel...

Shenzhen Hiner Technology Co., Ltd.
Guangdong,China

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Socket Type Anti Static IC Packaging Tray High Temperature Resistance

Socket Type Anti Static IC Packaging Tray High Temperature Resistance Specially Customized Socket Type Anti-Static Tray For Electronic Components For electronic products in the process of transportation and pac...

Shenzhen Hiner Technology Co., Ltd.
Guangdong,China

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Anti Static IC Packaging Trays High Level Dustless Cleaning

Anti Static IC Packaging Trays High Level Dustless Cleaning Anti-Static Tray Design And Production Integration Of Chinese Manufacturers Hiner pack designs trays for any type of component, module, MEMS, or devic...

Shenzhen Hiner Technology Co., Ltd.
Guangdong,China

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Custom Black High Temperature JEDEC Trays For IC Packaging In PPE Raw Material

Custom Black High Temperature JEDEC Trays For IC Packaging In PPE Raw Material Features: Compatibility: The JEDEC trays have been specifically designed and manufactured to fit seamlessly with standard handling ...

Shenzhen Hiner Technology Co., Ltd.
Guangdong,China

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Efficient 1054110104 Crystal Ic Package Type Smd

Product Description: Crystal IC is an advanced integrated crystal oscillator designed to provide exceptional stability and accuracy. It features a height of 1.2mm, a frequency aging of ��3ppm/year, an output loa...

Shenzhen Xinyuanpeng Technology Co., Ltd.
China

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Chip Factory Ic Packaging Testing EMMC 5.1 Embedded Memory 4gb 8gb 16gb 32gb 64gb

Chip Factory IC Packaging Testing EMMC 5.1 Embedded Memory 4gb 8gb 16gb 32gb 64gb ��15 + Years Flash Packaging Testing Manufacturer�� Deeply Customized Embedded Memory Chip Description eMMC is a kind of flash sto...

Shenzhen Jinfly Semiconductor Corporation
China

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MAX17224ELT+T High-Efficiency Low-Power Power Management IC Package Case 6-WDFN

MAX17224ELT+T Power Management IC Features: �� Low-Dropout (LDO) Linear Regulators with High PSRR �� Low Quiescent Current: 330��A �� Low Shutdown Current: 0.1��A �� Up to 500mA of Output Current �� Adjustable Output ...

Shenzhen Sai Collie Technology Co., Ltd.
China

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MAX8686ETL+T High-Efficiency Dual-Output Power Management IC Package Case 40-WFQFN

MAX8686ETL+T The MAX8686ETL+T is a highly integrated power management IC for space-constrained, energy-efficient, high-performance battery-powered applications. It integrates a wide-input buck-boost DC-DC conve...

Shenzhen Sai Collie Technology Co., Ltd.
China

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HI3536RV100 HI3516DV300 HI3559AV100 HI3559RV200 BGA ic components PICS BOM Module Mcu Ic Chip Integrated Circuits

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ShenZhen QingFengYuan Technology Co.,Ltd.
China

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500C Hot Air High Temperature Drying Oven For IC Packaging With PID Control

High Temperature Drying Oven.pdf 500C Hot Air High Temperature Drying Oven for IC Packaging with PID Control Product Description High Temperature Drying Oven can provide a stable test space for pre-heating, dry...

ASLi (CHINA) TEST EQUIPMENT CO., LTD
China

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LT8610ABIMSE#TRPBF Switching Voltage Regulator Ic Package PMIC MSOP16

LT8610ABIMSE#TRPBF Package MSOP16 Power Management (PMIC) Voltage Regulator - DC-DC Switching Voltage Regulator 100% PRODUCT DESCRIPTION Part number LT8610ABIMSE#TRPBF is manufactured by ADI and distributed by ...

STJK(HK) ELECTRONICS CO.,LIMITED
China

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500C Hot Air High Temperature Drying Oven For IC Packaging With PID Control

High Temperature Drying Oven.pdf 500C Hot Air High Temperature Drying Oven for IC Packaging with PID Control Product Description High Temperature Drying Oven can provide a stable test space for pre-heating, dry...

ASLi (CHINA) TEST EQUIPMENT CO., LTD
China

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YJJ SS551AT SS351AT SS451A Full-Range Hall Effect Digital Position Sensor Ics Packaging type SOT-89B

... Sensor Ics Features: SS551AT Hall Effect digital position sensor IC, full polarity, low sensitivity, SOT-89B, 1000 units/pocket tape and reel. The SS551AT series of low-cost bipolar Hall effect sensor ics a...

ShenzhenYijiajie Electronic Co., Ltd.
Guangdong,China

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Texas Instruments ISO7241 Electronic bga Ic Components Chip Circuitos integratedados Circuitos TI-ISO7241

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ShenZhen QingFengYuan Technology Co.,Ltd.
China

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Bga Ic Package

Total 43059 products for bga ic package Manufacture & Suppliers

TPS62400DRCR 4.5V-17V Input 2A Step-Down Power Management IC Package Case 10-VFDFN

Fully Automated HAST Chamber with 100%RH Humidity Range and 0.1ºC Resolution Accuracy for IC Package Testing

180°C High Temp JEDEC Tray with ESD Protection for Semiconductor IC Packaging

Silver Alloy Bonding Wire High Purity For IC Packaging And LED Equipment

High Strength Palladium Coated Copper Wire With 4N High Purity Copper Material For IC Packaging

Ultra Fine 0.01mm Palladium Coated Copper Wire With Low Curvature And High Toughness For IC Packaging

Antistatic Waffle Pack Chip Trays IC Packaging Protecting CSP

Socket Type Anti Static IC Packaging Tray High Temperature Resistance

Anti Static IC Packaging Trays High Level Dustless Cleaning

Custom Black High Temperature JEDEC Trays For IC Packaging In PPE Raw Material

Efficient 1054110104 Crystal Ic Package Type Smd

Chip Factory Ic Packaging Testing EMMC 5.1 Embedded Memory 4gb 8gb 16gb 32gb 64gb

MAX17224ELT+T High-Efficiency Low-Power Power Management IC Package Case 6-WDFN

MAX8686ETL+T High-Efficiency Dual-Output Power Management IC Package Case 40-WFQFN

HI3536RV100 HI3516DV300 HI3559AV100 HI3559RV200 BGA ic components PICS BOM Module Mcu Ic Chip Integrated Circuits

500C Hot Air High Temperature Drying Oven For IC Packaging With PID Control

LT8610ABIMSE#TRPBF Switching Voltage Regulator Ic Package PMIC MSOP16

500C Hot Air High Temperature Drying Oven For IC Packaging With PID Control

YJJ SS551AT SS351AT SS451A Full-Range Hall Effect Digital Position Sensor Ics Packaging type SOT-89B

Texas Instruments ISO7241 Electronic bga Ic Components Chip Circuitos integratedados Circuitos TI-ISO7241