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Total 43059 products for bga ic package Manufacture & Suppliers

Unicomp AX9100max X-ray Inspection System For Flip-Chip BGA (FCBGA) Packaging Analysis

... a broad range of industries, including: BGA/CSP/Flip Chip packaging LED & optoelectronic components Fuse & diode manufacturing PCB & semiconductor assembly Battery production Small metal castings Electronic...

Unicomp Technology
Guangdong,China

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BGA type packaging memory substrate manufacture

...IC Substrate pcb BGA package is one of the semiconductor package types on memory electronics manufacture,It required the substrate ball high quality guarantee,It is also one of types of the semiconductor pac...

HongRuiXing (Hubei) Electronics Co.,Ltd.
China

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STM32F439NIH6 Embedded Microcontroller MCU 2MB Flash BGA-216 Package

...BGA-216 Package Product Description Of STM32F439NIH6 STM32F439NIH6 is a 32-bit RISC processor that features exceptional code-efficiency, delivering the high-performance expected from an Arm core in the memor...

ShenZhen Mingjiada Electronics Co.,Ltd.
China

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High Reliability Automotive Grade EMMC5.1 with 5 Years Warranty Storage Component 64GB 128GB 256GB BGA 153 Package

High Reliability Automotive Grade EMMC5.1 with 5 Years Warranty Storage Component 64GB 128GB 256GB BGA 153 Package Available in 64GB, 128GB, and 256GB capacities with BGA 153 package, this automotive-grade eMMC...

China Chips Star Semiconductor Co., Ltd.
China

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IC PCB storage dry cabinet / digital dry cabinet for emiconductor IC Packages BGA PGA,IC PCB SMT PBGA

IC PCB storage dry cabinet / digital dry cabinet high performance Applications: DC82403LE is equipped with a precise LED control, which has ±3%RH precision tolerance. It is especially designed with fully automa...

SUPER SECURITY LTD
Jiangsu,China

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CSR1000A04-IQQM-R CSR8311A08 CSR8610A04-IBBC-R CSR8610B04-IBBC-R CSR QUALCOMM QFN BGA IC Chips

...ICs) CSR1000A04-IQQM-R CSR8311A08 CSR8610A04-IBBC-R CSR8610B04-IBBC-R CSR QUALCOMM QFN BGA Integrated Circuits Components Specification :CSR1000A04-IQQM-R CSR8311A08 CSR8610A04-IBBC-R CSR8610B04-IBBC-R Categ...

HK NeoChip Technology Limited
China

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Precision 0.15mm IC Packaging Substrate Fabrication V2 Flame Retardant

...IC Packaging Substrate fabrication Application:bank card,IC card,SIM card,Dram memory electronics,Sd card,memory card,all kind of memor ycard,MicroSD,MicroTF card,Flash memory card,DDR,Semi Package,Semicondu...

HongRuiXing (Hubei) Electronics Co.,Ltd.
China

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Precision 0.15mm IC Package Substrate Fabrication V2 Flame Retardant

...IC Packaging Substrate fabrication Application:bank card,IC card,SIM card,Dram memory electronics,Sd card,memory card,all kind of memor ycard,MicroSD,MicroTF card,Flash memory card,DDR,Semi Package,Semicondu...

HongRuiXing (Hubei) Electronics Co.,Ltd.
China

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Customizable coreless IC Package Substrate with 0.09mm Thickness

...IC Package Substrate production supporting Application:Dram memory electronics,Sd card,memory card,all kind of memor ycard,MicroSD,MicroTF card,Flash memory card,DDR,Semi Package,Semiconductors ,Semiconducto...

HongRuiXing (Hubei) Electronics Co.,Ltd.
China

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ENEPIG plating ic package substrate manufacture

...Package,Semiconductors ,Semiconductor,IC package,IC substrate,uMCP,MCP,UFS,CMOS,MEMS,IC assembly,Storage IC substrage;Smart phone -.Lap top (Ultra thin notebook / Tablet PC) -.Portable game device-.Power/Ana...

HongRuiXing (Hubei) Electronics Co.,Ltd.
China

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Tenting process 25um DRAM IC package Substrate BT material 4 Layer

...Package,Semiconductors ,Semiconductor,IC package,IC substrate,uMCP,MCP,UFS,CMOS,MEMS,IC assembly,Storage IC substrage;Smart phone -.Lap top (Ultra thin notebook / Tablet PC) -.Portable game device-.Power/Ana...

HongRuiXing (Hubei) Electronics Co.,Ltd.
China

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Precision 0.15mm IC Packaging Substrate fabrication

...IC card,SIM card,Dram memory electronics,Sd card,memory card,all kind of memor ycard,MicroSD,MicroTF card,Flash memory card,DDR,Semi Package,Semiconductors ,Semiconductor,IC package,IC substrate,MCP,UFS,CMOS...

HongRuiXing (Hubei) Electronics Co.,Ltd.
China

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Precision 0.15mm IC Packaging Substrate Fabrication 4 Layer Electrolytic Foil Processing

...IC card,SIM card,Dram memory electronics,Sd card,memory card,all kind of memor ycard,MicroSD,MicroTF card,Flash memory card,DDR,Semi Package,Semiconductors ,Semiconductor,IC package,IC substrate,MCP,UFS,CMOS...

HongRuiXing (Hubei) Electronics Co.,Ltd.
China

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Unicomp AX8500 110kV 5um 2.5D X-ray for Electronics SMT PCBA BGA IC soldering quality check

Unicomp AX8500 110kV 5um 2.5D X-ray for Electronics SMT PCBA BGA IC soldering quality check Technical Parameters and Specifications System Summary Footprint 1370(W)��1300(D)��1700(H)mm Machine Weight 1600 kg Powe...

Unicomp Technology
Guangdong,China

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Unicomp close tube AX7900 X-ray system with FPD tilting view for SMT EMS BGA IC Cable & wires qualtiy inspection

Unicomp close tube AX7900 X-ray system with FPD tilting view for SMT EMS BGA IC Cable & wires qualtiy inspection Specifications of AX7900 X-ray system: System Summary Footprint 1200(W)��1200(D)��1500(H)mm Machine...

Unicomp Technology
Guangdong,China

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Hitachi BT IC Package Substrate production supporting

...Semi Package,Semiconductors ,Semiconductor,IC package,IC substrate,MCP,UFS,CMOS,MEMS,IC assembly,Storage IC substrage;Memory card,MicroSD card,MicroTF card,Memory card;Semiconductor,IC package,IC assembly,Se...

HongRuiXing (Hubei) Electronics Co.,Ltd.
China

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JEDEC Standard eMCP IC Package Substrate Fabrication

...,IC package,IC assembly,Semi packaging,IC substrate,wearable electronics,Nand/Flash memory spackage; Spec.of Substrate production: Mini.Line space/width:1mil (......

HongRuiXing (Hubei) Electronics Co.,Ltd.
China

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vacuum Suction Pen Tools Alternative SMD BGA IC Pick Up Tools wholesale

vacuum Suction Pen Tools Alternative SMD BGA IC Pick Up Tools wholesale whatsapp:+8613424013606,skype:sensenhenhao,wechat:JoyLY0322 IC Pick Up Tools Specifications: -100% new with high quality. -Low-cost altern...

Meraif Limited/Shenzhen meraif import and export co., ltd
Guangdong,China

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NAND/FLASH Memory Ic packaging Substrate

...Package,Semiconductors ,Semiconductor,IC package,IC substrate,uMCP,MCP,UFS,CMOS,MEMS,IC assembly,Storage IC substrage;Smart phone -.Lap top (Ultra thin notebook / Tablet PC) -.Portable game device-.Power/Ana...

HongRuiXing (Hubei) Electronics Co.,Ltd.
China

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line/space 25um FBGA Package Substrate For Memory ic packaging

...:Semi Package,Semiconductors ,Semiconductor,IC package,IC substrate,uMCP,MCP,UFS,CMOS,MEMS,IC assembly,Storage IC substrage;Smart phone -.Lap top (Ultra thin notebook / Tablet PC) -.Portable game device-.Pow...

HongRuiXing (Hubei) Electronics Co.,Ltd.
China

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