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Total 43059 products for bga ic package Manufacture & Suppliers

XQVP1202-1MSIVSRC2197 AI Processor Chip Versal Premium Adaptive SoC BGA-2197 Package

XQVP1202-1MSIVSRC2197 AI Processor Chip Versal Premium Adaptive SoC BGA-2197 Package [MJD Advantage] + 15 years experience for electronic components + Secure Ordering + Excellent Feedback + Delivery Date Guaran...

ShenZhen Mingjiada Electronics Co.,Ltd.
China

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SA230 AI Processor Chip AI SoC Chip with 1.0 TOPS for Automotive Electronic in BGA-232 Package

SA230 AI Processor Chip AI SoC Chip For Automotive Electronic In BGA-232 Package Product Description Of SA230 SA230 AI SoC provides up to 1.0 TOPS AI computing power, supports 4K encoding and various algorithms...

ShenZhen Mingjiada Electronics Co.,Ltd.
China

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SA210 AI Processor Chip with 1.2 TOPS AI Computing Power in BGA-335 Package for Automotive Applications

SA210 AI Processor Chip High-Performance Automotive AI Chip In BGA-335 Package Product Description Of SA210 SA210 AI SoC is a high-performance automotive AI chip. It integrates the self-developed NPU, providing...

ShenZhen Mingjiada Electronics Co.,Ltd.
China

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SA206 AI Processor Chip with 0.6 / 1.2 TOPS NPU and Dual-core CPU for Automotive AI SoC in BGA-385 Package

SA206 AI Processor Chip Integrate Automotive AI SoC Chip In BGA-385 Package Product Description Of SA206 The SA206 AI SoC integrates self-developed NPU, providing 0.6 / 1.2 TOPS AI computing power. It supports ...

ShenZhen Mingjiada Electronics Co.,Ltd.
China

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Auto SMT Dry Cabinet for BGA IC Dry Box Humodity Moisture-Proof Box

Auto SMT Dry Cabinet for BGA IC Dry Box Humodity Moisture-Proof Box CWDC-1428B Function: Humidity in the air may have negative effect on the operation of any precision instruments and equipment. Dry cabinet can...

Shenzhen SMTfly Electronic Equipment Manufactory Ltd
Chongqing,China

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Auto SMT Dry Cabinet for BGA IC SMT SMD Wafer MSD Warranty for 1 Year

Auto SMT Dry Cabinet For BGA IC SMT SMD Wafer MSD warranty for one year CWDC-1428B Function: Humidity in the air may have negative effect on the operation of any precision instruments and equipment. Dry cabinet...

Shenzhen SMTfly Electronic Equipment Manufactory Ltd
Chongqing,China

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2 Layers IC Package Substrate Palladium Gold COF Electric Annoyed Liquid Crystal Drive

2 layers of COF,electric annoyed liquid crystal drive,IC Package Substrate,palladium gold,ic package,pcb production Product Description Product area: electric annoyed liquid crystal drive Number of layers: 2 la...

Shenzhen Chaosheng Electronic Technology Co.,Ltd
Hong Kong,China

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Analog Devices ADIS16475-2BMLZ Precision MEMS IMU with 2621440deg/s/LSB in Miniature BGA-44 Package for Wide Temperature Range -40℃~105℃

...BGA-44 Precision, Miniature MEMs IMU Precision 2621440deg/s/LSB 262144000LSB/g SPI 3V 3.6V New Origianl 100% New Original Brand Lead time: 1-2working days( enough in stock) Product Pictures Related Product L...

Dongguan Blueto Electronics&Communication Co., Ltd
Guangdong,China

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IC Packaging BGA IC Type JEDEC IC Trays Black MPPO PPE ABS PEI IDP Material

*, *::before, *::after {box-sizing: border-box;}* {margin: 0;}html, body {height: 100%;}body {line-height: 1.5;-webkit-font-smoothing: antialiased;}img, picture, video, canvas, svg {display: block;max-width: 10...

Shenzhen Hiner Technology Co., Ltd.
Guangdong,China

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ESD Plastic JEDEC Standard Matrix Tray For IC Packaging

... is the packaging tray used by the enterprise for its chip packaging test. Because the IC chip is small and thin, the enterprise will generally take external protection to avoid scratches and damage. JEDEC M...

Shenzhen Hiner Technology Co., Ltd.
Guangdong,China

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China Unicomp AX8200 BGA/IC/PCB Closed X-Ray Machine with factory price

Smt X-ray Closed 5g Chipset Electronic Connector Module Inspection Machine AX8200 The AX-8200 machine is designed to provide high resolution x-ray imaging primarily for the electronics industry. This versatile ...

Unicomp Technology
Guangdong,China

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High Storage Efficiency Lightweight JEDEC Tray with ESD Protection for IC Packaging

...IC Packaging Designed for high-level semiconductor cleanroom environments, this tray minimizes contamination and ensures IC integrity. Key Features/ Benefits Lower cost solution Lightweight design High stora...

Shenzhen Hiner Technology Co., Ltd.
Guangdong,China

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ADP1613ARMZ-R7 Power Management ICs Boost SEPIC Switching Regulator IC Package 8-TSSOP 8-MSOP63

ADP1613ARMZ-R7 Power Management ICs Boost SEPIC Switching Regulator IC Package 8-TSSOP 8-MSOP Product Status Active Function Step-Up Output Configuration Positive Topology Boost, SEPIC Output Type ......

Shenzhen Sai Collie Technology Co., Ltd.
China

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MAX8815AETB+T Power Management ICs Boost Switching Regulator IC Package 10-WFDFN Exposed Pad

MAX8815AETB+T Power Management ICs Boost Switching Regulator IC Package 10-WFDFN Exposed Pad Product Status Active Function Step-Up Output Configuration Positive Topology Boost Output ......

Shenzhen Sai Collie Technology Co., Ltd.
China

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Universal JEDEC Matrix Tray Stackable For IC Packaging Industry

Universal JEDEC Matrix Tray Stackable For IC Packaging Industry Offering both standard and custom configurations, our JEDEC trays meet a wide range of semiconductor packaging needs. This JEDEC matrix tray is cr...

Shenzhen Hiner Technology Co., Ltd.
Guangdong,China

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Injection JEDEC Tray With Custom Cavity Design For IC Packaging And Shipping

Injection JEDEC Tray With Custom Cavity Design For IC Packaging And Shipping Need packaging that integrates into your existing process? Our JEDEC trays are automation-ready and tailor-made for your workflow. Th...

Shenzhen Hiner Technology Co., Ltd.
Guangdong,China

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Anti-Static And Automation Ready Custom JEDEC Tray For IC Packaging

Anti-Static And Automation Ready Custom JEDEC Tray For IC Packaging Protect and transport your ICs with confidence��our JEDEC trays meet industry standards and adapt to your exact chip form factor. This JEDEC-co...

Shenzhen Hiner Technology Co., Ltd.
Guangdong,China

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ODM PCB Module ESD Black IC Packaging Trays Heat-Resistant

ODM PCB Module ESD Black IC Packaging Trays Heat-Resistant Go beyond off-the-shelf��get JEDEC trays engineered for your chip��s shape, height, and transportation needs. While the JEDEC Tray is widely used in the ...

Shenzhen Hiner Technology Co., Ltd.
Guangdong,China

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Communication IC Package Substrate Aluminum Base ENIG Surface Finishing

... line spacing 0.009/0.009mil, nickel palladium Quantities range from prototype to volume production. 100% E-Test Packing: vacuum packaging + desiccant +...

Shenzhen Chaosheng Electronic Technology Co.,Ltd
Hong Kong,China

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Bga Ic Package

Total 43059 products for bga ic package Manufacture & Suppliers

XQVP1202-1MSIVSRC2197 AI Processor Chip Versal Premium Adaptive SoC BGA-2197 Package

SA230 AI Processor Chip AI SoC Chip with 1.0 TOPS for Automotive Electronic in BGA-232 Package

SA210 AI Processor Chip with 1.2 TOPS AI Computing Power in BGA-335 Package for Automotive Applications

SA206 AI Processor Chip with 0.6 / 1.2 TOPS NPU and Dual-core CPU for Automotive AI SoC in BGA-385 Package

Auto SMT Dry Cabinet for BGA IC Dry Box Humodity Moisture-Proof Box

Auto SMT Dry Cabinet for BGA IC SMT SMD Wafer MSD Warranty for 1 Year

2 Layers IC Package Substrate Palladium Gold COF Electric Annoyed Liquid Crystal Drive

Analog Devices ADIS16475-2BMLZ Precision MEMS IMU with 2621440deg/s/LSB in Miniature BGA-44 Package for Wide Temperature Range -40℃~105℃

IC Packaging BGA IC Type JEDEC IC Trays Black MPPO PPE ABS PEI IDP Material

ESD Plastic JEDEC Standard Matrix Tray For IC Packaging

China Unicomp AX8200 BGA/IC/PCB Closed X-Ray Machine with factory price

High Storage Efficiency Lightweight JEDEC Tray with ESD Protection for IC Packaging

ADP1613ARMZ-R7 Power Management ICs Boost SEPIC Switching Regulator IC Package 8-TSSOP 8-MSOP63

MAX8815AETB+T Power Management ICs Boost Switching Regulator IC Package 10-WFDFN Exposed Pad

Universal JEDEC Matrix Tray Stackable For IC Packaging Industry

Injection JEDEC Tray With Custom Cavity Design For IC Packaging And Shipping

Anti-Static And Automation Ready Custom JEDEC Tray For IC Packaging

ODM PCB Module ESD Black IC Packaging Trays Heat-Resistant

Communication IC Package Substrate Aluminum Base ENIG Surface Finishing