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...sop, qfp, bga to csp to mcm, encapsulation form by the traditional single chip encapsulation to the multi-chip encapsulation form of change, encapsulation form of ......
...SOIC, CHIP, QFP, PLCC, BGA and so on. It is suitable for contractive flexible tube. Functions: * Closed loop of sensor, microcomputer to display digital and control temperature, large power in ......
Injection Moulding JEDEC IC Trays With High Temperature Resistance Whether for BGA, PGA, QFP or proprietary modules, our JEDEC trays ensure consistent alignment and secure chip retention. Developed for Precisio...
... CCD visual alignment,and optional dotting function. 3.MES system integration. It supports a wide range of chip packages, including QFN, SOP, BGA and QFP. It's very convenient to program chips of different p...
... 11+ THINE F5408L1MQB 67 LCC 00+ TI BD11600NUX-E2 4900 QFN 12+ ROHM EPF10K50RI240-4 67 QFP 10+ ALTERA ASC375AVEF 4880 SOP16 10+ ASC K7R320982C-FC20 67 BGA 06+ SAMSUNG ATTINY12L-4SI 4850 SOP8 05+ ATMEL EPM703...
... OP16GN8 2722 LINEAR 14+ DIP-8 UPC3403G2 2754 NEC 16+ SOP14 XC5VLX50T-1FFG1136C 2786 XILINX 16+ BGA ATMEGA8515L-8AU 2818 ATMEL 13+ QFP INA125PA 2850 TI 15+ DIP8 M5L8216P 2882 MIT 16+ DIP P80C552EBA 2914 PHI ...
Stock Offer (Hot Sell) Part no. Quantity Brand D/C Package M2716-1F1 4192 ST 16+ DIP MPQ2222A 5931 MOTOROLA 16+ DIP N270 SLB73 440 INTEL 13+ BGA MSP430F149IPMR 6673 TI 14+ QFP BQ34Z100PWR 1310 TI 12+ QFN LM3875...
...PQFP CS4398-CZZR 2234 CIRRUS 15+ TSSOP LC4064V-75TN100-10I 3070 LATTICE 15+ QFP ME0550-02DA 595 IXYS 14+ IGBT MDD26-14N1B 5902 IXYS 16+ IGBT MT9V024IA7XTM 2499 ON 15+ BGA MCC21-1408B 4756 IXYS 14+ IGBT CM100...
... camera, six high-speed recognition camera can effectively mount 0402-5050 RCA, two transistors, SOP, QFP-256 chip, BGA and other sizes 45mm * 45mm size recognition of components within the placement. XY dri...
..., six high-speed recognition camera can effectively mount 0402-5050 RCA, two transistors, SOP, QFP-256 chip, BGA and other sizes 45mm * 45mm size recognition of components within the placement. XY drive usin...
... mount 0402-5050 components, beads, diodes, transistors, SOP, 45mm*45mm range pin pitch ≥0.3mm chip QFP-256, BGA etc. Fast Speed: the max. mounting speed: 8000CPH, average mounting speed: 6000CPH. Strong Sta...
... holes board etc) 3. Material procurement and management 4. Prototype and NPI (new product introduction) 5. PCBA (SMD Placement include 0402,QFP,QFN,BGA etc...
.... The finished products can be used in producing resistor-capacitor, glass cylinder package diode, triode, TQFP package, QFN package, QFP package, BGA package, lamp pole etc. Technical parameters Maximum mou...
... finished products can be used in producing resistor-capacitor, glass cylinder package diode, triode, TQFP package, QFN package, QFP package, BGA package, lamp pole etc. Technical parameters Maximum mounting...
... 0402-5050 components, LED beads, diodes, transistors, SOP, 40mm*40mm range pin pitch ≥0.3mm chip QFP, BGA etc. 2. Fast Speed: the max. mounting speed:...
... mount 0402-5050 components, beads, diodes, transistors, SOP, 45mm*45mm range pin pitch ≥0.3mm chip QFP-256, BGA etc. Fast Speed: the max. mounting speed: 8000CPH, average mounting speed: 6000CPH. Strong Sta...
... 0402-5050 components, LED beads, diodes, transistors, SOP, 40mm*40mm range pin pitch ≥0.3mm chip QFP, BGA etc. 2.Fast Speed: the max. mounting speed: 7000CPH,...
... instructions Type of pump air: Airflow fan with soft air suitable for a variety of components such as demolition welding, such as: SOIC, CHIP, QFP, PLCC, BGA, etc. (special variable for...