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... components Integrated Circuits (ICs) EP2C5F256C8N EP2C5T144C8N EP2S60F1020C5N EP3C10E144C8N EP3C10F256C8 ALTERA BGA QFP QFP144 Integrated Circuits Components Specification :EP2C5F256C8N EP2C5T144C8N EP2S60F...
... production line. Multi-component adaptability Yamaha SMT Feeder supports feeding from tiny 0201 patch components to large QFP and BGA...
... Gold,Gold Finger Components Chip & IC 01005(0.25* 0.12) 24*24 Special size(Connector) 1.6*0.8 100mm BGA Pitch 0.3mm 1.0mm QFP Pitch 0.3mm 1.0mm Components Type Speed(CPH)...
... Gold,Gold Finger Components Chip & IC 01005(0.25* 0.12) 24*24 Special size(Connector) 1.6*0.8 100mm BGA Pitch 0.3mm 1.0mm QFP Pitch 0.3mm 1.0mm...
... Test Sockets are essential in ensuring accurate performance verification of integrated circuits (ICs) across a wide range of package types, including BGA (Ball Grid Array), QFP...
..., QFP, connectors,PLCC, CSP/BGA, long ~ 0402-31 mm components, connectors (L100mm x W31mm) - >mind vision camera, 0603 - more than 31 type components, ......
... enables fast, accurate identification of various component shapes, including BGA, SOP, and QFP, ranging from as small as 03015 to sizes up to 50 mm square. This laser-recognition system ensures stable recog...
...:JoyLY0322 Specification of Yamaha YV100II Chip Mounter Chip theoretical speed 0.25sec / chip Mounting range 1005 ~ qfp'sqp 'soj'plcc (25mm) bga (0.4p) Positioning accuracy of plus or minus 0.08mm PCB size l...
...% (actual utilization rate) = 12,000 elements/hour 2) the range of mountable components: 0603CR (metric system) to vac32mm IC,CSPs,BGAs and QFPs. 3) header structure: there are 8 mounting heads in the mounti...
... SUPPORT LED 1.2M PCB JUKI 2060 Mounter - Technical Specifications Patch range: 0402(1005)-SOP.PLCC.QFP.BGA, 1, substrate size M substrate (330 × 250mm) For the L substrate (410 x 360mm). Lwide (510 x 360mm)...
... of heads: 4 regular heads n Mounting PCB size: 410 × 460 × 5.0mm (maximum) n Mounting component size: 01005 - 18mm (QFP, BGA) n Mounting accuracy: ±0.03 n Number of FEEDER equipped: 80 (8mm) Future MX200LED...
...: Patch speed: 0.25 seconds / CHIP SMD PCB size: L457XW407MM_L50XW50MM SMD components: CHIP, MELF, SOT, PLCC, QFP, BGA, CSP and shaped electromechanical components, pin pitch ≥ 0.3mm SMD components can be pl...
... seconds / CHIP Patch PCB size: L510XW440MM_L50XW50MM SMD component: 0402(MM)-45MMX45MM component SOP SOJ PLCC QFP BGA SMD components can be...
...; For the latest 0402, 0201, 01005 and other small components and fine pitch QFP, BGA, uBGA, Connector and other precision components can not be repaired after reflow and super difficult rework, etc., can be...
..., resistor, components Mounting SMD components The types of SMD components are very much and different. Like the SOP,SOJ,PLCC,LCCC,QFP,BGA,CSP,FC,MCM,LED CHIP, Resistor, IC, ETC. In the led lighting industry...
... temperature. * Suitable for soldering and de-soldering surface mounted ICs. Such as QFP, PLCC, SOP, BGA, etc. * Continued automatism cooling system. Deferred air delivery after switch off upon. * Completion...
..., limitless air adjust, rapid heating, Suitable for soldering and de-soldering surface mounted ICs. Such as QFP, PLCC, SOP, BGA etc. Light handle. Especially suitable for mounting and reworking SMD component...
...stable temperature, Suitable for soldering and de-soldering surface mounted ICs. Such as QFP, PLCC, SOP, BGA etc. Intelligent cooling systems. Deferred air delivery after switch off upon completion of rework...
...closed loop of sensor, rapid heating, precise and stable temperature, Suitable for soldering and de-soldering surface mounted ICs. Such as QFP, PLCC, SOP, BGA etc. Light handle. Especially suitable for mount...
...QFP, PLCC, SOP, BGA etc. Continued automatism cooling system. Deferred air delivery after switch off upon completion of rework and automatically switch off power supply after one minute. Use ......