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....3mm) Maximum BGA size 74x74mm BGA ball pitch 1.00mm(minimum), 3.00mm(maximum) BGA ball diameter 0.40mm(minimum), 1.00mm(maximum) QFP lead pitch 0.38mm(minimum), 2.54mm(maximum) Volume One piece to low volum...
... Max PCB Size 1200mm*400mm Min PCB Thinkness 0.35mm Min Chip Size 01 005 Max BGA Size 74mm*74mm BGA Ball Pitch 1.0-3.00 BGA Ball Diameter 0.2 - 1.0mm QFP Lead Pitch...
...BGA, QFP, as well as THT selective soldering.Our engineers is qualified and experienced in producing surface-mount (SMT), through-hole (THT) and mixed-technology components and fine-pitch parts and ball grid...
...BGA, QFP, as well as THT selective soldering.Our engineers is qualified and experienced in producing surface-mount (SMT), through-hole (THT) and mixed-technology components and fine-pitch parts and ball grid...
... and experienced in producing surface-mount (SMT), through-hole (THT) and mixed-technology components and fine-pitch parts and ball grid arrays (BGAs) for high-density FR-4 PCBs . We can produce and offer bu...
...DIP, BGA, QFP, as well as THT selective soldering.Our engineers is qualified and experienced in producing surface-mount (SMT), through-hole (THT) and mixed-technology components and fine-pitch parts and ball...
...SMT,DIP, BGA, QFP, as well as THT selective soldering.Our engineers is qualified and experienced in producing surface-mount (SMT), through-hole (THT) and mixed-technology components and fine-pitch parts and ...
... in producing surface-mount (SMT), through-hole (THT) and mixed-technology components and fine-pitch parts and ball grid arrays (BGAs) for high-density FR-4 PCBs . We can produce and offer bulk volume printe...
...BGA, QFP, as well as THT selective soldering.Our engineers is qualified and experienced in producing surface-mount (SMT), through-hole (THT) and mixed-technology components and fine-pitch parts and ball grid...
...BGA, QFP, as well as THT selective soldering.Our engineers is qualified and experienced in producing surface-mount (SMT), through-hole (THT) and mixed-technology components and fine-pitch parts and ball grid...
... and experienced in producing surface-mount (SMT), through-hole (THT) and mixed-technology components and fine-pitch parts and ball grid arrays (BGAs) for high-density FR-4 PCBs . We can produce and offer bu...
... in producing surface-mount (SMT), through-hole (THT) and mixed-technology components and fine-pitch parts and ball grid arrays (BGAs) for high-density FR-4 PCBs . We can produce and offer bulk volume printe...
...SMT,DIP, BGA, QFP, as well as THT selective soldering.Our engineers is qualified and experienced in producing surface-mount (SMT), through-hole (THT) and mixed-technology components and fine-pitch parts and ...
...DIP, BGA, QFP, as well as THT selective soldering.Our engineers is qualified and experienced in producing surface-mount (SMT), through-hole (THT) and mixed-technology components and fine-pitch parts and ball...
...size 0402.0201 to 01005, SOIC,PLCC, TSOP, QFP,BGA Assembly Method Single and double-sided / SMD and THT / SMT and Thru-hole Ball Grid Array (BGA) As small as 0.5mm pitch,All BGA placements are inspected by X...
... size: 0201 (0.2x0.1)/0603 (0.6 x 0.3mm) Maximum BGA size: 74x74mm BGA ball pitch: 1.00mm (minimum), 3.00mm (maximum) BGA ball diameter: 0.40mm (minimum), 1.00mm (maximum) QFP lead pitch: 0.38mm (minimum), 2...
... size: 0201 (0.2x0.1)/0603 (0.6 x 0.3mm) Maximum BGA size: 74x74mm BGA ball pitch: 1.00mm (minimum), 3.00mm (maximum) BGA ball diameter: 0.40mm (minimum), 1.00mm (maximum) QFP lead pitch: 0.38mm (minimum), 2...
...0603 (0.6 x 0.3mm) Maximum BGA size: 74x74mm BGA ball pitch: 1.00mm (minimum), 3.00mm (maximum) BGA ball diameter: 0.40mm (minimum), 1.00mm (maximum) QFP lead pitch: 0.38mm (minimum), 2.54mm (maximum) Volume...
... chip size: 0201 (0.2x0.1)/0603 (0.6 x 0.3mm) Maximum BGA size: 74x74mm BGA ball pitch: 1.00mm (minimum), 3.00mm (maximum) BGA ball diameter: 0.40mm (minimum), 1.00mm (maximum) QFP lead pitch: 0.38mm (minimu...
... size: 0201 (0.2x0.1)/0603 (0.6 x 0.3mm) Maximum BGA size: 74x74mm BGA ball pitch: 1.00mm (minimum), 3.00mm (maximum) BGA ball diameter: 0.40mm (minimum), 1.00mm (maximum) QFP lead pitch: 0.38mm (minimum), 2...