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... Chip Mounter Machine applicable for 0603 to SOP, PLCC, QFP, BGA, CSP, and connector components made by I-Pulse. I-Pulse M1-Plus SMT Pick and Place machine have a professional rail design for smooth ......
...% custom tray is not only suitable for storing IC but also better protect the chip storage.We have designed a lot of packaging way, which also contains common BGA, FBGA, LGAQFN, QFP,...
...a variety of chip packages, including BGA.CSP.QFP.QFN... And so on,Hiner-pack custom IC trays matrix trays. offer the ultimate protection and convenience. We offer a wide variety of ......
... and thin matrix trays to handle various QFP, PGA, BGA and other custom devices. If a new tray design is required, we provide expert design services to develop the best tray to meet your needs, and ......
Heat Resistant PES Black JEDEC Trays For IC Chip SGS Certified Our JEDEC tray series is tailored for QFP, BGA, and other IC packages, ensuring secure positioning during high-speed processes. HN21090 is a kind o...
... ±50μm@μ±3σ/chip Control Accuracy 5μm Component Height 12mm Component Type 0201/0402/0603~5050/SOT/SOP/QFP/QFN/BGA, etc...
... and other electronic components.These are usually referred to as JEDEC standard matrix trays. It is suitable for all kinds of packages, including BGA,CSP,QFN,QFP,ect. Details Of HN21127 JEDEC Tray The main ...
...: 0.15mm/4mil PCB Test:: Flying probe and AOI (Default)/Fixture Test Chip and IC:: 0201(0.6*0.3)~22*22 BGA Pitch: 0.3 mm ~3.0 mm QFP Pitch: 0.3 mm ~1.0 mm Number of...
. Product Description YT101S ranks in eton honor series. Support component 0201-40*40mm tape reel package Such as BGA, CSP, QFP, etc. Suitable for various home appliance driver boards, TV displays and various ...
...closed loop of sensor, rapid heating, precise and stable temperature, Suitable for soldering and de-soldering surface mounted ICs. Such as QFP, PLCC, SOP, BGA etc. Light handle. Especially suitable for mount...
...stable temperature, Suitable for soldering and de-soldering surface mounted ICs. Such as QFP, PLCC, SOP, BGA etc. Intelligent cooling systems. Deferred air delivery after switch off upon completion of rework...
..., limitless air adjust, rapid heating, Suitable for soldering and de-soldering surface mounted ICs. Such as QFP, PLCC, SOP, BGA etc. Light handle. Especially suitable for mounting and reworking SMD component...
... temperature. * Suitable for soldering and de-soldering surface mounted ICs. Such as QFP, PLCC, SOP, BGA, etc. * Continued automatism cooling system. Deferred air delivery after switch off upon. * Completion...
...QFP, PLCC, SOP, BGA etc. Continued automatism cooling system. Deferred air delivery after switch off upon completion of rework and automatically switch off power supply after one minute. Use ......
... OP16GN8 2722 LINEAR 14+ DIP-8 UPC3403G2 2754 NEC 16+ SOP14 XC5VLX50T-1FFG1136C 2786 XILINX 16+ BGA ATMEGA8515L-8AU 2818 ATMEL 13+ QFP INA125PA 2850 TI 15+ DIP8 M5L8216P 2882 MIT 16+ DIP P80C552EBA 2914 PHI ...
Stock Offer (Hot Sell) Part no. Quantity Brand D/C Package M2716-1F1 4192 ST 16+ DIP MPQ2222A 5931 MOTOROLA 16+ DIP N270 SLB73 440 INTEL 13+ BGA MSP430F149IPMR 6673 TI 14+ QFP BQ34Z100PWR 1310 TI 12+ QFN LM3875...
... TPS3803-01DCKRG4 3500 TI 12+ 3C70-5 TNY277P 3508 POWER 16+ DIP-7 BCM5221A4KPTG 3520 BROMADCOM 12+ QFP LP2957AIS 3520 NS 16+ TO263-6...
... from DIP, SOIC, QFP, BGA, etc., and supply current from 2mA-100mA. It offers excellent performance in high-density, high-speed, and low-power applications. The specific ......
... types, including DIP, SOIC, QFP, and BGA, with dimensions ranging from 2.0mm x 2.0mm to 12.0mm x 12.0mm. Our integrated circuits feature a wide range of data rates, up to ......