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... Services: SMT, DIP, BGA 4. Flying Probe Test, X-ray Inspection, AOI Test, Function Test 5. Stencil,Cable and Enclosure Assembly 6. Reverse engineering service 7. PCB Soldering Flexible printed circuit board...
...Production Line Features · Even temperature and high heat compensation efficiency,especially suitable for soldering of BGA CSP components. · The patent wind wheel design can ensure wind speed windspeed can b...
...BGA CSP components. 2. The patent wind wheel design can ensure wind speed windspeed can be adjusted by frequency conversion 3. All temperature zone ......
...SMT Reflow Oven RF-500Ⅰ Features 1. Even temperature and high heat compensation efficiency, especially suitable for soldering of BGA CSP components. 2. All temperature zone applies coercive independent cycle...
8 Zones Lead Free Reflow Oven Hot Air Reflow Oven RF-800 Features 1. Even temperature and high heat compensation efficiency, especially suitable for soldering of BGA CSP components. 2. All temperature zone app...
...Solder Mask green, yellow, white, blue, black, red Finished Surface conventional hasl, lead free hasl, immersion gold, immersion tin, immersion silver, hard gold, OSP... Silkscreen color white, black Product...
...raised by electric handspike, safe and credible 2. SMEMA compatible 3. Even temperature and high heat compensation efficiency, especially suitable for soldering of BGA CSP components. 4. Quick warm up, it ta...
... service. Including: * AOI(Automatic Optical Inspection) * Function Testing * In Circuit Testing * Testing Jig * Testing Service * X-Ray for BGA Testing * Printing Solder Paste Test Each board is carefully...
... Mount Technology. We fabricate PCB Assembly with SMT,DIP, BGA, QFP, as well as THT selective soldering. SMT assembly as an alternative to the through-hole method of PCB manufacturing, is a method of placing...
... , Our PCB assembly line has a unique layout design that allows a flexible combination of automated and manual components loading stations. We can also easily solder fine pitch components and BGAs for...
...:0.25"*0.25" Min Components size 0201-54 sq.mm (0.084 sq.inch),Long Connector,CSP,BGA,QFP Speed 0.15sec/chip, 0.7sec/QFP Wave-Solder Max.PCB Width:450mm Min.PCB Width:unlimited...
...:0.25"*0.25" Min Components size 0201-54 sq.mm (0.084 sq.inch),Long Connector,CSP,BGA,QFP Speed 0.15sec/chip, 0.7sec/QFP Wave-Solder Max.PCB Width:450mm Min.PCB Width...
...:0.25"*0.25" Min Components size 0201-54 sq.mm (0.084 sq.inch),Long Connector,CSP,BGA,QFP Speed 0.15sec/chip, 0.7sec/QFP Wave-Solder Max.PCB Width:450mm Min.PCB Width:unlimited...
...:0.25"*0.25" Min Components size 0201-54 sq.mm (0.084 sq.inch),Long Connector,CSP,BGA,QFP Speed 0.15sec/chip, 0.7sec/QFP Wave-Solder Max.PCB Width:450mm Min.PCB Width:unlimited Components...
...collectors, digital collectors, instruments, smart water meters), etc., We fabricate PCB Assembly with SMT,DIP, BGA, QFP, as well as THT selective soldering.Our engineers is qualified and experienced in prod...
..., Imdepence PCB, Highfrequency PCB,Buried & Blind via PCB; 4. PCB Assembly: PCB Bare Board with SMT, THT/DIP, BGA, COB soldered components; 5.PCBA...
... service. Including: 1. AOI(Automatic Optical Inspection) 2. Function Testing 3. In Circuit Testing 4. Testing Jig 5. Testing Service 6. X-Ray for BGA Testing 7. Printing Solder Paste Test Each...
...:0.25"*0.25" Min Components size 0201-54 sq.mm (0.084 sq.inch),Long Connector,CSP,BGA,QFP Speed 0.15sec/chip, 0.7sec/QFP Wave-Solder Max.PCB Width:450mm Min.PCB Width:unlimited Components Height:Top 120mm/Bo...
... Features: 1 8 Layer HDI PCB with blind and buried holes. 2 Green solder mask and immersion gold treatment. 3 Min hole size is 0.1mm and min BGA size is 9mil. 4 Finished board thickness is 0.8mm. 5 The produ...
...Finished Board Thickness: 1.0 MM tolerance is +/-0.1MM 4 Solder Mask: Green 5 Min Lind Space&Width: 4/4 mil 6 Application Area: Blue-tooth Module 7 Drillings: L1-L4 0.2MM 8 BGA Size: 0.3MM 9 Surface Treatmen...