| Sign In | Join Free | My burrillandco.com |
|
...: Fast prototyping High mix, low and medium volume build SMT MinChip:0201 BGA: 1.0 to 3.0 mm pitch Through-hole assembly Special processes (such as conformal coating and potting) ROHS capability IPC-A-610E a...
... thickness. Also, the board size of this Multilayer PCB Board is 94 * 88 mm, with red solder mask and ENIG surface treatment. Quick Details One of the largest PCB(Printed Circuit Board) manufacturers in Chin...
...BGA hole need to be filled Rogers 4003C fr4 Stack up files: Quick detail: Model:XCEBR-6 Size: 16*5cm Copper THK:35UM Color: Green Surface finish:Immersion gold,ENIG 6 layer 0.693mm thickness Green solder mas...
... hole PCB with impedance control Base material: FR4 Layer: 6 layers with impedance control & BGA Board thickness: 1.6 mm Copper thickness: 1 oz Surface finish: ENIG Solder mask & Silkscreen: Green & White Mi...
... hole PCB with impedance control Base material: FR4 Layer: 6 layers with impedance control & BGA Board thickness: 1.6 mm Copper thickness: 1 oz Surface finish: ENIG Solder mask & Silkscreen: Green & White Mi...
... Base material: FR4 Layer: 8layers with impedance control & BGA Board thickness: 1.6 mm Copper thickness: 1 oz Surface finish: ENIG Solder mask & Silkscreen: Green & White Min. line space: 4 mil Min. line wi...
...manufacturer Material Copper Base material: FR4 Layer: 8layers with impedance control & BGA Board thickness: 1.6 mm Copper thickness: 1 oz Surface finish: ENIG Solder mask & Silkscreen: Green & White Min. li...
...Multi-layer printed circuit boards, flex boards BGA with x-ray and rework capability. Lead-free Assembly Wave soldering. In circuit testing. Functional testing. Conformal coating. Burn in. In-line AOI inspec...
... Conformal coating Green Solder Mask Rohs CE Huaswin specialized in PCB manufacturing and and PCB Assembly PCBA capabilities: FR-4, TG170,14-layer HDI+PCBA Fast prototyping High mix, low and medium volume bu...
..., Gold plating Layer 1-20 Layer Solder Mask Color Yellow/Black/White/Red/Blue/Green Special requirements Buried and blind vias+controlled impedance +BGA Copper thickness 0.5 OZ to 6 oz Tolerance Shape tolera...
... / HASL lead free, HAL, Chemical tin, Immersion Silver/Gold, OSP, Gold plating Layer 1-20 Layer Solder Mask Color Yellow/Black/White/Red/Blue/Green Special requirements Buried and blind vias+controlled imped...
... PCB Board Thickness: 1.0MM Material: FR4 Copper Thickness: 1/H/H/1OZ Min Hole: 0.1MM Min Line: 3/3 Mil BGA Size: 8Mil Unit Size: 82*109.6MM/20UP Hole: L1-L4, L2-L3, L3-L4, L1-L2 Min Distance Between Inner L...
... PCB Board Thickness: 0.8MM Material: FR4 Copper Thickness: 1/H/H/1OZ Min Hole: 0.1MM Min Line: 4/4 Mil BGA Size: 10Mil Unit Size: 115*84MM/24UP Hole: L1-L4, L2-L3, L3-L4, L1-L2 Solder Mask: Green Surface Tr...
...: 1.6MM Material: FR4 Min Hole: 0.1MM Min Line: 3/3 Mil BGA Size: 10Mil Unit Size: 92*78mm/4up Hole: L1-L2, L2-L7, L7-L8, L1-L8 Solder Mask: Green Surface Treatment: ENIG Application: Camera Capabilities: It...
...PCB Board Thickness: 1.2MM Material: FR4 NY3150A Min Hole: 0.1MM Min Line: 3/3 Mil BGA Size: 8Mil Unit Size: 90MM*60MM/20UP Blind Holes: L1-L2 , L5-L6 0.1MM Buried Holes: L1-L6 Solder Mask: Green Surface Tre...
...: L1-L4 Blind Hole: L1-L2 0.1MM, L3-L4 0.1MM Buried Hole: L3-L4 0.2MM BGA Size: 10 Mil Solder Mask: Green Surface...
...Layer Count: 4Layer Half Plated Hole PCB Board Thickness: 0.8MM Copper Thickness: 1/H/H/1OZ BGA Size: 10 Mil, Via In Pad Min Hole: 0.1MM Min Line: 3/3 Mil Hole: L1-L4 Blind Hole: L1-L2 0.1MM, L3-L4 0.1MM Bur...
...: 6 Layer Rigid PCB: Material: FR4 S2600F Board Thickness: 1.6MM Min Hole: 0.3MM Min Trace: 5/5Mil BGA Size: 12Mil Solder Mask: Green Surface Treatment: ENIG Application: Power Supply Capabilities: Item Capa...