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...Silicon Wafer CZ N Type Phosphorus Doped Orientation 100 Test Grade 4" Test Wafer PAM-XIAMEN develops advanced crystal growth and epitaxy technologies, range from the silicon substrate to compound semiconduc...
... boron,which create "holes"in the silicon lattice. These holes act as positive charge carriers, allowing for the conduction of electricity. 2inch 4inch and 6inch diameter wafers are common sizes used in the ...
...Silicon Wafer for IC and Power Devices Introduction of N-Type Silicon Wafer: An N-type Silicon Wafer is a high-purity, single-crystal silicon substrate doped with phosphorus, arsenic, or antimony atoms to in...
Product Description: IC Silicon Wafers are 8-inch diameter substrates used for semiconductor devices with a wide range of applications. It is made of high-purity silicon with various thicknesses of 0.28/ 0.35/ ...
...Silicon Wafers Ultrasonic Golf Club Cleaning Machine Model CL-10800 Voluem 960L Ultrasonic power 10.8kw Heating power 30kw Tank size 1500*800*800mm Overall size 1700*1280*1150mm Frequency 40/28KHz Weight 500...
...Silicon Wafers Ultrasonic Golf Club Cleaning Machine Model CL-10800 Voluem 960L Ultrasonic power 10.8kw Heating power 30kw Tank size 1500*800*800mm Overall size 1700*1280*1150mm Frequency 40/28KHz Weight 500...
Ultrasonic Cleaning Equipment For Silicon Wafer And Optical Lens Ultrasonic Cleaning Machine Model CL-10800 Voluem 960L Ultrasonic power 10.8kw Heating power 30kw Tank size 1500*800*800mm Overall size 1700*1280...
Ultrasonic Cleaning Equipment For Silicon Wafer And Optical Lens Ultrasonic Cleaning Machine Model CL-10800 Voluem 960L Ultrasonic power 10.8kw Heating power 30kw Tank size 1500*800*800mm Overall size 1700*1280...
...Silicon Wafer Jar Packaging With Accessories The Silicon Wafer Jar packaging primarily used to store and transport silicon wafers for the semiconductor industry. We have a wide range of sizes for customers t...
Abstract This product is a high-purity silicon wafer, designed specifically for the manufacture of high-performance integrated circuits. The wafer is processed through high-temperature melting and single-crysta...
...Silicon Wafer With High-Resistivity And Good Lifetime. FZ-Silicon The mono-crystalline silicon with the characteristics of low foreign-material content, low defect density and perfect crystal structure is pr...
..., PAM-XIAMEN offer semiconductor silicon substrate with diameters from 1’’ (25.4 mm) to 12’’ (300 mm). We work either Cz (Czochralski) or FZ (Float Zone) silicon substrate. The polishing process is also made...
..., PAM-XIAMEN offer semiconductor silicon substrate with diameters from 1’’ (25.4 mm) to 12’’ (300 mm). We work either Cz (Czochralski) or FZ (Float Zone) silicon substrate. The polishing process is also made...
..., PAM-XIAMEN offer semiconductor silicon substrate with diameters from 1’’ (25.4 mm) to 12’’ (300 mm). We work either Cz (Czochralski) or FZ (Float Zone) silicon substrate. The polishing process is also made...
..., PAM-XIAMEN offer semiconductor silicon substrate with diameters from 1’’ (25.4 mm) to 12’’ (300 mm). We work either Cz (Czochralski) or FZ (Float Zone) silicon substrate. The polishing process is also made...
..., PAM-XIAMEN offer semiconductor silicon substrate with diameters from 1’’ (25.4 mm) to 12’’ (300 mm). We work either Cz (Czochralski) or FZ (Float Zone) silicon substrate. The polishing process is also made...
..., PAM-XIAMEN offer semiconductor silicon substrate with diameters from 1’’ (25.4 mm) to 12’’ (300 mm). We work either Cz (Czochralski) or FZ (Float Zone) silicon substrate. The polishing process is also made...
..., PAM-XIAMEN offer semiconductor silicon substrate with diameters from 1’’ (25.4 mm) to 12’’ (300 mm). We work either Cz (Czochralski) or FZ (Float Zone) silicon substrate. The polishing process is also made...
..., PAM-XIAMEN offer semiconductor silicon substrate with diameters from 1’’ (25.4 mm) to 12’’ (300 mm). We work either Cz (Czochralski) or FZ (Float Zone) silicon substrate. The polishing process is also made...
..., PAM-XIAMEN offer semiconductor silicon substrate with diameters from 1’’ (25.4 mm) to 12’’ (300 mm). We work either Cz (Czochralski) or FZ (Float Zone) silicon substrate. The polishing process is also made...