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Fr4 Substrate Thickness

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Total 6712 products for fr4 substrate thickness Manufacture & Suppliers

UDP/USB memory substrate manufacture supporting

... brand:Mainly brand:SHENGYI,Mitsubishi(BT-FR4),mitsuiseiki,OhmegaPly,Ticer,AMC,Isola,AGC,Neclo,Rogers,Taconic,Others; Surface finished:Mainly immersion gold,support ......

HongRuiXing (Hubei) Electronics Co.,Ltd.
China

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wire bonding memory substrate with gold plating manufacture

... brand:SHENGYI,Mitsubishi(BT-FR4),mitsuiseiki,OhmegaPly,Ticer,AMC,Isola,AGC,Neclo,Rogers,Taconic,Others; Surface finished:Mainly immersion gold,support ......

HongRuiXing (Hubei) Electronics Co.,Ltd.
China

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MGC BT Memory substrate 4L with ENEPIG plating

... brand:SHENGYI,Mitsubishi(BT-FR4),mitsuiseiki,OhmegaPly,Ticer,AMC,Isola,AGC,Neclo,Rogers,Taconic,Others; Surface finished:Mainly immersion gold,support ......

HongRuiXing (Hubei) Electronics Co.,Ltd.
China

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0.2mm 4L BT memory substrate manufacture JEDEC standard

... brand:SHENGYI,Mitsubishi(BT-FR4),mitsuiseiki,OhmegaPly,Ticer,AMC,Isola,AGC,Neclo,Rogers,Taconic,Others; Surface finished:Mainly immersion gold,support ......

HongRuiXing (Hubei) Electronics Co.,Ltd.
China

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big capacity of memory packaging substrate manufacture

... brand:Mainly brand:SHENGYI,Mitsubishi(BT-FR4),mitsuiseiki,OhmegaPly,Ticer,AMC,Isola,AGC,Neclo,Rogers,Taconic,Others; Surface finished:Mainly immersion gold,support ......

HongRuiXing (Hubei) Electronics Co.,Ltd.
China

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RF Module substrate impedance control 4L BT material soft gold

... brand:SHENGYI,Mitsubishi(BT-FR4),mitsuiseiki,OhmegaPly,Ticer,AMC,Isola,AGC,Neclo,Rogers,Taconic,Others; Surface finished:Mainly immersion gold,support ......

HongRuiXing (Hubei) Electronics Co.,Ltd.
China

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Semiconductor sensors substrate manufacture

...,IC package,Consumer electronics,Car electronics; Spec.of Substrate production: Mini.Line space/width:1mil (25um) Finished thickness:0.17mm; Material brand:Mainly brand:SHENGYI,Mitsubishi(BT-FR4),mitsuiseiki...

HongRuiXing (Hubei) Electronics Co.,Ltd.
China

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FCCSP package substrate 4L Buildup types ENEPIG

...package,IC package,Consumer electronics,Computer,others; Spec.of Substrate production: Mini.Line space/width:1mil (25um) Finished thickness:0.3mm; Material brand:Mainly brand:SHENGYI,Mitsubishi(BT-FR4),mitsu...

HongRuiXing (Hubei) Electronics Co.,Ltd.
China

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FCCSP substrate manufacture supporting China

...electronics,Internet electronics,telcommunication electronics,Others; Spec.of Substrate production: Mini.Line space/width:1mil (25um) Finished thickness:0.4mm; Material brand:Mainly brand:SHENGYI,Mitsubishi(...

HongRuiXing (Hubei) Electronics Co.,Ltd.
China

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QFN package sensors substrate manufacture supporting

...,QFN package,Sensors electronics,Smart electronics; Spec.of Substrate production: Mini.Line space/width:1mil (25um) Finished thickness:0.2mm; Material brand:Mainly brand:SHENGYI,Mitsubishi(BT-FR4),mitsuiseik...

HongRuiXing (Hubei) Electronics Co.,Ltd.
China

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BGA/QFN package substrate production for IoT industry semiconductor

... industry electronics,Smart express electronics ,others; Spec.of Substrate production: Mini.Line space/width:1mil (25um) Finished thickness:0.18mm; Material brand:Mainly brand:SHENGYI,Mitsubishi(BT-FR4),mits...

HongRuiXing (Hubei) Electronics Co.,Ltd.
China

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0.3mm FCCSP Package Substrate 4L Buildup Types ENEPIG 5*5mm BT Material

...package,IC package,Consumer electronics,Computer,others; Spec.of Substrate production: Mini.Line space/width:1mil (25um) Finished thickness:0.3mm; Material brand:Mainly brand:SHENGYI,Mitsubishi(BT-FR4),mitsu...

HongRuiXing (Hubei) Electronics Co.,Ltd.
China

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semiconductor FCCSP Package Substrate manufacture

...; Material brand:Mainly brand:SHENGYI,Mitsubishi(BT-FR4),mitsuiseiki,OhmegaPly,Ticer,AMC,Isola,AGC,Neclo,Rogers,Taconic,Others; Surface finished:Mainly immersion gold,support ......

HongRuiXing (Hubei) Electronics Co.,Ltd.
China

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Substrate Fr4 Printed Circuit Board 3 Layers PCB 1OZ Copper Thickness 2 Years Guarantee

Substrate fr4 printed circuit board 3 layer pcb prototype PCB board Specifications 3 layer pcb 1. Substrate FR-4 printed circuit board; 2. Multilayer PCB; 3. 16 years experience ; 4. Contract manufacturer . 3 l...

Shenzhen Shinelink Technology Ltd
Guangdong,China

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ODM Matee Green Fiberglass High TG PCB Substrate 94v0 One Stop Turnkey Service

...,Peelable mask Solder mask color Green, Black(gloss/matte),Blue, Red, Yellow, White, Purple Board thickness 0...

Shenzhen Fany Technology Co.,Ltd
Guangdong,China

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Thickness 0.13MM FR4 PCB / Fr4 Double Sided Pcb Circuit Board Green Solder Mask

...FR4 Printed Circuit Board , Board Thickness 0.13MM , Green Solder Mask PCB Specifications: Layer Count: 2 Layer Rigid PCB Material: FR4 Board Thickness: 0.13MM Min Hole: 0.2MM Hole Stucture: L1-L2 Min Trace:...

Witgain Technology Ltd
Guangdong,China

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Copper Clad Fr4 Printed Electronic Circuit Board 2 Layer PCB HAL Lead Free

...Boards 2 Layer PCB With HAL Lead Free PCB Specifications: 1 2 Layer FR4 substrate material printed circuit board. 2 Double layer copper, copper thickness is 35um/35um. 3 Finished pcb thickness is 1.2mm. 4 2 ...

Witgain Technology Limited
China

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Copper Clad Fr4 Printed Electronic Circuit Board 2 Layer PCB HAL Lead Free

...Boards 2 Layer PCB With HAL Lead Free PCB Specifications: 1 2 Layer FR4 substrate material printed circuit board. 2 Double layer copper, copper thickness is 35um/35um. 3 Finished pcb thickness is 1.2mm. 4 2 ...

Witgain Technology Limited
China

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FR4 Clad 20um PTH Multi Layer PCB ENIG 2u'' Multilayer Pcb Board

...FR4 PCB Multilayer Circuit Board 1. 4 layer PCB board. 2. FR4 clad. 3. Immersion gold 2U''. 4. Electronics application. 5. PTH wall 20um min. 1 Layers 4 2 Substrate FR4 3 PCB thick 1.7mm 4 Application Elec...

Abis Circuits Co., Ltd.
Guangdong,China

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