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Fr4 Substrate Thickness

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Total 6701 products for fr4 substrate thickness Manufacture & Suppliers

BGA IC Package Substrate With Cap Plated MGC BT material

...substrate;Memory card,MicroSD card,MicroTF card,Memory card;Semiconductor,IC package,IC assembly,Semi packaging,IC substrate,wearable electronics,Nand/Flash memory spackage; Spec.of Substrate production: Min...

HongRuiXing (Hubei) Electronics Co.,Ltd.
China

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OEM ODM Gold Bonding IC Package Substrate 4 Layer

...substrate,IC packge pcb,IC/chip assembly,Memory card,TF card,UDP,SD card;Memory card,MicroSD card,MicroTF card,Memory card;Semiconductor,IC package,IC assembly,Semi packaging,IC substrate,wearable electronic...

HongRuiXing (Hubei) Electronics Co.,Ltd.
China

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AUS308 PSR IC Package substrate manufacture

...substrate pcb board;Semiconductor,IC package,IC assembly,Semi packaging,IC substrate,wearable electronics,Nand/Flash memory spackage; Spec.of Substrate production: Mini.Line space/width:1mil (25um) Finished ...

HongRuiXing (Hubei) Electronics Co.,Ltd.
China

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Bright Gold 0.2mm Multilayer substrate Fabrication With AUS308 PSR

...substrate,MCP,UFS,CMOS,MEMS,IC assembly,Storage IC substrage;Memory card,MicroSD card,MicroTF card,Memory card;Semiconductor,IC package,IC assembly,Semi packaging,IC substrate,wearable electronics,Nand/Flash...

HongRuiXing (Hubei) Electronics Co.,Ltd.
China

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JEDEC Standard eMCP IC Package Substrate Fabrication

...,IC package,IC assembly,Semi packaging,IC substrate,wearable electronics,Nand/Flash memory spackage; Spec.of Substrate production: Mini.Line space/width:1mil (25um) Finished thickness:0.29mm; Material brand:...

HongRuiXing (Hubei) Electronics Co.,Ltd.
China

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semiconductor packaging Substrate of DRAM Memory manufacture

...substrate,Dram/SSD/LPDDR package substrate;IC package,Semiconductor package,Memory electronics,NAND/Flash memory; Spec.of substrate production: Mini.Line space/width:1mil (25um) Finished thickness:0.15mm; Ma...

HongRuiXing (Hubei) Electronics Co.,Ltd.
China

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Soft Gold MCP / CSP Package Substrate BT FR4 0.1 - 0.4mm Finished Thickness

Soft gold MCP/CSP package substrate manufacture supporting MCP (Multi-Chip Package) MCP is the structure that increases memory capacity and performance, and maximizes the foot print efficiency by stacking sever...

HongRuiXing (Hubei) Electronics Co.,Ltd.
China

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Soft Gold MCP / CSP Package Substrate BT FR4 0.1 - 0.4mm Finished Thickness

Soft gold MCP/CSP package substrate manufacture supporting MCP (Multi-Chip Package) MCP is the structure that increases memory capacity and performance, and maximizes the foot print efficiency by stacking sever...

HongRuiXing (Hubei) Electronics Co.,Ltd.
China

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Fingerprint sensors packaging substrate manufacture supporting

...4mm) finished thickness; Material brand:Mainly brand:SHENGYI,Mitsubishi(BT-FR4),mitsuiseiki,OhmegaPly,Ticer,AMC,Isola,AGC,Neclo,Rogers,Taconic,Others; Surface finished:Mainly immersion gold,support ......

HongRuiXing (Hubei) Electronics Co.,Ltd.
China

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0.2mm Ultrathin MEMS packaging substrate fabrication for microphoneµelectronics

... pcb,Microelectronics package; Spec.of Substrate production: Mini.Line space/width:1mil (25um) Finished thickness:BT (0.1-0.4mm) finished thickness; Material brand:Mainly brand:SHENGYI,Mitsubishi(BT-FR4),mit...

HongRuiXing (Hubei) Electronics Co.,Ltd.
China

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EMMC IC Package Substrate PCB BGA Gold Plating 0.2mm Finished FR4 Material

...UAV,house electronics,consumer electronics. Product description IC substrate is a type of carry material for integrated circuit with internal circuit to connect the chips and PCBS. Additionally, the IC subst...

HongRuiXing (Hubei) Electronics Co.,Ltd.
China

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Customized 22F FR4 PCB Printed Circuit Board Prototype Drone Motherboard

... Circuit Board Prototype Drone Motherboard Specification: Model 22F 1.5 25Copper(V-shaped material)) Substrate material Copper Copper thickness 1OZ Plate thickness 1.5mm Minimum aperture 1.4mm Minimum line w...

Shenzhen Hansion Technology Co., Ltd.
China

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6L 2OZ Multilayer Printed Circuit Board , FR4 TG150 6 Layers Pcb Green Solder Mask

...copper traces, where the outer copper layers have a thickness of 2oz. The thicker copper layers provide better heat dissipation, which makes such PCBs suitable for high-current applications. FR4 TG150 is a t...

ShenZhen Jieteng Circuit Co., Ltd.
China

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Red Solder Mask FR4 Circuit Board 1 OZ Copper Thickness OSP Treatment

Red Solder Mask FR4 Substrate Material 1 OZ Copper Thickness OSP Treatment PCB Specifications: 1 Part NO: Multi-Layer PCB000351 2 Layer Count: 8 Layer PCB 3 Finished Board Thickness: 1.6MM 4 Copper Thickness: 1...

Witgain Technology Limited
China

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Red Solder Mask FR4 Circuit Board 1 OZ Copper Thickness OSP Treatment

Red Solder Mask FR4 Substrate Material 1 OZ Copper Thickness OSP Treatment PCB Specifications: 1 Part NO: Multi-Layer PCB000351 2 Layer Count: 8 Layer PCB 3 Finished Board Thickness: 1.6MM 4 Copper Thickness: 1...

Witgain Technology Limited
China

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No Copper 1.5mm FR4 PCB Board With Drill Holes

... 1.57 mm thick without mask. The base material is from ILM supplying 1 up single board. They're fabricated per IPC 6012 Class 2 using supplied Gerber data. Each ......

Bicheng Electronics Technology Co., Ltd
Guangdong,China

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6 Layer Copper Substrate PCB Through Hole FR4 TG150 HDI High Frequency

..., HDI Printed Circuit Boards high frequency pcb Copper Substrate PCB,gold finger Product Description Computer memory 6-layer through hole, FR-4, TG150, Plate thickness 1.60mm, copper thickness 1OZ, Green sol...

Shenzhen Chaosheng Electronic Technology Co.,Ltd
Hong Kong,China

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Microelectronics IC substrate manufacture

...substrate.IC package,IC assembly,TF card,MrcroSD card;IC package,Semiconductor package,Memory electronics,NAND/Flash memory; Spec.of substrate production: Mini.Line space/width:1mil (25um) Finished thickness...

HongRuiXing (Hubei) Electronics Co.,Ltd.
China

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Flash/NAND memory package substrate production

...substrate,MCP,UFS,CMOS,MEMS,IC assembly,Storage IC substrage;IC package,Semiconductor package,Memory electronics,NAND/Flash memory; Spec.of substrate production: Mini.Line space/width:1mil (25um) Finished th...

HongRuiXing (Hubei) Electronics Co.,Ltd.
China

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MiniLED substrate manufacture supporting

...substrate for Mini LED/Micro LED Application:MiniLED/Mirco LED Line space/width:1mil (25um) Spec.of pcb production: FR4/BT (0.1-1.0mm) finished thickness; Surface finished:immersion gold/silver/OSP; Copper:1...

HongRuiXing (Hubei) Electronics Co.,Ltd.
China

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