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Fr4 Substrate Thickness

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Total 6701 products for fr4 substrate thickness Manufacture & Suppliers

HOREXS semiconductor ic package substrate With Chip Wire Bonding

...electronics,Nand/Flash memory spackage; Spec.of Substrate production: Mini.Line space/width:1mil (25um) Finished thickness:0.29mm; Material brand:Mainly brand:SHENGYI,Mitsubishi(BT-FR4),mitsuiseiki,OhmegaPly...

HongRuiXing (Hubei) Electronics Co.,Ltd.
China

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4L build up types 0.8mm Gold Surface IC Package Substrate

...electronics,Nand/Flash memory spackage; Spec.of Substrate production: Mini.Line space/width:1mil (25um) Finished thickness:0.29mm; Material brand:Mainly brand:SHENGYI,Mitsubishi(BT-FR4),mitsuiseiki,OhmegaPly...

HongRuiXing (Hubei) Electronics Co.,Ltd.
China

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Sensors package substrate CMOS substrate manufacture supporting

... thickness:0.25mm; Material brand:Mainly brand:SHENGYI,Mitsubishi(BT-FR4),mitsuiseiki,OhmegaPly,Ticer,AMC,Isola,AGC,Neclo,Rogers,Taconic,Others; Surface finished:Mainly immersion gold,support ......

HongRuiXing (Hubei) Electronics Co.,Ltd.
China

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Sip package substrate BT material 4 layer ENEPIG

...,IC package,IC substrate,wearable electronics,IC assembly,Storage IC substrage; Spec.of Substrate production: Mini.Line space/width:1mil (25um) Finished thickness:0.22mm; Material brand:Mainly brand:SHENGYI,...

HongRuiXing (Hubei) Electronics Co.,Ltd.
China

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Semiconductor Package Substrate 12um copper buildup types

... thickness:0.22mm; Material brand:Mainly brand:SHENGYI,Mitsubishi(BT-FR4),mitsuiseiki,OhmegaPly,Ticer,AMC,Isola,AGC,Neclo,Rogers,Taconic,Others; Surface finished:Mainly immersion gold,support ......

HongRuiXing (Hubei) Electronics Co.,Ltd.
China

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CSP BGA Semiconductor Packaging Substrate 4 Layer BT ENEPIG Surface Finished

... thickness:0.22mm; Material brand:Mainly brand:SHENGYI,Mitsubishi(BT-FR4),mitsuiseiki,OhmegaPly,Ticer,AMC,Isola,AGC,Neclo,Rogers,Taconic,Others; Surface finished:Mainly immersion gold,support ......

HongRuiXing (Hubei) Electronics Co.,Ltd.
China

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0.26mm BT BGA IC Substrate Board manufacture

... thickness:0.26mm; Material brand:Mainly brand:SHENGYI,Mitsubishi(BT-FR4),mitsuiseiki,OhmegaPly,Ticer,AMC,Isola,AGC,Neclo,Rogers,Taconic,Others; Surface finished:Mainly immersion gold,support ......

HongRuiXing (Hubei) Electronics Co.,Ltd.
China

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BT Memory Card BGA package Substrate 6 layer Immersion Gold

... thickness:0.22mm; Material brand:Mainly brand:SHENGYI,Mitsubishi(BT-FR4),mitsuiseiki,OhmegaPly,Ticer,AMC,Isola,AGC,Neclo,Rogers,Taconic,Others; Surface finished:Mainly immersion gold,support ......

HongRuiXing (Hubei) Electronics Co.,Ltd.
China

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25um BT IC Package Substrate Soft gold plating

... thickness:0.22mm; Material brand:Mainly brand:SHENGYI,Mitsubishi(BT-FR4),mitsuiseiki,OhmegaPly,Ticer,AMC,Isola,AGC,Neclo,Rogers,Taconic,Others; Surface finished:Mainly immersion gold,support ......

HongRuiXing (Hubei) Electronics Co.,Ltd.
China

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Camera / Bluetooth / Wireless Module Substrate BT 4L 0.21mm Soft Gold Finished

...substrate manufacture Application:Semiconductor package,Wireless modules,Power AMS module,Bluetooth module,Camera module,IC package,WIFI module/Bluetooth module,Others; Spec.of Substrate production: Mini.Lin...

HongRuiXing (Hubei) Electronics Co.,Ltd.
China

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FR4 Double Sided PCB FR4 PCB Board With Green Solder Mask Custom Printed Circuit Board OEM

FR4 Double Sided PCB FR4 PCB Board With Green Solder Mask Custom Printed Circuit Board Specification: FR - 4 epoxy glass fiber cloth substrate, based on epoxy resin as binder, with electronic level glass fiber ...

Foisontech Corporation Co., Limited
Guangdong,China

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Multifunctional Multilayer FR4 Epoxy Substrate FR4 Panel

... Board, High Frequency Board, HDI PCB board, Aluminum Substrate . Haina lean Electronics Co., Ltd is one of the most professional PCB manufacture in Beijing,China.With 9 years of development, Haina Lean Elec...

Beijing Haina Lean Technology Co., Ltd
Beijing,China

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Multifunctional Multilayer FR4 Epoxy Substrate FR4 Panel

... Board, High Frequency Board, HDI PCB board, Aluminum Substrate . Haina lean Electronics Co., Ltd is one of the most professional PCB manufacture in Beijing,China.With 9 years of development, Haina Lean Elec...

Beijing Haina Lean Technology Co., Ltd
Beijing,China

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V-Cut PCB depanelizer PCBA depaneling machine for 0.3mm - 3.5mm thickness

...thick PCBs Can be used with aluminum , FR4, CEM3 and other substrates Keeping pace with mid-to-large volume production Panelized flexible or ultra-thin PCBs Densely populated PCBs with components located too...

Guangdong Chuangwei Electronic Equipment Manufactory
Guangdong,China

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Via In Pad Treatment 8 Layer PCB Black Solder Mask FR4 TG170

...each layer 4 FR4 substrate material ,halogen free material. 5 Surface treatment is immersion gold. 6 Gold thickness is 1U'. 7 Finished board thickness is 1.6mm. 8 Gerber file or PCB file should be offered by...

Witgain Technology Limited
China

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Via In Pad Treatment 8 Layer PCB Black Solder Mask FR4 TG170

...each layer 4 FR4 substrate material ,halogen free material. 5 Surface treatment is immersion gold. 6 Gold thickness is 1U'. 7 Finished board thickness is 1.6mm. 8 Gerber file or PCB file should be offered by...

Witgain Technology Limited
China

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Substrate Fr4 Material PCB Prototype Circuit Board 4 Layers 2 Years Guarantee

...,UL,ROHS,IPC Production Description specialized in single-sided PCB, double-sided PCB, multilayer PCB and PCBA. Material Type: FR4,CEM-1,non-halogen,Aluminium, high frequency, 94-V0, PI, High TG Surface trea...

Shenzhen Shinelink Technology Ltd
Guangdong,China

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FR4 TG170 PCB Board 1.6mm Soldermask White Silkscreen 150*50mm

...epoxy glass fiber cloth substrate, based on epoxy resin as binder, with electronic level glass fiber cloth as reinforcing material of substrate. Its bonding sheet and thin copper-clad r.p. panel and inner co...

Shenzhen Xinchenger Electronic Co.,Ltd
Guangdong,China

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FR4 UL 94v0 PCB Prototype Customed Electronics Board Green Color

...: FR - 4 epoxy glass fiber cloth substrate, based on epoxy resin as binder, with electronic level glass fiber cloth as reinforcing material of substrate. Its bonding sheet and thin copper-clad r.p. panel and...

Shenzhen Xinchenger Electronic Co.,Ltd
Guangdong,China

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FR4 Immersion Gold PCB Prototype Board 1.6mm Impedance Control

...: FR - 4 epoxy glass fiber cloth substrate, based on epoxy resin as binder, with electronic level glass fiber cloth as reinforcing material of substrate. Its bonding sheet and thin copper-clad r.p. panel and...

Shenzhen Xinchenger Electronic Co.,Ltd
Guangdong,China

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