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... (25um) Finished thickness:FR4/BT (0.1-0.4mm) finished thickness; Material brand:Mainly brand:SHENGYI,Mitsubishi(BT-FR4),mitsuiseiki,OhmegaPly,Ticer,AMC,Isola,AGC,Neclo,Rogers,Taconic,Others; Surface finishe...
...thickness 2u'. 3 FR4 substrate material, tg150 degree. 4 Min line space and width 4/4mil. 5 Copper thickness is 1 oz on each layer, 35 um on each layer. 6 Green solder mask and white silkscreen. 7 ROHS, MSDS...
...thickness 2u'. 3 FR4 substrate material, tg150 degree. 4 Min line space and width 4/4mil. 5 Copper thickness is 1 oz on each layer, 35 um on each layer. 6 Green solder mask and white silkscreen. 7 ROHS, MSDS...
...substrate manufacture supporting Application:IC package,Semiconductor package,UDP/USB products,Memory electronics,NAND/Flash memory,NAND Flash Memory cards, Smart Mobile devices, Notebook PC; Spec.of substra...
...epoxy glass fiber cloth substrate, based on epoxy resin as binder, with electronic level glass fiber cloth as reinforcing material of substrate. Its bonding sheet and thin copper-clad r.p. panel and inner co...
...epoxy glass fiber cloth substrate, based on epoxy resin as binder, with electronic level glass fiber cloth as reinforcing material of substrate. Its bonding sheet and thin copper-clad r.p. panel and inner co...
...epoxy glass fiber cloth substrate, based on epoxy resin as binder, with electronic level glass fiber cloth as reinforcing material of substrate. Its bonding sheet and thin copper-clad r.p. panel and inner co...
... Oil Electro-Mechanical Green Soldermask White Silkscreen Motor Control Board,FR - 4 epoxy glass fiber cloth substrate, based on epoxy resin as binder, with electronic level glass fiber cloth as reinforcing ...
... of the substrate (Copper-Clad Laminate copper clad substrate) (in KB-6160 (the most commonly used FR-4 plate), for example) Yellow and white core plate divided core material, usually ......
4 Layer FR4 Prototype PCB Boards For Equipment Production 1. 4 layer PCB. 2. FR4 substrate. 3. HASL lead free approved by RoHS. 4. Equipment production. 5. Prototype service. 1 Layer 4 layer 2 Substrate FR4 s...
Custom PCB Board FR4 4OZ Copper HDI Board 1. 8 layers hdi board. 2. FR4 substrate. 3. PTH wall 25um. 4. 4OZ heavy copper. 5. Blind/Buried via and VIP process. 1 Layer 8 2 Substrate FR4 3 PCB thickness 1.63mm ...
Custom PCB Board FR4 4OZ Copper HDI Board 1. 8 layers hdi board. 2. FR4 substrate. 3. PTH wall 25um. 4. 4OZ heavy copper. 5. Blind/Buried via and VIP process. 1 Layer 8 2 Substrate FR4 3 PCB thickness 1.63mm ...
4 Layer FR4 Prototype PCB Boards For Equipment Production 1. 4 layer PCB. 2. FR4 substrate. 3. HASL lead free approved by RoHS. 4. Equipment production. 5. Prototype service. 1 Layer 4 layer 2 Substrate FR4 s...
...Substrate Memory EMMC Substrate Production Application:Memory package,Memory packaging substrate,Dram/SSD/LPDDR package substrate,Semiconductor package; Spec.of substrate production: Mini.Line space/width:1m...
...epoxy glass fiber cloth substrate, based on epoxy resin as binder, with electronic level glass fiber cloth as reinforcing material of substrate. Its bonding sheet and thin copper-clad r.p. panel and inner co...
FR4 TG175 Heavy Copper Circuit Board 6 Layers PCB For Automobile 1. 6 layers PCB. 2. 35um thick PTH wall. 3. FR4 TG175 substrate. 4. ENIG 2u'' +4OZ copper. 5. Application for automobile electronics. 1 Layer 6...
FR4 TG175 Heavy Copper Circuit Board 6 Layers PCB For Automobile 1. 6 layers PCB. 2. 35um thick PTH wall. 3. FR4 TG175 substrate. 4. ENIG 2u'' +4OZ copper. 5. Application for automobile electronics. 1 Layer 6...
...substrate ,IC assembly substrate;Semiconductor,IC package,IC assembly,Semi packaging,IC substrate,wearable electronics,Nand/Flash memory spackage; Spec.of Substrate production: Mini.Line space/width:1mil (25...
...substrate manufacture with lower cost China Application:Memory package,Memory packaging substrate,Dram/LPDDR package substrate,Semiconductor package; Spec.of pcb production: Mini.Line space/width:1mil (25um)...
... packaging,IC substrate,wearable electronics,Nand/Flash memory spackage; Spec.of Substrate production: Mini.Line space/width:1mil (25um) Finished thickness:0.29mm; Material brand:Mainly brand:SHENGYI,Mitsubi...