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MoCu Flange Molybdenum Copper Heat Spreader For Optoelectronics Packages Description: It is a composite made from Mo and Cu. Similar to W-Cu, CTE of Mo-Cu can also be tailored by adjusting the composition. But ...
85WCu Copper Tungsten Alloy , No Void Heat Spreader For Electronic Packaging Description: Electronic packaging is to put a certain function of the integrated circuit chips (including semiconductor integrated ci...
CuMo Heatspreader Copper Moly Base Plate , Customized Size Copper Molybdenum Heat Spreader Description: Cu-Mo is suitable for rolling and pressing processes. Thermal expansion and thermal conductivity are adjus...
Nickel And Gold Plated CPC Heat Spreader Material For LDMOSs With Low CTE And High TC Description: Cu/Mo70Cu/Cu(CPC) is a sandwich composite similar to that of Cu/......
... (approximately 2000 W/m·K), far surpassing traditional materials like copper and aluminum. As a result, CVD diamond heat spreaders exhibit outstanding thermal dissipation capabilities in high-power electron...
High Performance Aluminum Thermal Adhesive Tape For Power Converter PCB Heat Spreader The TIA800ALSeries products are mostly used for bonding heat dissipation fins, microprocessors and other power consumption ...
High Performance Aluminum Thermal Adhesive Tape For Power Converter PCB Heat Spreader The TIA800ALSeries products are mostly used for bonding heat dissipation fins, microprocessors and other power consumption ...
Laser Diode Tungsten Copper Heat Spreader , Low Void WCu Heat Sink Base Plate Description: CuW heat sink material is a composite of tungsten and copper, with both tungsten low expansion characteristics, but als...
High Heat Dissipation Hermetic Packages Electronics Mo50Cu50 Heat Spreader For IC Packages Description: Mo-Cu heat sink material is a composite of molybdenum and copper, its thermal expansion coefficient and th...
...Heat Spreader For Instance IGBT Modular Description: With With reliable heat dissipation properties, our molybdenum copper heat sinks are used widely in electronic components. Our materials can be often foun...
Chip Or Substrate Heat Dissipation Mo80Cu20 Thermal Tabs As Heat Spreader For Microelectronic Packaging Description: Molybdenum copper alloy is a composite material of molybdenum and copper which has adjustable...
...material. It uses pure molybdenum as the core material, and is covered with pure copper or dispersion strengthened copper on both sides. Besides, copper molybdenum copper heat sink has adjustable coefficient...