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Chip Or Substrate Heat Dissipation Mo80Cu20 Thermal Tabs As Heat Spreader For Microelectronic Packaging Description: Molybdenum copper alloy is a composite material of molybdenum and copper which has adjustable...
...material. It uses pure molybdenum as the core material, and is covered with pure copper or dispersion strengthened copper on both sides. Besides, copper molybdenum copper heat sink has adjustable coefficient...
Thermal conductivity 7.5W Heat Spreader Transfer Insulated Silicone Thermal Conductive Pads Ziitek TIF740HP is an extremely soft gap filling material rated at a thermal conductivity of 7.5W/m-K. It is specially...
Gold Plated Tungsten Copper Heat Spreader , Microelectronic Packaging Tungsten Copper Submount Description: W-Cu heat sink material is a composite of tungsten and copper, with both tungsten low expansion charac...
...Memory Type: DDR5 DRAM/DDR4 DRAM; · DIMM Type: UDIMM; · Heat Sink: Yes; · Color: Black/White; · Capacity: 8GB/16GB/32GB; · Frequency: 4800/5600/6000/6400/6800/7200MHz; · Voltage: 1.1/1.35/1.4V; · Operating T...
CPC Heat Spreader For Hermetic Packages Electronics RF GaN HEMT Description: Cu/MoCu/Cu(CPC) is a sandwich composite like Cu/Mo/Cu including a Mo-Cu alloy core layer and two copper clad layers.The ratio of the ...
CPC141 Carrier / Heat Spreader / Flange For Hermetic Packages And Microelectronic Packages Description: CPC is a sandwich composite similar to that of Cu/Mo/Cu including a Mo70-Cu alloy core layer and two coppe...
Mo80Cu20 Mo75C25 Mo70Cu30 Mo60Cu40 Mo50Cu50 Heat Spreader For Optoelectronics And Microwave Packages Description: Molybdenum copper alloy is a composite material of molybdenum and copper which has adjustable t...
Excellent CTE High TC No Voids Of CPC Heat Spreader For Hermetic Packages Description: Cu/MoCu/Cu(CPC) is a sandwich composite like Cu/Mo/Cu including a Mo-......
TCSUNBOW DDR4 Memory Heat Sink Series H50 H40 Memory Type: DDR4/DDR5; Form Factor: UDIMM; Special Feature: Heat Sink/ Heat Dissipation; Color: Multiple colors; Voltage: 1.1V/1.2V/1.35/1.4V; Capacity: 4GB/8GB/16...
... heatsink prevents overheating during intense workloads. High-Speed Performance: DDR5 technology for increased bandwidth and module capacities. PC Memory Upgrade: Delivers next-gen capabilities for...
Anodizing Gold Aluminum Skived Fin Heat Sink With 2pcs Heat Pipe Quick Detail Raw Material Al6063/1050 Custom Service Yes, OEM/ODM Service Quality System ISO9001:2015 Processing Technology CNC Gear /Wood machin...
Hard Anodizing 25 Micron Aluminum Profile Heat Sink For Custom Request Quick Detail Raw Material AL6063-T5 Custom Service Yes, OEM/ODM Service Quality System ISO9001:2015 Processing Technology Cutting/Wood mach...